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ST3243EBJR

STMicroelectronics

ST3243EBJR by STMicroelectronics

ST3243EBJR by STMicroelectronics is a Line Transceiver IC with 3 functions, operating at 3.3V/5V. It features EIA-232, TIA-232, V.24, and V.28 interface standards for industrial applications. This rectangular package has a grid array style with very thin profile and fine pitch terminals for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,800

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-

-

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Digiode

USA . 2,210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,210

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-

-

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Anansix

USA . 2,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,088

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,813 parts In-Stock

1+ parts

$3.180

100+ parts

-

1k+ parts

-

10k+ parts

-

3,813

$3.180

-

-

-

Microchip USA

USA . 166 parts In-Stock

1+ parts

$3.930

100+ parts

$3.930

1k+ parts

$3.930

10k+ parts

$3.930

166

$3.930

$3.930

$3.930

$3.930

IDEA Electronic Components Group

UK . 454 parts In-Stock

1+ parts

$5.612

100+ parts

-

1k+ parts

$5.051

10k+ parts

-

454

$5.612

-

$5.051

-

MKK Technologies

India . 650 parts In-Stock

1+ parts

$10.553

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$10.553

-

-

-

DigiPath Technology Company

USA . 650 parts In-Stock

1+ parts

$10.553

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$10.553

-

-

-

AZTECH Wire

Italy . 475 parts In-Stock

1+ parts

$16.940

100+ parts

-

1k+ parts

-

10k+ parts

-

475

$16.940

-

-

-

Assy Fe

Spain . 100,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100,000

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-

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Perfect Parts

USA . 20,131 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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20,131

-

-

-

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GreenTree Electronics

Israel . 17,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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17,500

-

-

-

-

Corphita

USA . 3,339 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,339

-

-

-

-

A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

-

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Kepictronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,500

-

-

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Authorized Procurement Solutions

USA . 1,892 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,892

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-

-

-

Parana Technologies

USA . 958 parts In-Stock

1+ parts

-

100+ parts

$6.710

1k+ parts

-

10k+ parts

-

958

-

$6.710

-

-

Overview

Elevate your electronic designs with the ST3243EBJR by STMicroelectronics. Crafted with precision and expertise, this line driver & receiver offers unparalleled quality and reliability in every aspect. Ideal for industrial applications, this product boasts a wide range of benefits, from its compact design to its efficient power management capabilities. Experience seamless connectivity and superior performance with the ST3243EBJR, setting a new standard in the industry. Unlock endless possibilities with this innovative solution from a trusted manufacturer, tailored to meet your unique needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and longevity are key considerations.

Surface Mount: YES

Being surface mountable allows for easy and secure installation on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of systems and environments, offering flexibility in deployment.

No. of Functions: 3

Having multiple functions in a single device allows for integration of different capabilities in one package, reducing the need for additional components and circuitry.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and facilitates easy mounting on PCBs, making it suitable for compact and densely populated electronic devices.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages ensures compatibility with varying system requirements, offering versatility in design and application.

No. of Terminals: 28

With a higher number of terminals, this product enables greater connectivity options and integration with other components, enhancing functionality and versatility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch design allows for high-density mounting and efficient use of PCB real estate, making it suitable for compact layouts.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement makes the product energy efficient and suitable for applications where power consumption is a critical factor.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions and operate reliably in demanding scenarios.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the product to function effectively in both extreme cold and hot environments, ensuring consistent performance in various conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and connection processes, making it easier to integrate the product into existing systems or designs.

Maximum Seated Height: 0.95 mm

The low maximum seated height profile helps in keeping the overall profile of the device compact and suitable for slim form factor applications.

Width: 2.57 mm

The narrow width dimension enables efficient space utilization on PCBs, allowing for compact circuit designs and supporting miniaturization efforts.

Maximum Output Low Current: 1.6 Amp

The high maximum output low current rating indicates the product's capability to drive external loads with sufficient current, ensuring reliable signal transmission.

Receiver No. of Bits: 5

The receiver with 5 bits allows for precise and detailed data reception, enhancing the accuracy and reliability of communication processes.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time allowed at peak reflow temperature ensures proper soldering and reflow processes during manufacturing, leading to robust and reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability supports durable soldering and reflow processes, ensuring the product can withstand manufacturing and assembly requirements.

Length: 4.07 mm

The compact length dimension helps in maintaining a small footprint on the PCB, contributing to overall space efficiency and streamlined circuit layouts.

Minimum Out Swing: 5 V

The minimum output swing specification ensures compatibility with systems requiring a 5V signal level, making it suitable for a wide range of applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating certifies the product's reliability and performance in industrial environments with demanding temperature conditions.

Maximum Receive Delay: 0 ns

The zero receive delay specification ensures minimal latency in data reception, enabling real-time communication and faster signal processing.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, reducing the risk of connectivity issues and ensuring stable performance in various conditions.

Interface Standard: EIA-232; TIA-232; V.24; V.28

Support for multiple interface standards allows for versatile connectivity options and interoperability with different systems and devices, enhancing compatibility.

Maximum Supply Current: 1 mA

The low maximum supply current requirement indicates energy-efficient operation, reducing power consumption and making it suitable for battery-powered applications.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input characteristics ensure reliable and noise-immune signal processing, enhancing the product's ability to maintain signal integrity.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage specification provides a stable operating voltage for the product, ensuring consistent performance and reliability in operation.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and precise connections, supporting compact designs and efficient use of PCB space.

Driver No. of Bits: 3

The driver with 3 bits enables accurate and detailed data transmission, facilitating reliable communication and signal integrity between connected devices.

Interface IC Type: LINE TRANSCEIVER

The interface IC type of line transceiver offers enhanced functionality for signal transmission and reception, making it a versatile choice for communication applications.

Technical Specifications

Line Drivers & Receivers ST3243EBJR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.24; V.28

JESD-30 Code:

R-PBGA-B28

Length:

4.07 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

5 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA28,5X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

.95 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2.57 mm

Trade Compliance

ST3243EBJR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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