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STA120D13TR

STMicroelectronics

STA120D13TR by STMicroelectronics

STA120D13TR by STMicroelectronics is a consumer IC designed for surface mount applications. It operates b/w -30 °C and 85°C, with a supply voltage range of 3V to 3.6V. This compact 28-terminal device features a rectangular shape and CMOS technology, ideal for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,755 parts In-Stock

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3,755

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Anansix

USA . 1,512 parts In-Stock

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1,512

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Digiode

USA . 934 parts In-Stock

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934

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ComSIT Distribution GmbH

Germany . 670 parts In-Stock

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670

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$1.648

100+ parts

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$1.483

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961

$1.648

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$1.483

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MKK Technologies

India . 1,534 parts In-Stock

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$3.098

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1,534

$3.098

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DigiPath Technology Company

USA . 1,534 parts In-Stock

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$3.098

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1,534

$3.098

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Microchip USA

USA . 391 parts In-Stock

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$5.857

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391

$5.857

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AZTECH Wire

Italy . 155 parts In-Stock

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$20.770

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155

$20.770

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QUARKTWIN TECHNOLOGY LTD

USA . 17,632 parts In-Stock

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17,632

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A-Z Elektronik GmbH

Germany . 6,179 parts In-Stock

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6,179

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Corphita

USA . 4,331 parts In-Stock

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Parana Technologies

USA . 1,511 parts In-Stock

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$1.970

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1,511

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$1.970

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Metaverse IC Inc.

Canada . 1,262 parts In-Stock

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Vigor

Singapore . 1,090 parts In-Stock

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Kepictronics

USA . 749 parts In-Stock

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749

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RC Electronics

USA . 744 parts In-Stock

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744

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Overview

Elevate your designs with the STA120D13TR from STMicroelectronics, a leading name in innovative consumer IC solutions. Crafted for reliability and performance, this compact dual-terminal device excels in various applications, ensuring seamless integration into your projects. With exceptional temperature resilience and efficient power management, it offers unmatched value, enabling you to create high-quality products that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors, making it suitable for various consumer applications.

Surface Mount: YES

Being a surface mount device allows for a smaller footprint and ease of assembly on PCB layouts, making it ideal for compact electronic designs.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of board space, allowing for a better arrangement of components in electronic designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is optimized for high performance in everyday electronic devices.

No. of Terminals: 28

With 28 terminals, this IC provides versatile connection options, accommodating a wide range of functionalities in consumer applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in compact design while still allowing for excellent thermal and electrical performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in various environmental conditions, suitable for consumer electronics.

Minimum Operating Temperature: -30 °C

The wide operating temperature range from -30 °C allows this IC to be used in diverse environments, from cold climates to warm interiors.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in PCB design, simplifying integration into various circuit layouts.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a more compact overall design, which is crucial for modern electronics that prioritize space efficiency.

Width: 7.5 mm

With a width of 7.5 mm, the IC is well-sized for integration into consumer devices without taking up excessive space on the PCB.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3 V supports a variety of low-power applications, enhancing battery life in portable devices.

Length: 17.9 mm

At a length of 17.9 mm, this IC maintains a compact profile, making it suitable for devices with limited space.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures the IC meets performance standards across varied operating environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, essential for efficient and reliable consumer electronics.

Terminal Form: GULL WING

Gull wing terminals facilitate secure soldering to the PCB, enhancing the reliability and mechanical integrity of the connection.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between ease of assembly and high density, supporting a wide range of applications.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V allows for flexibility in power supply options while ensuring compatibility with standard voltage levels.

Technical Specifications

Other Function Consumer ICs STA120D13TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

STA120D13TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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