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STM32C031K4U7TR

STMicroelectronics

STM32C031K4U7TR by STMicroelectronics

STM32C031K4U7TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0+ CPU, operates at a max voltage of 3.6V, and includes 18 ADC channels. Ideal for low-power applications, it supports I2C, SPI, and UART connectivity. Its compact design suits various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,580 parts In-Stock

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8,580

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Digiode

USA . 3,452 parts In-Stock

1+ parts

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3,452

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Anansix

USA . 983 parts In-Stock

1+ parts

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983

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 955 parts In-Stock

1+ parts

$12.060

100+ parts

-

1k+ parts

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955

$12.060

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Corphita

USA . 2,315 parts In-Stock

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2,315

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Overview

Unlock the potential of your projects with the STM32C031K4U7TR microcontroller from STMicroelectronics, a leader in innovation and quality. This compact powerhouse combines efficiency and versatility, making it ideal for automotive, industrial automation, and IoT applications. With its low power consumption and robust performance, you can design cutting-edge solutions that stand out. Choose STMicroelectronics for reliability and performance that propel your ideas forward!

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache improves the processing speed by reducing the time needed to access frequently used data.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of circuit board space, enhancing the product's versatility.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications.

On Chip Data RAM Width: 8

An 8-bit RAM width provides sufficient memory access for a variety of applications while maintaining low power consumption.

Package Shape: SQUARE

The square package shape allows for efficient layout on PCBs and optimal thermal performance.

Bit Size: 32

A 32-bit architecture enables better performance and handling of complex data types and operations.

No. of Terminals: 32

Thirty-two terminals offer ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and effective heat dissipation characteristics make it suitable for compact and thermally demanding applications.

Minimum Supply Voltage: 2 V

The low minimum supply voltage allows for operation in battery-powered and low-voltage applications.

Maximum Operating Temperature: 105 °C

This high temperature rating enables the microcontroller to function reliably in harsh environments.

CPU Family: Cortex-M0+

The Cortex-M0+ family is known for energy efficiency, making it ideal for low-power applications.

Minimum Operating Temperature: -40 °C

The ability to operate at extreme low temperatures expands its applicability in various industrial and outdoor settings.

ADC Channels: YES

Built-in ADC channels enable precise analog signal processing, enhancing functionality for sensor applications.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency, reducing CPU load and enhancing performance.

Terminal Position: QUAD

The quad terminal position allows for easier integration into circuit boards and improves connectivity options.

ROM Words: 16384

This amount of ROM supports ample program storage for complex applications and firmware.

Maximum Seated Height: 0.6 mm

The low seated height is advantageous for space-constrained designs, contributing to slimmer electronic devices.

Width: 5 mm

A compact width enhances the microcontroller's versatility for various application designs.

Peripherals: BOR, DMA(3), POR, TIMER(5), WDT

Multiple integrated peripherals reduce the need for external components, simplifying design and improving reliability.

Maximum Clock Frequency: 48 MHz

A 48 MHz clock frequency provides a balance of performance and power consumption, suitable for many embedded applications.

Length: 5 mm

A short length contributes to a compact overall form factor, making it efficient for small gadgets and devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers high performance with low power consumption, suitable for a variety of applications.

No. of Timers: 5

Multiple timers allow for complex timing functions and multitasking in embedded systems.

RAM Bytes: 12288

Sufficient RAM supports effective multitasking and improves performance for demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption and high integration, ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead terminals improve solderability and reduce overall environmental impact.

Analog To Digital Converts: 18-Ch 12-Bit

With 18 channels of 12-bit precision, it is capable of handling multiple sensors with high accuracy.

Maximum Supply Current: 4.1 mA

Low supply current makes it suitable for energy-sensitive applications, prolonging battery life.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V balances power consumption with performance for various applications.

No. of DMA Channels: 3

Three DMA channels allow efficient data handling and improved throughput in applications requiring frequent data transfers.

No. of Serial I/Os: 2

Two serial I/O channels provide versatile communication options for interfacing with other devices.

PWM Channels: YES

PWM channels support a variety of control applications, including motor control and dimming.

Connectivity: I2C, I2S, SPI, UART(2)

Versatile connectivity options enable easy communication with numerous peripherals and systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing the product's longevity.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for compact design considerations, making it ideal for miniaturized electronics.

Format: FIXED POINT

Fixed-point format allows for efficient processing and greater accuracy in specific applications.

Speed: 48 rpm

A maximum speed of 48 rpm supports reliable performance in rotary applications and various motors.

Low Power Mode: YES

The low power mode feature extends battery life in portable devices, crucial for IoT applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width helps accommodate compact instruction sets for efficient code execution.

No. of I/O Lines: 30

The availability of 30 I/O lines facilitates extensive interfacing options for various peripherals and sensors.

Technical Specifications

Microcontrollers STM32C031K4U7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

NO

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

3

No. of I/O Lines:

30

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

12288

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Maximum Supply Current:

4.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Connectivity:

I2C, I2S, SPI, UART(2)

Peripherals:

BOR, DMA(3), POR, TIMER(5), WDT

Analog To Digital Convertors:

18-Ch 12-Bit

Trade Compliance

STM32C031K4U7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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