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STM1404CTOCQ6F

STMicroelectronics

STM1404CTOCQ6F by STMicroelectronics

STM1404CTOCQ6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3V, supporting 2.5/3.3V supplies. It operates in extreme temps from -40 °C to 85 °C and features a very thin profile design for efficient thermal management. Ideal for industrial applications, it ensures reliable performance in space-constrained environments.

Median Price

$3.162

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 247 parts In-Stock

1+ parts

-

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-

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10k+ parts

$3.162

247

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$3.162

Distributors (In-Stock)

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Vyrian

USA . 7,411 parts In-Stock

1+ parts

-

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7,411

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Digiode

USA . 2,692 parts In-Stock

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2,692

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Anansix

USA . 2,184 parts In-Stock

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2,184

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 176 parts In-Stock

1+ parts

$2.690

100+ parts

-

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176

$2.690

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IDEA Electronic Components Group

UK . 1,477 parts In-Stock

1+ parts

$8.523

100+ parts

-

1k+ parts

$7.671

10k+ parts

-

1,477

$8.523

-

$7.671

-

MKK Technologies

India . 1,385 parts In-Stock

1+ parts

$16.027

100+ parts

-

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1,385

$16.027

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DigiPath Technology Company

USA . 1,385 parts In-Stock

1+ parts

$16.027

100+ parts

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1,385

$16.027

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Microchip USA

USA . 455 parts In-Stock

1+ parts

$16.360

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455

$16.360

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 1,202 parts In-Stock

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$10.190

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1,202

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$10.190

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Corphita

USA . 1,154 parts In-Stock

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1,154

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Perfect Parts

USA . 277 parts In-Stock

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277

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Overview

Unlock the potential of your designs with the STM1404CTOCQ6F from STMicroelectronics—a trusted leader in innovative power management solutions. This high-performance IC combines exceptional efficiency and reliability, making it ideal for a range of applications from industrial controls to consumer electronics. With its compact, heat-dissipating design and wide operating temperature range, it ensures optimal performance in demanding environments, delivering unmatched value and peace of mind for your projects.

Feature Benefit Bullets

Surface Mount: YES

This surface mount technology allows for smaller PCB footprints and supports high-density designs, making it suitable for modern electronics.

Package Shape: SQUARE

The square package shape provides a balanced design, enhancing thermal performance and facilitating efficient layout on PCBs.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3V is common in many digital applications, ensuring compatibility with a wide range of devices.

Power Supplies (V): 2.5/3.3

Supports both 2.5V and 3.3V power supplies, offering flexibility for various applications and compatibility with different systems.

No. of Terminals: 16

With 16 terminals, this IC provides ample connection points for features, enhancing its versatility in complex circuits.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile design helps in saving space, while the heat sink/slug improves thermal management, essential for power management applications.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in higher temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for demanding environments such as automotive and aerospace.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and reduces the likelihood of tin whisker growth, improving long-term reliability.

Terminal Position: QUAD

Quad terminal positioning facilitates simpler placement on PCBs and supports better routing of traces.

Maximum Seated Height: 1 mm

A maximum height of 1 mm helps maintain a low profile in designs, conducive for portable and compact applications.

Width: 3 mm

A width of just 3 mm enables this IC to fit in tight spaces, allowing more design flexibility in compact devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply management, it helps ensure stable operation across various power conditions.

Minimum Supply Voltage (Vsup): 2.2 V

This low minimum supply voltage expands usability in battery-powered applications, where power conservation is critical.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds allows for efficient soldering without damaging the IC, ensuring reliable assembly.

Peak Reflow Temperature (°C): 260

The high peak reflow temperature tolerance enables compatibility with modern lead-free soldering processes.

Length: 3 mm

Maintaining a length of 3 mm alongside width helps achieve balanced dimensions for compact integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures dependable performance in rigorous conditions, suitable for long-lasting applications.

Maximum Supply Current (Isup): 0.065 mA

Low maximum supply current indicates energy efficiency, essential for low-power applications.

Terminal Form: NO LEAD

No-lead terminals help reduce PCB space usage while providing excellent thermal and electrical performance.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for high-density layouts, maximizing the use of available space on PCBs.

Maximum Supply Voltage (Vsup): 3.6 V

The ability to handle up to 3.6V makes it versatile enough for a range of applications without risk of damage.

Technical Specifications

Power Management ICs STM1404CTOCQ6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.065 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STM1404CTOCQ6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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