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STM32C031K6T3

STMicroelectronics

STM32C031K6T3 by STMicroelectronics

STM32C031K6T3 microcontroller from STMicroelectronics features a 32-bit Cortex-M0+ CPU, operates at a max voltage of 3.6V, and includes 18 ADC channels. With low power modes and versatile connectivity options like I2C and SPI, it's ideal for embedded applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,475 parts In-Stock

1+ parts

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2,475

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Digiode

USA . 1,959 parts In-Stock

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1k+ parts

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1,959

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Anansix

USA . 1,164 parts In-Stock

1+ parts

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1,164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,003 parts In-Stock

1+ parts

$13.390

100+ parts

-

1k+ parts

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10k+ parts

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1,003

$13.390

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Corphita

USA . 833 parts In-Stock

1+ parts

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833

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Overview

Unlock your project's potential with the STM32C031K6T3 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Boasting exceptional performance and energy efficiency, this compact solution is perfect for various applications like IoT devices, industrial automation, and consumer electronics. Its robust features ensure reliability and ease of integration, providing you with unmatched value and flexibility to elevate your innovations. Experience quality and support from an industry titan!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy contributes to a robust and lightweight design, enhancing durability and usability in various applications.

Integrated Cache: YES

Having an integrated cache improves data access speed, resulting in better overall performance for applications requiring swift data processing.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier integration into various circuit boards, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This voltage limit ensures compatibility with a wide range of power supplies while maintaining efficiency and safety.

On Chip Data RAM Width: 8

An 8-bit RAM width offers a good balance of performance and power consumption for applications requiring moderate data handling.

Package Shape: SQUARE

The square package shape is advantageous for thermal and electrical performance while simplifying PCB layout design.

Bit Size: 32

A 32-bit architecture enables more complex computations and enhances processing capabilities for demanding applications.

No. of Terminals: 32

Having 32 terminals facilitates connectivity and interfacing with a broad range of peripherals and external devices.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile design minimizes space usage, making this microcontroller ideal for compact electronic devices.

Minimum Supply Voltage: 2 V

A low minimum supply voltage enhances the microcontroller's versatility, allowing it to operate in battery-powered and energy-efficient applications.

Maximum Operating Temperature: 125 °C

This high temperature range ensures reliability in extreme environments, making it suitable for industrial and automotive applications.

CPU Family: Cortex-M0+

As part of the Cortex-M0+ family, this microcontroller provides a balance of performance and energy efficiency, targeting low-power applications.

Minimum Operating Temperature: -40 °C

The capability to function in subzero temperatures is crucial for outdoor or harsh environment applications.

ADC Channels: YES

Analog-to-digital converters (ADC) enable the microcontroller to interface with analog signals, allowing for diverse sensor applications.

DMA Channels: YES

Direct Memory Access (DMA) support boosts data transfer efficiency, allowing the CPU to focus on processing while peripherals handle data transfer.

Terminal Position: QUAD

Quad terminal positioning maximizes board space usage and enables effective mounting and soldering on PCBs.

ROM Words: 32768

Providing 32,768 ROM words allows for ample program storage, suitable for most applications while enhancing functionality.

Maximum Seated Height: 1.6 mm

A low seated height ensures compatibility with compact device designs, allowing for more design flexibility.

Width: 7 mm

A compact width makes it easier to fit into smaller electronic devices, catering to modern compact design trends.

Peripherals: BOR, DMA(3), POR, TIMER(5), WDT

With various integrated peripherals, this microcontroller is well-equipped for diverse applications, simplifying design and reducing component count.

Maximum Clock Frequency: 48 MHz

A 48 MHz clock frequency offers sufficient processing power for responsive applications without excessive power consumption.

Length: 7 mm

Having 7 mm length contributes to a small footprint, making it suitable for portable electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

This RISC architecture supports efficient processing, optimal for low power consumption applications.

No. of Timers: 5

The inclusion of five timers is beneficial for precise timing applications, allowing for greater control in automated processes.

RAM Bytes: 12288

With 12,288 bytes of RAM, this microcontroller can handle moderate data tasks and support more complex algorithms.

Technology: CMOS

CMOS technology ensures low power consumption coupled with high speed, making it an ideal choice for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide improved mechanical stability for soldering, enhancing reliability in various applications.

Analog To Digital Converters: 18-Ch 12-Bit

The ADC capability with 18 channels and 12-bit resolution enables fine-grained data collection from a variety of sensors.

Maximum Supply Current: 4.6 mA

A maximum supply current of 4.6 mA supports low-power applications, promoting longevity in battery-operated designs.

Nominal Supply Voltage: 3 V

Stable operation at a nominal voltage of 3 V ensures compatibility with common power sources and reduces power requirements.

No. of DMA Channels: 3

Three DMA channels facilitate efficient data handling, allowing multiple transfers simultaneously without CPU intervention.

No. of Serial I/Os: 2

With two serial I/Os, this microcontroller can communicate with more devices, enhancing its versatility in various applications.

PWM Channels: YES

Pulse-width modulation (PWM) capability allows control of analog devices such as motor drivers and dimmers, expanding application potential.

Connectivity: I2C, I2S, SPI, UART(2)

Multiple connectivity options like I2C and SPI provide flexibility in interfacing with different sensors and devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates to the microcontroller's firmware, enhancing scalability and adaptability.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows easy soldering and better space efficiency on PCBs, improving design adaptability.

Format: FIXED POINT

The fixed-point format supports efficient mathematical operations suitable for real-time control applications.

Speed: 48 rpm

Providing operational speed at 48 rpm allows for adequate response time in real-time applications.

Low Power Mode: YES

Low power mode functionality is essential for energy efficiency, prolonging battery life in portable devices.

On Chip Program ROM Width: 8

With an 8-bit program ROM width, this microcontroller efficiently handles storing and executing code for various applications.

No. of I/O Lines: 30

Thirty I/O lines enable extensive interfacing capabilities with external devices, promoting versatility in designs.

Technical Specifications

Microcontrollers STM32C031K6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

NO

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

3

No. of I/O Lines:

30

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

RAM Bytes:

12288

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

4.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C, I2S, SPI, UART(2)

Peripherals:

BOR, DMA(3), POR, TIMER(5), WDT

Analog To Digital Convertors:

18-Ch 12-Bit

Trade Compliance

STM32C031K6T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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