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STM32C031K6T7TR

STMicroelectronics

STM32C031K6T7TR by STMicroelectronics

STM32C031K6T7TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M0+ CPU, 48 MHz clock frequency, and 18-Ch 12-Bit ADC channels. Ideal for applications requiring low power consumption, it features integrated cache, 12288 bytes of RAM, and connectivity options like I2C, I2S, SPI, and UART(2).

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,977 parts In-Stock

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5,977

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Anansix

USA . 2,418 parts In-Stock

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2,418

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

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500

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Digiode

USA . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 4,062 parts In-Stock

1+ parts

$7.623

100+ parts

-

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4,062

$7.623

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AZTECH Wire

Italy . 600 parts In-Stock

1+ parts

$7.846

100+ parts

-

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600

$7.846

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Ampacity Inc.

Singapore . 430 parts In-Stock

1+ parts

$8.000

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430

$8.000

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Argo Parts USA

USA . 4,011 parts In-Stock

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4,011

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Continental Prestige Electronics

USA . 1,183 parts In-Stock

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1,183

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Corphita

USA . 448 parts In-Stock

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448

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Unleash the power of innovation with the STM32C031K6T7TR microcontroller from STMicroelectronics, known for its unparalleled quality and advanced technology. This versatile device offers a wide range of applications in various industries, providing customers with exceptional value and benefits. With features such as integrated cache, low power mode, and multiple connectivity options, this microcontroller delivers high performance and efficiency. Elevate your projects to new heights with the STM32C031K6T7TR and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides good durability and protection for the microcontroller, making it suitable for various applications.

Integrated Cache: YES

Integrated cache helps in improving performance by reducing the access time to frequently used data, enhancing overall efficiency.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options, accommodating different voltage requirements.

On Chip Data RAM Width: 8

8-bit on-chip data RAM width enables efficient data storage and manipulation, enhancing processing capabilities.

Package Shape: SQUARE

Square package shape saves space and facilitates easier PCB layout, contributing to a compact and organized design.

Bit Size: 32

32-bit processing capability offers higher performance and efficiency for handling complex tasks and computations.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options and interface possibilities, making the microcontroller versatile in application.

Minimum Supply Voltage: 2 V

Low minimum supply voltage enables energy-efficient operation and extends battery life in power-constrained applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range ensures reliable performance even in harsh environmental conditions with elevated temperatures.

CPU Family: Cortex-M0+

Being part of the Cortex-M0+ CPU family implies compatibility, reliability, and performance optimization, offering a solid foundation for development projects.

Technical Specifications

Microcontrollers STM32C031K6T7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

NO

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

3

No. of I/O Lines:

30

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

RAM Bytes:

12288

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

4.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C, I2S, SPI, UART(2)

Peripherals:

BOR, DMA(3), POR, TIMER(5), WDT

Analog To Digital Convertors:

18-Ch 12-Bit

Trade Compliance

STM32C031K6T7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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