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ST3241EBDR

STMicroelectronics

ST3241EBDR by STMicroelectronics

ST3241EBDR by STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V, supporting EIA-232 standards. It features 3 functions and operates in industrial temperatures from -40 °C to 85 °C. Ideal for reliable data communication in compact designs.

Median Price

$3.765

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 10 parts In-Stock

1+ parts

$3.765

100+ parts

$3.954

1k+ parts

$3.728

10k+ parts

-

10

$3.765

$3.954

$3.728

-

Vyrian

USA . 6,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,993

-

-

-

-

Digiode

USA . 2,457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,457

-

-

-

-

Anansix

USA . 1,298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,298

-

-

-

-

LIBRA Elektronik GmbH

Germany . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

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EMSNET

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,033 parts In-Stock

1+ parts

$4.481

100+ parts

-

1k+ parts

$4.033

10k+ parts

-

1,033

$4.481

-

$4.033

-

Microchip USA

USA . 208 parts In-Stock

1+ parts

$6.260

100+ parts

$6.260

1k+ parts

$6.260

10k+ parts

$6.260

208

$6.260

$6.260

$6.260

$6.260

MKK Technologies

India . 2,139 parts In-Stock

1+ parts

$8.427

100+ parts

-

1k+ parts

-

10k+ parts

-

2,139

$8.427

-

-

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DigiPath Technology Company

USA . 2,139 parts In-Stock

1+ parts

$8.427

100+ parts

-

1k+ parts

-

10k+ parts

-

2,139

$8.427

-

-

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AZTECH Wire

Italy . 352 parts In-Stock

1+ parts

$14.880

100+ parts

-

1k+ parts

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10k+ parts

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352

$14.880

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Vigor

Singapore . 1,780 parts In-Stock

1+ parts

-

100+ parts

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1,780

-

-

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Corphita

USA . 1,163 parts In-Stock

1+ parts

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100+ parts

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1,163

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Parana Technologies

USA . 1,081 parts In-Stock

1+ parts

-

100+ parts

$5.358

1k+ parts

-

10k+ parts

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1,081

-

$5.358

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Overview

Experience unparalleled reliability with the ST3241EBDR from STMicroelectronics, a leader in innovative semiconductor solutions. This robust line driver and receiver excels in industrial applications, ensuring seamless data transmission even in demanding conditions. With its compact design and low power consumption, the ST3241EBDR delivers exceptional performance while simplifying your circuit layouts. Trust in STMicroelectronics’ commitment to quality and elevate your projects with this versatile component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and resistance to environmental stress.

Surface Mount: YES

Surface mount compatibility offers streamlined assembly processes and effective use of space in compact designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in powering the device, allowing for compatibility with various systems.

No. of Functions: 3

Multiple functions support diverse applications, making this product versatile for a range of line driving and receiving tasks.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating easier integration in tight layouts.

Power Supplies (V): 3.3/5

Dual voltage supply options make it adaptable for different operational requirements and system designs.

No. of Terminals: 28

With 28 terminals, this component allows for extensive connectivity options, improving functional flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, enhancing design compactness.

Minimum Supply Voltage: 3 V

The low minimum supply voltage contributes to energy efficiency, making it suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in warmer environments, crucial for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures expands its usability in extreme conditions, enhancing reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning simplifies circuit board layout and design, improving installation efficiency.

Maximum Seated Height: 2.65 mm

The low seated height facilitates better compatibility in space-restricted setups, allowing for efficient design.

Width: 7.5 mm

A compact width ensures easy integration into narrow PCB layouts, expanding design options.

Maximum Output Low Current: 1.6 Amp

The high output current capability allows for powering demanding loads without compromising performance.

Receiver No. of Bits: 5

A 5-bit receiver enhances data handling capabilities, making it suitable for complex communication tasks.

Length: 17.9 mm

The manageable length supports integration into various enclosures without space constraints.

Minimum Out Swing: 10 V

Ability to achieve a minimum out swing of 10V enhances signal integrity over long distances.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring robustness and reliability in challenging environments.

Maximum Receive Delay: 0 ns

Zero maximum receive delay guarantees instant data transmission, eliminating latency in critical applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable mechanical connections.

Interface Standard: EIA-232; TIA-232; V.24; V.28

Wide compatibility with standard interfaces makes this product ideal for various communication setups.

Maximum Supply Current: 1 mA

Low supply current consumption enhances energy efficiency, making the product suitable for low-power applications.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics improve noise immunity and signal integrity, ensuring reliable operation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage is ideal for modern digital systems, ensuring efficient operation.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch improves the density of connections, allowing for more compact circuit designs.

Driver No. of Bits: 3

A 3-bit driver offers adequate data transmission capabilities, suitable for a variety of applications.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it supports robust communication over longer distances, crucial for industrial and commercial uses.

Technical Specifications

Line Drivers & Receivers ST3241EBDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.24; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ST3241EBDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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