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STM32C031G6U7TR

STMicroelectronics

STM32C031G6U7TR by STMicroelectronics

STM32C031G6U7TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0+ CPU, operates at up to 48 MHz, and supports low power modes. With integrated ADC (17-ch) and DMA channels (3), it's ideal for IoT applications. Its compact design suits space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 13,072 parts In-Stock

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13,072

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Anansix

USA . 2,584 parts In-Stock

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2,584

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Digiode

USA . 1,551 parts In-Stock

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1,551

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Distributors (Availability)

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AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$20.760

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559

$20.760

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Corphita

USA . 1,463 parts In-Stock

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1,463

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Overview

Unlock innovative potential with the STM32C031G6U7TR microcontroller from STMicroelectronics. Renowned for its quality and reliability, this versatile 32-bit marvel is ideal for a wide range of applications—from smart home devices to industrial automation. Benefit from low power consumption and robust performance while enjoying seamless connectivity options. Elevate your projects with STMicroelectronics' commitment to excellence and experience unmatched value today!

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache improves the performance and efficiency of the microcontroller by reducing access time for frequently used data.

Surface Mount: YES

Surface mount technology allows for smaller and more compact PCB designs, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V provides flexibility in design and compatibility with a wide range of peripherals.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient handling of data operations, supporting a variety of applications.

Package Shape: SQUARE

The square package shape aids in uniform heat distribution and ease of mounting on PCBs.

Bit Size: 32

A 32-bit architecture enables efficient processing and the ability to handle larger data types, improving overall performance.

No. of Terminals: 28

The 28 terminals provide ample I/O options for interfacing with various sensors and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package design allows for effective heat dissipation and a slim form factor, perfect for tight spaces.

Minimum Supply Voltage: 2 V

A low minimum supply voltage of 2 V allows for battery-powered operation and low power applications.

Maximum Operating Temperature: 105 °C

The ability to operate up to 105 °C makes this microcontroller suitable for high-temperature environments.

CPU Family: Cortex-M0+

The Cortex-M0+ is energy-efficient, making this microcontroller a great choice for battery-operated devices.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller can function in extreme conditions.

ADC Channels: YES

Integrated ADC channels allow for easy analog signal processing, making it ideal for sensor applications.

DMA Channels: YES

Having DMA channels enhances performance by enabling data transfer without CPU intervention, optimizing processing time.

Terminal Position: QUAD

Quad terminal positioning facilitates better layout in PCB designs, ensuring efficient space usage.

ROM Words: 32768

A ROM capacity of 32768 words ensures adequate memory for storing application code.

Maximum Seated Height: 0.6 mm

A low seated height allows for low-profile designs, making it ideal for compact applications.

Width: 4 mm

The narrow width facilitates integration into tight spaces, making it versatile for various applications.

Peripherals: BOR, DMA(3), POR, TIMER(5), WDT

The inclusion of multiple peripherals enhances functionality, making it capable of handling complex tasks.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz allows for fast processing, suitable for real-time applications.

Length: 4 mm

The compact length further supports its integration in space-constrained designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture enables efficient instruction execution, enhancing performance.

No. of Timers: 5

Five timers support multiple timing operations, making it ideal for applications that require timing functions.

RAM Bytes: 12288

With 12288 bytes of RAM, the microcontroller can handle significantly more tasks simultaneously.

Technology: CMOS

CMOS technology ensures low power consumption, making it energy-efficient for sustainable designs.

Terminal Form: NO LEAD

No lead terminals enhance reliability and facilitate environmentally friendly manufacturing processes.

Analog To Digital Converters: 17-Ch 12-Bit

Seventeen channels of 12-bit ADC provide high precision for accurate data measurements, ideal for sensor integrations.

Maximum Supply Current: 4.1 mA

A low maximum supply current allows for extended battery life in portable applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V is optimal for many battery-operated devices, ensuring compatibility.

No. of DMA Channels: 3

Having three DMA channels increases operational efficiency by allowing multiple data transfers simultaneously.

No. of Serial I/Os: 2

Two serial I/O lines provide flexible communication options with other devices, enhancing interoperability.

PWM Channels: YES

PWM capability enables precise control of motors and lights, making it suitable for various applications.

Connectivity: I2C, I2S, SPI, UART(2)

Versatile connectivity options allow easy integration with a variety of sensors and communication networks.

ROM Programmability: FLASH

The use of FLASH ROM for programmability allows for easy updates and modifications of the application firmware.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables high-density designs, maximizing the number of connections while minimizing space.

Format: FIXED POINT

The fixed-point format is efficient for mathematical operations, particularly in control applications.

Speed: 48 RPM

A stable speed of 48 RPM is suitable for applications requiring consistent rotational speed in motors.

Low Power Mode: YES

The low power mode enhances energy efficiency, making it ideal for battery-operated and low-power applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports simple and efficient instruction execution.

No. of I/O Lines: 26

Having 26 I/O lines allows for increased flexibility in connecting various peripherals and sensors.

Technical Specifications

Microcontrollers STM32C031G6U7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

NO

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

3

No. of I/O Lines:

26

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

12288

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Maximum Supply Current:

4.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Connectivity:

I2C, I2S, SPI, UART(2)

Peripherals:

BOR, DMA(3), POR, TIMER(5), WDT

Analog To Digital Convertors:

17-Ch 12-Bit

Trade Compliance

STM32C031G6U7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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