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STM1404ASMJQ6F

STMicroelectronics

STM1404ASMJQ6F by STMicroelectronics

STM1404ASMJQ6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3V, supporting 2.5/3.3V power supplies. It operates in extreme temperatures from -40 °C to 85 °C and features a very thin profile design. Ideal for industrial applications, it ensures efficient power support in space-constrained environments.

Median Price

$3.360

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.360

250

-

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-

$3.360

Distributors (In-Stock)

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Vyrian

USA . 6,726 parts In-Stock

1+ parts

-

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-

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6,726

-

-

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Digiode

USA . 2,413 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,413

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-

-

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Anansix

USA . 2,368 parts In-Stock

1+ parts

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10k+ parts

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2,368

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 131 parts In-Stock

1+ parts

$8.593

100+ parts

-

1k+ parts

-

10k+ parts

-

131

$8.593

-

-

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IDEA Electronic Components Group

UK . 1,357 parts In-Stock

1+ parts

$9.639

100+ parts

-

1k+ parts

$8.675

10k+ parts

-

1,357

$9.639

-

$8.675

-

MKK Technologies

India . 1,566 parts In-Stock

1+ parts

$18.125

100+ parts

-

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1,566

$18.125

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DigiPath Technology Company

USA . 1,566 parts In-Stock

1+ parts

$18.125

100+ parts

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10k+ parts

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1,566

$18.125

-

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Parana Technologies

USA . 1,522 parts In-Stock

1+ parts

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100+ parts

$11.525

1k+ parts

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1,522

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$11.525

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Corphita

USA . 1,211 parts In-Stock

1+ parts

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1,211

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Perfect Parts

USA . 280 parts In-Stock

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280

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Overview

Elevate your power management solutions with the STM1404ASMJQ6F from STMicroelectronics, a trusted leader in innovation and quality. Designed for reliability across various industrial applications, this advanced IC ensures optimal performance in demanding environments. With its compact design and exceptional thermal management, it delivers efficient power supply support while minimizing energy loss. Experience enhanced system stability and efficiency, empowering your projects to reach new heights!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration onto PCBs, optimizing space and enhancing manufacturability.

Package Shape: SQUARE

A square package shape can improve thermal performance and layout flexibility on printed circuit boards.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3V is widely used in various applications, making it versatile for many devices.

Power Supplies (V): 2.5/3.3

Compatibility with both 2.5V and 3.3V power supplies makes it suitable for a variety of modern electronic applications.

No. of Terminals: 16

Having 16 terminals enables a wide range of functionalities, providing complexity and control suited for power management.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures optimal heat dissipation and a compact design, crucial for high-performance electronics.

Maximum Operating Temperature: 85 °C

Operational capability up to 85 °C ensures reliability in applications with varying thermal conditions.

Minimum Operating Temperature: -40 °C

A -40 °C minimum operating temperature allows usage in extreme environments, enhancing the product’s applicability.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent solderability and corrosion resistance, ensuring longevity and reliability.

Terminal Position: QUAD

The quad terminal position enhances device performance and minimizes space on the PCB, allowing for a more compact design.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm supports slim and compact application designs, perfect for space-constrained environments.

Width: 3 mm

A width of 3mm allows for high-density layouts and is ideal for portable devices requiring space-efficient components.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply management, ensuring optimized power efficiency and system stability.

Minimum Supply Voltage (Vsup): 2.2 V

The minimum supply voltage of 2.2V supports lower-voltage applications, making it suitable for energy-efficient designs.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes, increasing production efficiency.

Peak Reflow Temperature: 260 °C

Handling a peak reflow temperature of 260 °C allows it to withstand harsh soldering conditions common in modern manufacturing.

Length: 3 mm

With a length of 3mm, it offers a compact form factor while maintaining high performance and functionality.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this IC can reliably operate in demanding environments and applications.

Maximum Supply Current (Isup): 0.065 mA

Low maximum supply current of 0.065mA enhances energy efficiency, making it ideal for battery-powered and low-power applications.

Terminal Form: NO LEAD

No lead design minimizes footprint and helps in meeting environmental standards, reflecting modern design practices.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch supports fine-pitch applications, enabling more compact designs without sacrificing performance.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6V allows for compatibility with a broad range of power sources.

Technical Specifications

Power Management ICs STM1404ASMJQ6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.065 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STM1404ASMJQ6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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