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STBB1-18PUR

STMicroelectronics

STBB1-18PUR by STMicroelectronics

STBB1-18PUR by STMicroelectronics is a compact DC-DC regulated power supply module designed for surface mount applications. It features a max output current of 1 A, operates at a peak reflow temp of 260 °C, and supports switching frequencies up to 2 MHz. Ideal for efficient power management in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,317

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-

-

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Digiode

USA . 3,106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,106

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-

-

-

Anansix

USA . 1,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,640

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,839 parts In-Stock

1+ parts

$6.972

100+ parts

-

1k+ parts

$6.275

10k+ parts

-

1,839

$6.972

-

$6.275

-

MKK Technologies

India . 596 parts In-Stock

1+ parts

$13.110

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$13.110

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-

-

DigiPath Technology Company

USA . 596 parts In-Stock

1+ parts

$13.110

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$13.110

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-

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Corphita

USA . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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96

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-

-

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Parana Technologies

USA . 46 parts In-Stock

1+ parts

-

100+ parts

$8.336

1k+ parts

-

10k+ parts

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46

-

$8.336

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-

Overview

Elevate your projects with the STBB1-18PUR from STMicroelectronics, a top-tier power supply module designed for reliability and efficiency. This compact solution delivers seamless performance across various applications, ensuring stable power where you need it most. With ST's renowned commitment to quality and innovation, you'll enjoy enhanced durability and superior output. Embrace the perfect blend of value and performance that empowers your designs to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient space utilization on PCBs.

Package Shape: SQUARE

A square shape provides uniform thermal distribution and simplifies layout designs.

No. of Terminals: 10

Having 10 terminals enhances flexibility in connections and integration into various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a lower profile, ideal for space-constrained designs.

Control Mode: CURRENT-MODE

Current-mode control enables faster transient response and improved stability.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and helps prevent oxidation, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and improved layout flexibility.

Other IC type: DC-DC REGULATED POWER SUPPLY MODULE

As a DC-DC regulated power supply module, it provides stable and efficient voltage regulation for various applications.

Maximum Time At Peak Reflow Temperature: 30 s

Thirty seconds at peak reflow temperature is suitable for reliable solder joint formation during assembly.

Peak Reflow Temperature: 260 C

A peak reflow temperature of 260 °C accommodates various solder processes ensuring compatibility with different manufacturing standards.

Maximum Switching Frequency: 2000 kHz

With a maximum switching frequency of 2000 kHz, this module supports high efficiency and compact size.

Maximum Output Current: 1 A

1 A maximum output current is adequate for many applications, providing reliable performance where it's needed most.

Terminal Form: NO LEAD

No-lead terminal form optimizes the module for miniaturized designs and improves thermal performance.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for tight spacing, ideal for modern compact PCB designs.

Technical Specifications

Power Supply Modules STBB1-18PUR attributes and parameters. Explore more Power Supply Modules devices from STMicroelectronics

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

10

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

2000 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STBB1-18PUR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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