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ST1480ACD

STMicroelectronics

ST1480ACD by STMicroelectronics

ST1480ACD by STMicroelectronics is a dual line transceiver with a max supply voltage of 3.6V and operates efficiently within 0 °C to 70 °C. It features a max transmit delay of 30 ns and supports EIA-422/EIA-485 standards, ideal for robust data communication applications. Its compact SO package ensures easy surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 11,267 parts In-Stock

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Digiode

USA . 2,498 parts In-Stock

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2,498

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Vyrian

USA . 1,753 parts In-Stock

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1,753

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Anansix

USA . 152 parts In-Stock

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152

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,474 parts In-Stock

1+ parts

$12.080

100+ parts

-

1k+ parts

$10.872

10k+ parts

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1,474

$12.080

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$10.872

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MKK Technologies

India . 199 parts In-Stock

1+ parts

$22.715

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199

$22.715

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DigiPath Technology Company

USA . 199 parts In-Stock

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$22.715

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199

$22.715

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Corphita

USA . 1,968 parts In-Stock

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1,968

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Parana Technologies

USA . 1,119 parts In-Stock

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$14.443

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1,119

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$14.443

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Overview

Unlock the potential of your designs with the ST1480ACD from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance line driver and receiver guarantees reliability in communication applications while delivering low power consumption and fast response times. Ideal for industrial automation, telecommunications, and data acquisition systems, the ST1480ACD ensures seamless connectivity and robust performance, empowering you to bring your projects to life with confidence and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern electronic circuits, maximizing space efficiency.

Maximum Supply Voltage: 3.6 V

With a maximum voltage of 3.6 V, this line driver/receiver can be safely used in a variety of systems without risking damage.

Package Shape: RECTANGULAR

The rectangular shape optimizes the layout for effective space utilization on PCB designs.

Maximum Transmit Delay: 30 ns

A low transmit delay ensures quick signal transmission, making this device suitable for high-speed communications.

Power Supplies (V): 3.3

Designed to operate at 3.3 V, it is compatible with common digital systems and helps in power management.

No. of Terminals: 8

An 8-terminal configuration provides adequate interfaces for multiple connections, supporting versatile applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enables flexible PCB design, making it ideal for compact devices.

Minimum Supply Voltage: 3 V

The minimum supply voltage allows for greater flexibility in power supply choices, accommodating various applications.

Maximum Operating Temperature: 70 °C

Operating at high temperatures (up to 70 °C) ensures reliability in demanding environments.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold environments, enhancing its adaptability across temperature ranges.

Terminal Finish: NICKEL PALLADIUM GOLD

This premium terminal finish promotes excellent conductivity and resistance to corrosion, ensuring a long service life.

Terminal Position: DUAL

Dual terminal positions enhance connection versatility, simplifying the design of circuit layouts.

Maximum Seated Height: 1.75 mm

A low seated height allows for a compact footprint, making the component suitable for space-constrained applications.

Width: 3.9 mm

Narrow width aids in efficient board space utilization, ideal for miniaturized electronic designs.

Maximum Output Low Current: 4 Amp

High output current capability facilitates driving heavier loads, extending application possibilities.

Differential Output: YES

Differential outputs reduce electromagnetic interference, ensuring cleaner signal transmission for reliable communication.

Length: 4.9 mm

Compact length enhances design flexibility and allows integration into various electronic devices.

Minimum Out Swing: 1.5 V

A minimum output swing of 1.5 V ensures compatibility with various logic levels, enhancing its usability.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures the product meets standard performance requirements for general electronic applications.

Maximum Receive Delay: 50 ns

A maximum receive delay of 50 ns supports efficient data handling, crucial for high-speed applications.

Terminal Form: GULL WING

Gull wing terminals facilitate secure soldering and reliable mechanical connection on PCBs.

Interface Standard: EIA-422; EIA-485

Compliance with EIA-422 and EIA-485 standards ensures compatibility with industry-standard communication protocols.

Maximum Supply Current: 2.2 mA

Low supply current consumption aids in energy efficiency, making it suitable for battery-operated devices.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input provides high noise immunity, which is essential for reliable data communication.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V aligns well with most low-power digital applications, promoting efficient performance.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports a variety of PCB designs, providing design flexibility.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it facilitates bidirectional communication, making it ideal for data transmission applications.

Technical Specifications

Line Drivers & Receivers ST1480ACD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

50 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2.2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

30 ns

Width:

3.9 mm

Trade Compliance

ST1480ACD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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