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STCF05TBR

STMicroelectronics

STCF05TBR by STMicroelectronics

STCF05TBR from STMicroelectronics is a compact LED display driver with a max supply voltage of 5.5V and operates in extreme temps (-40 °C to 85 °C). It features a serial data input mode and comes in a thin profile grid array package. Ideal for industrial graphics applications, it ensures reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,859 parts In-Stock

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4,859

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Vyrian

USA . 3,347 parts In-Stock

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3,347

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Anansix

USA . 2,186 parts In-Stock

1+ parts

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2,186

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A&K Electronics

USA . 250 parts In-Stock

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250

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Rotakorn

Sweden . 250 parts In-Stock

1+ parts

-

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250

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Bristol Electronics

USA . 250 parts In-Stock

1+ parts

-

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 163 parts In-Stock

1+ parts

$8.500

100+ parts

-

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-

163

$8.500

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IDEA Electronic Components Group

UK . 1,219 parts In-Stock

1+ parts

$10.772

100+ parts

-

1k+ parts

$9.695

10k+ parts

-

1,219

$10.772

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$9.695

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AZTECH Wire

Italy . 527 parts In-Stock

1+ parts

$18.920

100+ parts

-

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527

$18.920

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MKK Technologies

India . 2,282 parts In-Stock

1+ parts

$20.257

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2,282

$20.257

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DigiPath Technology Company

USA . 2,282 parts In-Stock

1+ parts

$20.257

100+ parts

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2,282

$20.257

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QUARKTWIN TECHNOLOGY LTD

USA . 29,223 parts In-Stock

1+ parts

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29,223

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Microchip USA

USA . 4,231 parts In-Stock

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4,231

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Corphita

USA . 2,209 parts In-Stock

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2,209

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Vigor

Singapore . 1,142 parts In-Stock

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1,142

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Parana Technologies

USA . 1,037 parts In-Stock

1+ parts

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100+ parts

$12.880

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1,037

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$12.880

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Overview

Elevate your display solutions with the STCF05TBR from STMicroelectronics, a premier choice in graphics display drivers. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a product that ensures reliability and performance in diverse applications, from industrial controls to consumer electronics. Enjoy seamless integration, low power consumption, and robust temperature resilience, empowering you to create stunning visual experiences without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials provides durability and resistance to environmental factors, ensuring long-lasting performance.

Data Input Mode: SERIAL

The serial data input mode simplifies communication with microcontrollers and reduces wiring complexity, making it easier to integrate into various applications.

Surface Mount: YES

Being a surface mount device allows for a smaller footprint on PCBs, maximizing space efficiency and enabling high-density circuit designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V offers flexibility in power supply design while ensuring compatibility with a wide range of systems.

Package Shape: SQUARE

The square shape of the package allows for easy design integration and layout on the PCB, enhancing the overall compactness of the assembly.

Power Supplies (V): 3.6

With a nominal supply voltage of 3.6V, the product is optimized for energy-efficient operation, reducing overall power consumption.

No. of Terminals: 25

Having 25 terminals provides sufficient connectivity options for complex designs while ensuring reliable signal integrity.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch design help in achieving higher performance in compact spaces and enable advanced manufacturing processes.

Minimum Supply Voltage: 2.5 V

A minimum supply voltage of 2.5V allows for versatility in low-power applications, making it suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

The capability to operate up to 85 °C ensures reliability in various industrial applications where thermal management can be a challenge.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes this product ideal for harsh environments, ensuring consistent performance under extreme conditions.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish enhances solderability and improves corrosion resistance, providing better electrical connectivity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and enhances the mechanical stability of the component on the PCB.

Maximum Seated Height: 1.16 mm

A low seated height contributes to a slim design profile, reducing the overall height of the assembly while maintaining performance.

Width: 3 mm

With a compact width of 3 mm, this driver is well-suited for space-constrained applications, enabling sleek product designs.

Maximum Time At Peak Reflow Temperature: 30 s

Limiting the peak reflow time to 30 seconds helps prevent thermal damage during assembly, ensuring reliability of the components.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C is suitable for lead-free soldering processes, aligning with modern environmental standards.

Length: 3 mm

A short length of 3 mm contributes to the compact design, making it adaptable for a variety of applications without increasing size.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees robust performance in a wide range of environmental conditions, suitable for demanding applications.

Terminal Form: BALL

Ball terminal form ensures efficient electrical connection and is compatible with advanced PCB mounting techniques.

Nominal Supply Voltage: 3.6 V

Operating at a nominal supply voltage of 3.6V optimizes device performance and maintains stability in various electronic systems.

No. of Segments: 2

Having two segments allows for versatile display options, enhancing user interfaces in applications like consumer electronics.

Terminal Pitch: 0.5 mm

With a 0.5 mm terminal pitch, this driver is optimized for high-density configurations, improving overall PCB layout efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate susceptibility to moisture, simplifying handling and storage while ensuring reliability in end-use applications.

Interface IC Type: LED DISPLAY DRIVER

Designed specifically for LED displays, this driver excels in providing clear visual output, making it ideal for various display applications.

Technical Specifications

Graphics Display Drivers STCF05TBR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

2

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

STCF05TBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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