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ST750ABD-TR

STMicroelectronics

ST750ABD-TR by STMicroelectronics

ST750ABD-TR by STMicroelectronics is a compact buck switching regulator with a max output current of 2A and operates b/w -40 °C to 85 °C. It features a 5V nominal input and supports PWM control at up to 280kHz. Ideal for industrial applications requiring efficient power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,338 parts In-Stock

1+ parts

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4,338

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-

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Digiode

USA . 3,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,768

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Anansix

USA . 286 parts In-Stock

1+ parts

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100+ parts

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286

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 32 parts In-Stock

1+ parts

$6.619

100+ parts

-

1k+ parts

$5.957

10k+ parts

-

32

$6.619

-

$5.957

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MKK Technologies

India . 1,394 parts In-Stock

1+ parts

$12.447

100+ parts

-

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10k+ parts

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1,394

$12.447

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DigiPath Technology Company

USA . 1,394 parts In-Stock

1+ parts

$12.447

100+ parts

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1,394

$12.447

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Corphita

USA . 2,008 parts In-Stock

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2,008

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Parana Technologies

USA . 1,927 parts In-Stock

1+ parts

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100+ parts

$7.914

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10k+ parts

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1,927

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$7.914

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Overview

Elevate your designs with the ST750ABD-TR from STMicroelectronics—a powerful switching regulator that guarantees exceptional performance in a compact footprint. With its industrial-grade reliability, this advanced component operates seamlessly in extreme temperatures, ensuring durability across diverse applications. Enjoy enhanced efficiency and lower power consumption, making it the ideal choice for modern electronics. Trust in STMicroelectronics’ legacy of innovation and quality to transform your projects into high-performance solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This robust material provides durability and resistance to environmental factors, ensuring the long-term reliability of the device.

Surface Mount: YES

The surface-mount design facilitates easy integration into various circuit board layouts, saving space and improving design flexibility.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient arrangement on PCB, enhancing thermal performance and space utilization.

No. of Terminals: 8

With eight terminals, this device allows for multiple connections, providing versatility and better functionality in applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced footprint, making it ideal for compact devices and applications.

Maximum Operating Temperature: 85 °C

The high operating temperature rating ensures that the regulator can function in demanding environments, suitable for industrial applications.

Control Mode: CURRENT-MODE

Current-mode control provides improved transient response and stability, essential for reliable power delivery.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for application in extreme environments, making it suitable for automotive and aerospace usage.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and is commonly used in various electronics, ensuring compatibility with multiple manufacturing processes.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and ease of mounting, which can simplify PCB designs.

Maximum Seated Height: 1.75 mm

The low seated height assists in maintaining a compact overall design, vital for space-constrained applications.

Width: 3.9 mm

Narrow width allows for high-density PCB layouts, a significant advantage in small electronic devices.

Other IC Type: SWITCHING REGULATOR

As a switching regulator, it provides high efficiency and reduced heat generation, which is critical in power supply designs.

Nominal Input Voltage: 5 V

Designed for a common nominal input voltage, this device is well-suited for various consumer electronics and industrial applications.

Length: 4.9 mm

Short length aids in compact designs, making it an apt choice for miniaturized electronic products.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliability in harsher operating conditions, ideal for rugged applications.

Maximum Switching Frequency: 280 kHz

A high switching frequency allows for smaller passive components, enhancing the efficiency and compactness of the overall design.

Maximum Output Current: 2 A

With a maximum output current of 2 A, this regulator can supply significant power, suitable for a wide range of devices.

Technology: CMOS

CMOS technology offers low power consumption and enhanced performance, making it efficient for switching applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and assembly during manufacturing, improving production efficiency.

Control Technique: PULSE WIDTH MODULATION

PWM control technique ensures precise output regulation, essential for maintaining stable power supply in various conditions.

Switcher Config: BUCK

The buck converter configuration enables efficient step-down voltage regulation, reducing power loss and improving performance.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between ease of soldering and high-density layouts, suitable for modern electronics.

Minimum Input Voltage: 4 V

The ability to operate at a minimum input voltage of 4 V makes this device versatile for various battery-powered applications.

Maximum Input Voltage: 11 V

Supporting a maximum input voltage of 11 V enhances its applicability across a range of power supply systems.

Technical Specifications

Switching Regulators & Controllers ST750ABD-TR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

11 V

Minimum Input Voltage:

4 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

280 kHz

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

ST750ABD-TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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