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STM1404CTMJQ6F

STMicroelectronics

STM1404CTMJQ6F by STMicroelectronics

STM1404CTMJQ6F by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 2.2V to 3.6V and features a max temp of 85 °C. Its surface mount design and very thin profile make it ideal for space-constrained environments.

Median Price

$3.162

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 225 parts In-Stock

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$3.162

225

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$3.162

Distributors (In-Stock)

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Vyrian

USA . 8,927 parts In-Stock

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Digiode

USA . 3,853 parts In-Stock

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3,853

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Anansix

USA . 567 parts In-Stock

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567

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IDEA Electronic Components Group

UK . 1,963 parts In-Stock

1+ parts

$7.246

100+ parts

-

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$6.521

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1,963

$7.246

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$6.521

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MKK Technologies

India . 1,252 parts In-Stock

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$13.625

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$13.625

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DigiPath Technology Company

USA . 1,252 parts In-Stock

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$13.625

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1,252

$13.625

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Component Stockers USA

USA . 562 parts In-Stock

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$99.990

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562

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,793 parts In-Stock

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13,793

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Microchip USA

USA . 3,547 parts In-Stock

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Corphita

USA . 1,755 parts In-Stock

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1,755

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Parana Technologies

USA . 1,699 parts In-Stock

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$8.664

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1,699

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$8.664

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Perfect Parts

USA . 252 parts In-Stock

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Overview

Power your projects with the STM1404CTMJQ6F from STMicroelectronics—a leader in innovative technology. This highly efficient Power Management IC enhances performance while ensuring reliability across a wide temperature range, making it ideal for industrial applications. With its ultra-compact design and low power consumption, it offers exceptional value that translates into longer battery life and reduced heat generation, empowering your designs with quality you can trust.

Feature Benefit Bullets

Surface Mount: YES

This surface mount capability allows for space-efficient designs and easier integration into compact electronic systems.

Package Shape: SQUARE

The square package shape facilitates better thermal performance and more efficient use of PCB space.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3 V is commonly used, making it compatible with a wide range of applications.

Power Supplies (V): 2.5/3.3

Supports multiple power supply voltages, offering flexibility in various applications.

No. of Terminals: 16

Having 16 terminals provides additional functionality and options for input/output configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This design enables efficient heat dissipation and makes the IC suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

Operating up to 85ºC ensures reliability in moderately high-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40ºC, this IC is well-suited for harsh environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and improves the reliability of the IC on the PCB.

Terminal Position: QUAD

Quad terminal positioning allows for effective layout and connections on circuit boards, making design easier.

Maximum Seated Height: 1 mm

A maximum seated height of only 1 mm contributes to low-profile applications, essential for modern compact designs.

Width: 3 mm

The compact width allows for tighter PCB layouts and less space consumption in device design.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC is specifically designed for power supply support, ensuring stability in powering other circuits.

Minimum Supply Voltage (Vsup): 2.2 V

A low minimum supply voltage enhances versatility and supports a broad range of applications.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds ensures compatibility with various soldering processes.

Peak Reflow Temperature °C: 260

Supports high peak reflow temperature, crucial for modern surface mount technology soldering.

Length: 3 mm

The compact length of 3 mm is ideal for minimizing space usage in dense electronic assemblies.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in demanding environments.

Maximum Supply Current (Isup): 0.065 mA

Low supply current helps in conserving energy, making it eco-friendly and efficient.

Terminal Form: NO LEAD

No lead design enhances environmental compatibility and allows for smaller footprint on PCB.

Terminal Pitch: 0.5 mm

A small terminal pitch enhances the IC's ability to pack more I/O in limited space.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6 V, this IC remains versatile for higher power applications.

Technical Specifications

Power Management ICs STM1404CTMJQ6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.065 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STM1404CTMJQ6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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