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STG719FTR

STMicroelectronics

STG719FTR by STMicroelectronics

STG719FTR by STMicroelectronics is a compact SPDT switch with a max supply voltage of 6V and low on-state resistance of 7Ω. It operates in industrial environments, supporting -40 °C to 85°C. Ideal for multiplexing applications, it features fast switching times of 24ns and 7ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,789 parts In-Stock

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3,789

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Digiode

USA . 3,298 parts In-Stock

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3,298

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Anansix

USA . 2,538 parts In-Stock

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2,538

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 845 parts In-Stock

1+ parts

$11.522

100+ parts

-

1k+ parts

$10.370

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845

$11.522

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$10.370

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MKK Technologies

India . 1,198 parts In-Stock

1+ parts

$21.667

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1,198

$21.667

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DigiPath Technology Company

USA . 1,198 parts In-Stock

1+ parts

$21.667

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1,198

$21.667

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Corphita

USA . 3,833 parts In-Stock

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3,833

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Parana Technologies

USA . 288 parts In-Stock

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$13.776

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288

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$13.776

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Overview

Elevate your designs with the STG719FTR from STMicroelectronics, a trusted leader in innovation. This versatile multiplexer combines reliability and performance, ensuring seamless operation in demanding environments with temperatures ranging from -40 °C to 85°C. Its compact, low-profile design is perfect for space-constrained applications, while its impressive switching speed enhances efficiency. Experience unmatched quality and support, making the STG719FTR your go-to choice for cutting-edge electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact PCB designs, promoting efficient use of space.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout and provides a stable footprint for mounting on PCBs.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3 V is ideal for modern low-voltage digital circuits, improving energy efficiency.

Power Supplies (V): 2/5

Support for multiple supply voltages (2V to 5V) enhances versatility, enabling usage in a wider range of applications.

No. of Terminals: 6

With 6 terminals, the device can offer flexible routing options for signals, enhancing its application in complex designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile package style minimizes space usage, making it ideal for applications where height restrictions are critical.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C ensures reliability in industrial environments where temperature variations are common.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows for use in extreme environments, increasing application range.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides excellent solderability and reliability in electrical connections.

Terminal Position: DUAL

Dual terminal position allows for improved layout flexibility, facilitating varied PCB designs.

Maximum Seated Height: 1.45 mm

A low seated height enables the component to fit into compact spaces, making it suitable for miniaturized applications.

Width: 1.625 mm

A narrow width allows for denser packing of components on a PCB, optimizing space utilization.

Other IC type: SPDT

As a Single Pole Double Throw (SPDT) switch, it provides versatile signal routing capabilities suitable for various applications.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage enhances compatibility with battery-operated and low-power devices.

Maximum On-state Resistance (Ron): 7 ohm

A maximum on-state resistance of 7 ohms ensures minimal signal loss, improving performance in switching applications.

Maximum Switch-on Time: 24 ns

Fast switch-on time of 24 ns enables high-speed data transmission, making it suitable for high-frequency applications.

Length: 2.9 mm

Compact length contributes to its suitability for space-constrained designs without sacrificing performance.

Maximum Switch-off Time: 7 ns

A quick switch-off time of 7 ns enhances overall system efficiency in high-speed applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures robust performance in harsh environments, making it ideal for industrial applications.

Technology: CMOS

CMOS technology benefits from low power consumption and high noise immunity, enhancing the product's reliability.

Terminal Form: GULL WING

Gull wing terminals facilitate automated soldering processes, ensuring reliable production methods.

Terminal Pitch: 0.95 mm

A 0.95 mm terminal pitch is ideal for modern PCB designs, allowing effective routing while maintaining compactness.

Maximum Supply Voltage (Vsup): 6 V

The ability to operate at a maximum supply voltage of 6V provides flexibility for various application requirements.

Nominal Off-state Isolation: 87 dB

High off-state isolation minimizes cross-talk and interference between signals, improving overall system performance.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature prevents short circuits during switching operations, enhancing safety.

Nominal On-state Resistance Match: 0.1 ohm

A low nominal on-state resistance match of 0.1 ohm ensures consistent performance across multiple switches in a system.

Technical Specifications

Multiplexers & Switches STG719FTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

87 dB

Nominal On-state Resistance Match:

.1 ohm

Maximum On-state Resistance (Ron):

7 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

7 ns

Maximum Switch-on Time:

24 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.625 mm

Trade Compliance

STG719FTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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