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ST491ACD

STMicroelectronics

ST491ACD by STMicroelectronics

ST491ACD by STMicroelectronics is a dual line transceiver with a max supply voltage of 5.5V and operates within -40 °C to 70°C. It features a max transmit delay of 16ns, supports EIA-422/EIA-485 standards, and is ideal for high-speed data communication applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,225

-

-

-

-

Vyrian

USA . 4,212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,212

-

-

-

-

Anansix

USA . 2,874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,874

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 126 parts In-Stock

1+ parts

$12.727

100+ parts

-

1k+ parts

$11.455

10k+ parts

-

126

$12.727

-

$11.455

-

MKK Technologies

India . 1,422 parts In-Stock

1+ parts

$23.933

100+ parts

-

1k+ parts

-

10k+ parts

-

1,422

$23.933

-

-

-

DigiPath Technology Company

USA . 1,422 parts In-Stock

1+ parts

$23.933

100+ parts

-

1k+ parts

-

10k+ parts

-

1,422

$23.933

-

-

-

Parana Technologies

USA . 2,100 parts In-Stock

1+ parts

-

100+ parts

$15.217

1k+ parts

-

10k+ parts

-

2,100

-

$15.217

-

-

Corphita

USA . 1,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,283

-

-

-

-

Overview

Unlock seamless communication with the ST491ACD from STMicroelectronics, a top-tier choice for line drivers and receivers. Designed for exceptional reliability, this compact device ensures efficient data transmission in various applications, from industrial automation to telecommunications. With low power consumption and impressive speed, it delivers superior performance that enhances your system's capabilities. Trust in STMicroelectronics' legacy of quality and innovation—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable plastic and epoxy materials ensures that the product is lightweight and resistant to environmental factors, enhancing its longevity.

Surface Mount: YES

Surface mount technology allows for easier integration into modern devices, contributing to a more compact and efficient design.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides compatibility with a wide range of systems, ensuring flexibility in various applications.

Package Shape: RECTANGULAR

The rectangular package shape is standard and offers ease of layout in PCB designs, making it user-friendly for engineers.

Maximum Transmit Delay: 16 ns

A low transmit delay enhances the speed of data transmission, making this device suitable for high-speed applications.

Power Supplies (V): 5

Operating with a standard supply voltage of 5 V makes the product easy to implement in existing systems without redesign.

No. of Terminals: 14

Having 14 terminals allows for multiple I/O options, providing flexibility for different circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, which is vital for compact device designs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V enables operation in environments with slightly lower supply levels, broadening system compatibility.

Maximum Operating Temperature: 70 °C

The ability to operate at temperatures up to 70 °C ensures reliability in various environments and applications.

Minimum Operating Temperature: 0 °C

Starting its operation at 0 °C allows for use in relatively low-temperature conditions, further increasing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes like nickel palladium gold guarantee excellent conductivity and corrosion resistance for longevity.

Terminal Position: DUAL

The dual terminal position allows for easier routing on the PCB, helping designers optimize their layouts.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75 mm, this product accommodates low-profile designs without compromising performance.

Width: 3.9 mm

A compact width of 3.9 mm allows for efficient use of space on the PCB, making it ideal for tight designs.

Maximum Output Low Current: 8 Amp

A maximum output low current of 8 A caters to high-load applications, ensuring the device can drive significant loads effectively.

Differential Output: YES

Differential outputs enhance noise immunity, making this driver/receiver suitable for long-distance communication.

Length: 8.65 mm

The overall length of 8.65 mm supports compact applications while maintaining adequate connection points.

Minimum Out Swing: 1.5 V

A minimum out swing of 1.5 V ensures sufficient voltage levels for signal integrity in noisy environments.

Temperature Grade: COMMERCIAL

Being rated for commercial use, it is well-suited for general electronic devices, offering reliability for everyday applications.

Maximum Receive Delay: 30 ns

A maximum receive delay of 30 ns allows for rapid communication, making it effective in networks requiring fast signal processing.

Terminal Form: GULL WING

The gull-wing terminal form promotes easier soldering and assembly, enhancing manufacturing efficiency.

Interface Standard: EIA-422; EIA-485

Compatibility with EIA-422 and EIA-485 standards ensures diverse application for industrial protocols, improving interoperability.

Maximum Supply Current: 5 mA

A low supply current requirement of 5 mA contributes to energy efficiency, making the device suitable for battery-operated applications.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger inputs provide enhanced noise margins, improving signal integrity and reducing false triggers.

Nominal Supply Voltage: 5 V

Standard 5 V nominal supply voltage simplifies design considerations and ensures compatibility with widely used components.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers a balance between compactness and ease of handling during assembly.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this product is tailored for effective communication between various electronic components, making it crucial in networking applications.

Technical Specifications

Line Drivers & Receivers ST491ACD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

30 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

16 ns

Width:

3.9 mm

Trade Compliance

ST491ACD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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