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ST72T141K2B6

STMicroelectronics

ST72T141K2B6 by STMicroelectronics

ST72T141K2B6 from STMicroelectronics is an 8-bit microcontroller with a speed of 8MHz and 8KB OTP memory. It features SPI connectivity, supports motor control PWM, and operates in temperatures from -40 °C to 85 °C. Ideal for embedded applications requiring efficient processing and robust performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 4,957 parts In-Stock

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Anansix

USA . 1,356 parts In-Stock

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Digiode

USA . 114 parts In-Stock

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R&J Components

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PC Components Company LLC

USA . 5 parts In-Stock

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Benley Electronics

USA . 2 parts In-Stock

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$1.750

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Microchip USA

USA . 140 parts In-Stock

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$6.195

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AZTECH Wire

Italy . 231 parts In-Stock

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$10.250

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Component Stockers USA

USA . 561 parts In-Stock

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$99.990

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Vigor

Singapore . 2,446 parts In-Stock

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Corphita

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MKK Technologies

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 710 parts In-Stock

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Parana Technologies

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Kepictronics

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Perfect Parts

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Overview

Unlock the potential of your projects with the ST72T141K2B6 from STMicroelectronics. Renowned for exceptional quality and reliability, STMicroelectronics delivers this versatile 8-bit microcontroller perfect for embedded applications. With robust features like motor control PWM and a reliable SPI connectivity, it streamlines design processes while enhancing performance. Elevate your innovations and experience unparalleled support from a trusted leader in integrated circuits!

Feature Benefit Bullets

Other Names: 497-2116-5, 497-2116-5-NDR

Multiple naming conventions enhance compatibility and ease of reference for customers.

Standard Package: 100

The quantity in a standard package supports efficient bulk purchasing for larger projects.

Category: Integrated Circuits (ICs) - Embedded Microcontrollers

This classification indicates it is suited for a variety of embedded applications, ensuring flexibility.

Series: ST7

Being part of the ST7 series means proven reliability and performance in microcontroller applications.

Packaging: Tube

Tube packaging provides protection and ease of handling for assembly processes.

Core Processor: ST7

The ST7 core processor is well-regarded for its low power consumption and efficiency in embedded systems.

Core Size: 8-Bit

An 8-bit core allows for cost-effective processing in simple applications, making it suitable for basic control tasks.

Speed: 8MHz

An operational speed of 8MHz provides adequate performance for many control and monitoring tasks.

Connectivity: SPI

SPI connectivity facilitates fast and simple connection with other devices, ideal for various applications.

Peripherals: LVD, Motor Control PWM, POR, PWM, WDT

A variety of integrated peripherals enhance functionality and reduce the need for external components.

Number of I/O: 14

14 I/O pins offer sufficient versatility for a wide range of application needs.

Program Memory Size: 8KB (8K x 8)

8KB of program memory allows for relatively complex programs while maintaining a compact footprint.

Program Memory Type: OTP

One-Time Programmable (OTP) memory is ideal for applications with a fixed program, ensuring security and stability.

RAM Size: 256 x 8

The 256 bytes of RAM provides sufficient temporary storage for short-term processing needs.

Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V

A wide operating voltage range enhances adaptability to different power supply configurations.

Data Converters: A/D 8x8b

Eight 8-bit A/D converters allow for analog input, expanding application potential in sensor interfacing.

Oscillator Type: Internal

An internal oscillator simplifies circuit design by eliminating the need for external oscillator components.

Operating Temperature: -40 °C ~ 85 °C (TA)

A broad operating temperature range ensures reliability in harsh environments.

Mounting Type: Through Hole

Through-hole mounting provides stronger mechanical stability, ideal for prototyping and rugged applications.

Package / Case: 32-SDIP (0.400", 10.16mm)

The SDIP package format balances compactness with ease of handling during assembly.

Base Product Number: ST72T

Reference to the base product enhances understanding of features and compatibility within a series.

Technical Specifications

Additional Parts ST72T141K2B6 attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Core Processor:

ST7

Other Names:

497-2116-5
497-2116-5-NDR

Speed:

8MHz

Operating Temperature:

-40°C ~ 85°C (TA)

Category:

Integrated Circuits (ICs)
Embedded Microcontrollers

Program Memory Type:

OTP

RAM Size:

256 x 8

Number of I/O:

14

Peripherals:

LVD, Motor Control PWM, POR, PWM, WDT

Mounting Type:

Through Hole

Oscillator Type:

Internal

Standard Package:

100

Series:

ST7

Package / Case:

32-SDIP (0.400", 10.16mm)

Core Size:

8-Bit

Packaging:

Tube

Connectivity:

SPI

Program Memory Size:

8KB (8K x 8)

Data Converters:

A/D 8x8b

Voltage - Supply (Vcc/Vdd):

4V ~ 5.5V

Base Product Number:

ST72T

Moisture Sensitivity Level (MSL):

Not Applicable

Trade Compliance

ST72T141K2B6 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.31.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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