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STM1404CSMJQ6F

STMicroelectronics

STM1404CSMJQ6F by STMicroelectronics

STM1404CSMJQ6F by STMicroelectronics is a power management IC designed for industrial applications, operating b/w -40 °C to 85 °C. It supports supply voltages of 2.2V to 3.6V and features a compact 16-terminal design with a very thin profile. Ideal for efficient power supply support in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,052 parts In-Stock

1+ parts

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8,052

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Digiode

USA . 3,600 parts In-Stock

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3,600

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Anansix

USA . 1,914 parts In-Stock

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1,914

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,204 parts In-Stock

1+ parts

$2.500

100+ parts

-

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1,204

$2.500

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AZTECH Wire

Italy . 489 parts In-Stock

1+ parts

$16.090

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-

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489

$16.090

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IDEA Electronic Components Group

UK . 1,890 parts In-Stock

1+ parts

$22.771

100+ parts

-

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$20.494

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-

1,890

$22.771

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$20.494

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MKK Technologies

India . 748 parts In-Stock

1+ parts

$42.819

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748

$42.819

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DigiPath Technology Company

USA . 748 parts In-Stock

1+ parts

$42.819

100+ parts

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748

$42.819

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Component Stockers USA

USA . 337 parts In-Stock

1+ parts

$99.990

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337

$99.990

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Microchip USA

USA . 4,843 parts In-Stock

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4,843

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Perfect Parts

USA . 2,507 parts In-Stock

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2,507

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Corphita

USA . 1,525 parts In-Stock

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1,525

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Parana Technologies

USA . 312 parts In-Stock

1+ parts

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$27.226

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312

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$27.226

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Overview

Unlock the potential of your designs with the STM1404CSMJQ6F from STMicroelectronics, a powerhouse in power management ICs. Renowned for their commitment to quality and innovation, STMicroelectronics delivers reliability in every chip, ensuring optimal performance across diverse applications. This ultra-thin profile IC is perfect for industrial environments, offering exceptional efficiency and thermal management. Elevate your projects with the trusted advantage of STMicroelectronics and experience unmatched value today!

Feature Benefit Bullets

Surface Mount: YES

This surface mount capability allows for easier integration into compact designs and enhances board space efficiency.

Package Shape: SQUARE

The square package shape offers uniformity in layout designs, facilitating better thermal performance and easier alignment.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal voltage of 3 V ensures compatibility with a wide range of digital and analog circuits.

Power Supplies (V): 2.5/3.3

Supports multiple supply voltages (2.5 V and 3.3 V), making it versatile for different applications.

No. of Terminals: 16

With 16 terminals, this IC provides sufficient connectivity options for various functionalities and redundancies.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile aids in compact designs, while the heat sink/slug offers enhanced thermal management.

Maximum Operating Temperature: 85 °C

Rated for high operating temperatures, making it suitable for industrial applications that may expose components to heat.

Minimum Operating Temperature: -40 °C

Low temperature operation (-40 °C) guarantees reliability in extreme environments, ideal for industrial and automotive applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish enhances solderability, improving reliability during the assembly process.

Terminal Position: QUAD

Quad terminal position allows for balanced layout design, improving stability and performance.

Maximum Seated Height: 1 mm

A low seated height allows for more flexibility in design, suitable for slim or constrained spaces.

Width: 3 mm

Compact width supports space-saving designs, making it a suitable choice for PCB layouts with tight constraints.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply applications, ensuring optimal performance and functionality in managing power.

Minimum Supply Voltage (Vsup): 2.2 V

A low minimum supply voltage provides flexibility for low-power applications, enhancing its applicability.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum of 30 seconds at peak reflow temperature allows compatibility with various soldering processes.

Peak Reflow Temperature (°C): 260

Supports a high peak reflow temperature, ensuring robustness during PCB assembly, reducing the risk of damage.

Length: 3 mm

With a compact length, this IC is ideal for space-constrained applications, facilitating versatile layout options.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates suitability for harsh conditions, ensuring reliability in demanding environments.

Maximum Supply Current (Isup): 0.065 mA

Low maximum supply current enhances energy efficiency, making it ideal for battery-powered devices.

Terminal Form: NO LEAD

No lead design reduces footprint area on PCBs and enhances performance by minimizing inductance.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for higher density placement on PCBs, suitable for modern compact designs.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V accommodates a wide range of applications while maintaining operational safety.

Technical Specifications

Power Management ICs STM1404CSMJQ6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.065 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STM1404CSMJQ6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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