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STH4N80FI

STMicroelectronics

STH4N80FI by STMicroelectronics

STH4N80FI by STMicroelectronics is a N-CHANNEL FET with 800V DS Breakdown Voltage, ideal for SWITCHING applications. It features 16A Max Pulsed Drain Current and 230mJ Avalanche Energy Rating. The transistor operates in ENHANCEMENT MODE with a max power dissipation of 55W at 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,840 parts In-Stock

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3,840

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Vyrian

USA . 1,314 parts In-Stock

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1,314

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Anansix

USA . 765 parts In-Stock

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765

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 578 parts In-Stock

1+ parts

$1.001

100+ parts

-

1k+ parts

$0.901

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578

$1.001

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$0.901

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MKK Technologies

India . 1,930 parts In-Stock

1+ parts

$1.882

100+ parts

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1,930

$1.882

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DigiPath Technology Company

USA . 1,930 parts In-Stock

1+ parts

$1.882

100+ parts

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1,930

$1.882

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Corphita

USA . 2,584 parts In-Stock

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2,584

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Parana Technologies

USA . 1,952 parts In-Stock

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$1.197

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1,952

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$1.197

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Overview

Unleash the power of innovation with the STH4N80FI by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors that are perfect for various switching applications. With a single configuration and built-in diode, this N-Channel transistor offers reliability and efficiency like no other. Experience the benefits of enhanced performance and maximum power dissipation of 55W, all while ensuring durability and stability. Trust STMicroelectronics to provide cutting-edge technology that meets your needs and exceeds your expectations. Step into the future of electronics with STH4N80FI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower ON-resistance and higher efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse current protection, enhancing the reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and high efficiency for optimal performance.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this FET can handle high voltages safely, making it suitable for high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into electronic circuits.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer secure connections and easy soldering onto circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement-mode FETs require a gate voltage to turn on, providing control over the switching behavior of the transistor.

Maximum Pulsed Drain Current (IDM): 16 A

The high pulsed drain current rating allows for reliable performance in applications with occasional high current spikes.

Avalanche Energy Rating (EAS): 230 mJ

The high avalanche energy rating indicates the FET's ability to withstand energy spikes without breakdown, ensuring long-term reliability.

Maximum Power Dissipation (Abs): 55 W

With a high power dissipation rating, this FET can handle high power levels without overheating, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical stability and easy mounting in industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low ON-resistance and fast switching speeds, making this FET efficient and reliable for switching applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures without degradation in performance.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance, reliability, and compatibility with common semiconductor materials in electronic circuits.

Maximum Turn On Time (ton): 290 ns

The fast turn-on time of 290 ns ensures rapid response in switching applications, improving overall system efficiency.

Maximum Drain-Source On Resistance: 3 ohm

The low ON-resistance of 3 ohms minimizes power loss and improves efficiency during operation.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and ensures easy integration into electronic systems.

Case Connection: ISOLATED

The isolated case connection enhances safety and reliability by preventing electrical interference and short circuits.

Maximum Feedback Capacitance (Crss): 55 pF

The low feedback capacitance of 55 pF minimizes signal distortion and improves high-frequency performance in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STH4N80FI attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

2.8 A

Maximum Drain Current (ID):

2.8 A

Maximum Drain-Source On Resistance:

3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

55 pF

JEDEC-95 Code:

TO-218

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

55 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

16 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn On Time (ton):

290 ns

Trade Compliance

STH4N80FI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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