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ST8R00PUR

STMicroelectronics

ST8R00PUR by STMicroelectronics

ST8R00PUR by STMicroelectronics is a compact switching regulator with a max input voltage of 6V and operates at a high switching frequency of 1.4 MHz. Its small outline package features 8 terminals in a dual position for efficient design integration. Ideal for space-constrained applications, it utilizes pulse width modulation for optimal performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,171 parts In-Stock

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10,171

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Digiode

USA . 4,169 parts In-Stock

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4,169

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Anansix

USA . 1,764 parts In-Stock

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1,764

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 660 parts In-Stock

1+ parts

$4.799

100+ parts

-

1k+ parts

$4.319

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660

$4.799

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$4.319

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MKK Technologies

India . 1,110 parts In-Stock

1+ parts

$9.024

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1,110

$9.024

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DigiPath Technology Company

USA . 1,110 parts In-Stock

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$9.024

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1,110

$9.024

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$9.753

100+ parts

$8.875

1k+ parts

$7.997

10k+ parts

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10

$9.753

$8.875

$7.997

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AZTECH Wire

Italy . 764 parts In-Stock

1+ parts

$20.320

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764

$20.320

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Microchip USA

USA . 5,504 parts In-Stock

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5,504

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Corphita

USA . 3,528 parts In-Stock

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3,528

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Parana Technologies

USA . 1,868 parts In-Stock

1+ parts

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$5.738

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1,868

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$5.738

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Overview

Elevate your designs with the ST8R00PUR from STMicroelectronics, a premium switching regulator that combines cutting-edge technology with exceptional reliability. Its compact, surface-mount design ensures effortless integration into space-constrained applications, while delivering outstanding efficiency and performance. Ideal for power management in consumer electronics, automotive systems, and industrial controls, this innovative solution empowers you to achieve superior results, reduce energy consumption, and enhance product longevity. Experience the advantage of working with a trusted manufacturer and unlock the full potential of your projects!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact spacing on PCBs, which is ideal for high-density applications.

Package Shape: SQUARE

A square package shape helps facilitate efficient layout and thermal management on the circuit board.

No. of Terminals: 8

With 8 terminals, this product offers multiple connection options for enhanced versatility in design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and very thin profile are suitable for space-constrained designs while improving thermal performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and reduces the risk of whisker growth, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position supports flexible PCB layout options and improves design layout efficiency.

Maximum Seated Height: 1 mm

A max seated height of only 1 mm enhances its suitability for ultra-compact designs.

Width: 4 mm

With a compact width of 4 mm, this regulator is ideal for tightly packed electronic circuits.

Other IC type: SWITCHING REGULATOR

Its classification as a switching regulator means superior efficiency and thermal management, making it suitable for various applications.

Nominal Input Voltage: 5 V

The nominal input voltage of 5 V is commonly used and compatible with standard voltage sources.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds ensures tolerance in assembly processes and helps maintain IC integrity.

Peak Reflow Temperature: 260 °C

With a peak reflow temperature of 260 °C, this IC can withstand high-temperature solder processes.

Length: 4 mm

A length of 4 mm complements its compact form factor, ideal for space-limited applications.

Maximum Switching Frequency: 1400 kHz

A high maximum switching frequency of 1400 kHz allows for smaller inductors and capacitors, optimizing space and efficiency.

Terminal Form: NO LEAD

The no-lead terminal form facilitates lower profile designs and better thermal performance.

Control Technique: PULSE WIDTH MODULATION

Using pulse width modulation for control offers high efficiency and reduces electrical noise, making it ideal for precision applications.

Switcher Config: BUCK

The buck configuration provides a straightforward means of stepping down voltage while maintaining efficiency and thermal performance.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, it allows for more compact placement, ideal for modern small form factor designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity, which means proper handling during assembly is required for reliability.

Minimum Input Voltage: 4 V

The minimum input voltage of 4 V provides flexibility in power applications that require lower input thresholds.

Maximum Input Voltage: 6 V

With a maximum input voltage of 6 V, it accommodates a range of voltage sources, ensuring integration in various systems.

Technical Specifications

Switching Regulators & Controllers ST8R00PUR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

6 V

Minimum Input Voltage:

4 V

Nominal Input Voltage:

5 V

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1400 kHz

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4 mm

Trade Compliance

ST8R00PUR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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