Loading...

STGAP2HDM

STMicroelectronics

STGAP2HDM by STMicroelectronics

STGAP2HDM by STMicroelectronics is a MOSFET gate driver with 2 functions. It has a max supply voltage of 5.5V and can operate in temperatures ranging from -40 to 125°C. It is commonly used as an interface IC for buffer or inverter based MOSFET drivers.

Median Price

$2.530

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$2.530

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$2.530

-

-

-

Vyrian

USA . 6,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,545

-

-

-

-

Anansix

USA . 2,848 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,848

-

-

-

-

Digiode

USA . 2,726 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,726

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 692 parts In-Stock

1+ parts

$2.995

100+ parts

-

1k+ parts

$2.695

10k+ parts

-

692

$2.995

-

$2.695

-

MKK Technologies

India . 1,525 parts In-Stock

1+ parts

$5.631

100+ parts

-

1k+ parts

-

10k+ parts

-

1,525

$5.631

-

-

-

DigiPath Technology Company

USA . 1,525 parts In-Stock

1+ parts

$5.631

100+ parts

-

1k+ parts

-

10k+ parts

-

1,525

$5.631

-

-

-

AZTECH Wire

Italy . 230 parts In-Stock

1+ parts

$14.522

100+ parts

-

1k+ parts

-

10k+ parts

-

230

$14.522

-

-

-

Ampacity Inc.

Singapore . 600 parts In-Stock

1+ parts

$23.500

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$23.500

-

-

-

Corphita

USA . 2,915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,915

-

-

-

-

Bastille Electronics

Australia . 870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

870

-

-

-

-

Parana Technologies

USA . 518 parts In-Stock

1+ parts

-

100+ parts

$3.580

1k+ parts

-

10k+ parts

-

518

-

$3.580

-

-

Overview

Discover the STGAP2HDM, a cutting-edge MOSFET gate driver by STMicroelectronics. With its high-quality manufacturing and superior performance, this driver is a game-changer in its category. Designed with customer needs in mind, it offers remarkable value, benefits, and advantages. From its compact size to its wide operating temperature range, the STGAP2HDM is perfect for a variety of applications. Experience enhanced efficiency, reliability, and precision with this exceptional product. Upgrade your projects with the STGAP2HDM and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and install.

Surface Mount: YES

Allows for easy and compact mounting on PCBs, saving space and making for a clean and organized layout.

Maximum Supply Voltage: 5.5 V

Provides a wide operating range and flexibility for different voltage requirements in various applications.

No. of Functions: 2

Having multiple functions within a single device can simplify circuit designs and reduce the need for additional components.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB and easy integration into existing designs.

Maximum Supply Voltage-1: 26 V

With a high maximum supply voltage, this product can handle high-power applications without risk of damage.

No. of Terminals: 32

Having a high number of terminals allows for a more versatile and customizable connection options in a circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design further contribute to space-saving on the PCB.

Minimum Supply Voltage: 3.1 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and applications.

Maximum Operating Temperature: 125 °C

This high operating temperature range allows the product to perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the product can function in extreme cold conditions without any issues.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit layout and connection options.

Maximum Seated Height: 2.65 mm

The low seated height contributes to the compactness and slim profile of the overall product.

Width: 7.5 mm

The narrow width allows for a space-efficient placement on the PCB.

High Side Driver: YES

Having a high side driver feature enables the product to control power switches on the high side of the circuit, expanding its application range.

Length: 15.4 mm

The moderate length provides a good balance between compactness and ease of handling during installation.

Terminal Form: GULL WING

The gull wing terminal form offers reliable solder connections and ease of assembly onto the PCB.

Nominal Supply Voltage: 5 V

The nominal supply voltage ensures compatibility with standard power sources and facilitates easy integration into existing systems.

Turn-on Time: 0.09 us

The fast turn-on time enables quick response and high switching speeds in the circuit.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for compact and efficient placement of terminals on the PCB.

Nominal Supply Voltage-1: 15 V

Having a nominal supply voltage of 15V allows for compatibility with a wide range of power sources in various applications.

Nominal Output Peak Current Limit: 4 A

The high output peak current limit ensures the product can handle demanding loads and operate reliably under high current conditions.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter based interface IC type offers flexibility and compatibility with different types of MOSFETs in a circuit.

Turn-off Time: 0.09 us

The fast turn-off time complements the quick turn-on time, allowing for precise control and fast switching speeds in the circuit.

Technical Specifications

MOSFET Gate Drivers STGAP2HDM attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G32

Length:

15.4 mm

No. of Functions:

2

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP32/36,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.1 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

26 V

Nominal Supply Voltage-1:

15 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Turn-off Time:

.09 us

Turn-on Time:

.09 us

Width:

7.5 mm

Trade Compliance

STGAP2HDM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20