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ST3237EBDR

STMicroelectronics

ST3237EBDR by STMicroelectronics

ST3237EBDR by STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V and operates b/w -40 °C to 85 °C. It features 3 functions, supports EIA-232 standards, and is ideal for industrial communication applications. Its compact SO package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,882 parts In-Stock

1+ parts

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4,882

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Digiode

USA . 1,103 parts In-Stock

1+ parts

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1,103

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Anansix

USA . 285 parts In-Stock

1+ parts

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285

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 614 parts In-Stock

1+ parts

$6.026

100+ parts

-

1k+ parts

$5.423

10k+ parts

-

614

$6.026

-

$5.423

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MKK Technologies

India . 156 parts In-Stock

1+ parts

$11.332

100+ parts

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156

$11.332

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DigiPath Technology Company

USA . 156 parts In-Stock

1+ parts

$11.332

100+ parts

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156

$11.332

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AZTECH Wire

Italy . 1,114 parts In-Stock

1+ parts

$21.350

100+ parts

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1,114

$21.350

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Microchip USA

USA . 4,306 parts In-Stock

1+ parts

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4,306

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QUARKTWIN TECHNOLOGY LTD

USA . 4,206 parts In-Stock

1+ parts

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4,206

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Vigor

Singapore . 1,897 parts In-Stock

1+ parts

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1,897

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Parana Technologies

USA . 1,512 parts In-Stock

1+ parts

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100+ parts

$7.205

1k+ parts

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1,512

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$7.205

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Corphita

USA . 993 parts In-Stock

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993

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Overview

Unlock seamless communication with the ST3237EBDR from STMicroelectronics, a leading name in innovation and quality. This reliable line driver and receiver promises exceptional performance across various applications, from industrial automation to consumer electronics. With its compact design and robust temperature range, it ensures durability and efficiency. Experience the benefits of superior signal integrity, low power consumption, and enhanced versatility—all backed by ST’s commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and thermal stability, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount capability allows for compact design and is suitable for automated assembly, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a wide range of digital circuits, providing flexibility in various applications.

No. of Functions: 3

Having multiple functions in a single IC reduces component count and complexity in design, leading to lower assembly costs and increased reliability.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCB layouts, allowing for efficient use of board real estate.

Power Supplies (V): 3.3/5

Dual supply voltage options of 3.3V and 5V enable compatibility with various systems, providing versatility in circuit design.

No. of Terminals: 28

With 28 terminals, this IC provides ample connectivity for complex designs, allowing integration with multiple signals and features.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates compact designs, ideal for modern electronic devices that require size efficiency.

Maximum High Level Input Current: 0.000001 Amp

Very low input current minimizes power consumption, making this device energy-efficient and suitable for battery-operated applications.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures operation in low-power environments, catering to energy-conscious design requirements.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows for reliable performance in industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this IC suitable for harsh environments, ensuring functional reliability in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish with nickel palladium gold ensures excellent solderability and corrosion resistance, enhancing overall longevity.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout, simplifying the design process and improving assembly efficiency.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm is advantageous for space-critical applications, enabling sleek and compact device designs.

Width: 7.5 mm

A width of 7.5 mm makes this component easy to integrate into a variety of designs, fitting well into standard PCB layouts.

Maximum Output Low Current: 1 Amp

The capability to output up to 1 Amp allows for driving larger loads, making this IC applicable in power-demanding applications.

Receiver No. of Bits: 3

With a 3-bit receiver, this device can handle multiple data lines simultaneously, facilitating effective data communication.

Length: 17.9 mm

The compact length of 17.9 mm supports integration into smaller devices, maximizing design flexibility without compromising performance.

Minimum Out Swing: 10 V

A minimum out swing of 10 V ensures that signals can be reliably transmitted over longer distances, maintaining signal integrity.

Temperature Grade: INDUSTRIAL

Industrial-grade components are built to withstand harsh environments, ensuring reliability and longevity in critical applications.

Maximum Receive Delay: 0 ns

Zero receive delay guarantees immediate signal processing, enhancing the responsiveness and efficiency of data communication.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and assembly, providing reliability in connections and improving overall device performance.

Interface Standard: EIA-232; TIA-232; V.24; V.28

Adherence to widely used communication standards ensures compatibility with existing infrastructure, making integration seamless.

Maximum Supply Current: 1 mA

Low supply current of 1 mA contributes to energy efficiency, suitable for battery-powered devices and applications focused on power savings.

Input Characteristics: SCHMITT TRIGGER

The use of Schmitt trigger for input characteristics improves noise immunity, leading to more reliable signal detection and processing.

Nominal Supply Voltage: 3.3 V

Nominal operating at 3.3 V balances performance with power efficiency, making it ideal for modern low-power electronics.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for efficient routing of signals on PCBs, simplifying the design and minimizing the risk of errors.

Driver No. of Bits: 5

With a 5-bit driver, it can handle multi-bit data efficiently, supporting more complex communications without additional components.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this component effectively manages data transmission and reception, marking it as a vital part of communication systems.

Technical Specifications

Line Drivers & Receivers ST3237EBDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Additional Features:

1 MEGA BITS PER SECOND DATA RATE POSSIBLE

Differential Output:

NO

Driver No. of Bits:

5

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.24; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ST3237EBDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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