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STM32F031K4U6TR

STMicroelectronics

STM32F031K4U6TR by STMicroelectronics

STM32F031K4U6TR by STMicroelectronics is a 32-bit microcontroller with 32 MHz clock frequency, 3.3V supply voltage, and 25 I/O lines. Ideal for industrial applications, it features ADC and DMA channels, FLASH ROM programmability, and operates in temperatures ranging from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,056 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,056

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-

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Anansix

USA . 2,693 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,693

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Digiode

USA . 1,780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,780

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,124 parts In-Stock

1+ parts

$1.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2,124

$1.390

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AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$9.790

100+ parts

-

1k+ parts

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10k+ parts

-

414

$9.790

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Microchip USA

USA . 7,926 parts In-Stock

1+ parts

$10.697

100+ parts

-

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10k+ parts

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7,926

$10.697

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IDEA Electronic Components Group

UK . 1,557 parts In-Stock

1+ parts

$17.056

100+ parts

-

1k+ parts

$15.350

10k+ parts

-

1,557

$17.056

-

$15.350

-

MKK Technologies

India . 4 parts In-Stock

1+ parts

$32.072

100+ parts

-

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10k+ parts

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4

$32.072

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DigiPath Technology Company

USA . 4 parts In-Stock

1+ parts

$32.072

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$32.072

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Epart123

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.900

10k+ parts

$0.900

15,000

-

-

$0.900

$0.900

Perfect Parts

USA . 4,116 parts In-Stock

1+ parts

-

100+ parts

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4,116

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Corphita

USA . 2,864 parts In-Stock

1+ parts

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2,864

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Parana Technologies

USA . 1,389 parts In-Stock

1+ parts

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100+ parts

$20.393

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1,389

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$20.393

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Overview

Unlock the potential of your next project with the STM32F031K4U6TR microcontroller by STMicroelectronics. Built with high-quality materials and cutting-edge technology, this versatile device offers a wide range of applications in various industries. Experience the benefits of its efficient performance, low power consumption, and advanced features like ADC and DMA channels. With a maximum clock frequency of 32 MHz and flash ROM programmability, this microcontroller delivers unmatched value and reliability for your designs. Upgrade your products today with the STM32F031K4U6TR and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the microcontroller lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V allows for flexibility in power supply options, making it suitable for a variety of applications.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the PCB, especially in tight layout designs.

Bit Size: 32

The 32-bit architecture provides high processing power and performance capabilities for handling complex tasks efficiently.

No. of Terminals: 32

Having 32 terminals offers ample connectivity options for interfacing with other components and peripherals in the system.

Minimum Supply Voltage: 2 V

The low minimum supply voltage requirement of 2V ensures compatibility with a wide range of power sources, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this microcontroller can withstand harsh environmental conditions, ideal for industrial settings.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 °C to 85°C allows for reliable operation in extreme cold or hot environments.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals ensures good solderability and corrosion resistance for long-term reliability.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, expanding the range of data inputs the microcontroller can process.

DMA Channels: YES

Having DMA channels allows for efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection to the PCB, reducing the risk of signal loss or disconnection.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm helps in maintaining a compact profile, suitable for space-constrained applications.

Width: 7 mm

The compact width of 7mm allows for easy integration into small form factor designs, saving valuable board space.

Maximum Clock Frequency: 32 MHz

With a high maximum clock frequency of 32MHz, this microcontroller can handle high-speed operations and real-time processing tasks efficiently.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable solder joints during assembly processes, reducing the risk of solder defects.

Length: 7 mm

The short length of 7mm further contributes to the compact size of the microcontroller, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions typically found in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The use of RISC architecture in the microcontroller's peripheral IC type enhances processing efficiency and performance for handling complex algorithms.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption, enabling energy-efficient operation and extended battery life.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and reliable electrical connections, ensuring secure mounting on the PCB.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides a stable power source for consistent performance and reliable operation of the microcontroller.

PWM Channels: YES

The presence of PWM channels allows for precise control of output signals, essential for applications requiring accurate timing and modulation.

ROM Programmability: FLASH

The use of FLASH memory for ROM programmability offers flexibility in programming and updating firmware or applications in the microcontroller.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm facilitates close spacing of terminals on the PCB, enabling high-density designs and saving board space.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the microcontroller can withstand moderate reflow soldering conditions, ensuring reliability in manufacturing processes.

Speed: 48 rpm

The speed of 48 revolutions per minute indicates the processing capability of the microcontroller, suitable for tasks requiring high-speed data processing.

No. of I/O Lines: 25

Having 25 I/O lines provides ample connectivity options for interfacing with external devices and sensors, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers STM32F031K4U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

25

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F031K4U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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