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SN250Q

STMicroelectronics

SN250Q by STMicroelectronics

SN250Q by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85°C. It features a compact 48-terminal quad package with a max height of 1mm and supports a nominal voltage of 1.8V. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

Median Price

$7.542

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 10 parts In-Stock

1+ parts

$7.542

100+ parts

$7.919

1k+ parts

$7.467

10k+ parts

-

10

$7.542

$7.919

$7.467

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Digiode

USA . 3,330 parts In-Stock

1+ parts

-

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3,330

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Vyrian

USA . 2,527 parts In-Stock

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2,527

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Anansix

USA . 995 parts In-Stock

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995

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Zilex Electronics Inc.

Canada . 211 parts In-Stock

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211

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ComSIT Distribution GmbH

Germany . 9 parts In-Stock

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ComSIT USA

USA . 9 parts In-Stock

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9

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Distributors (Availability)

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AZTECH Wire

Italy . 824 parts In-Stock

1+ parts

$12.170

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824

$12.170

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IDEA Electronic Components Group

UK . 1,848 parts In-Stock

1+ parts

$13.758

100+ parts

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$12.382

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1,848

$13.758

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$12.382

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MKK Technologies

India . 1,308 parts In-Stock

1+ parts

$25.870

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1,308

$25.870

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DigiPath Technology Company

USA . 1,308 parts In-Stock

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$25.870

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1,308

$25.870

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Parana Technologies

USA . 2,237 parts In-Stock

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$16.449

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2,237

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$16.449

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Corphita

USA . 1,135 parts In-Stock

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Overview

Experience unparalleled performance with the SN250Q from STMicroelectronics, a leader in innovative solutions. This versatile telecom interface IC is designed for reliability and efficiency, making it perfect for a wide range of applications, from industrial automation to telecommunications. With its compact size and robust temperature resilience, the SN250Q ensures optimal functionality even in challenging environments, delivering exceptional value that empowers your projects to succeed.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact PCB designs and enables automated assembly processes, making integration into various applications simpler and more efficient.

Package Shape: SQUARE

The square package shape facilitates easier placement on PCBs, minimizing the risk of orientation errors during setup.

No. of Terminals: 48

With 48 terminals, this IC can accommodate a wide range of functionalities, providing flexibility for complex telecom applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile along with the heat sink/slip package style improves thermal performance, crucial for high-density applications.

Maximum Operating Temperature: 85 °C

Operating reliably at temperatures up to 85 °C ensures the product can function in a variety of challenging environments.

Minimum Operating Temperature: -40 °C

The capability to function at temperatures as low as -40 °C makes this IC suitable for extreme conditions, enhancing its application range.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures excellent solderability, which can lead to more reliable connections and longer product life.

Terminal Position: QUAD

The quad terminal position supports more flexible routing on PCBs, which can simplify layout design and optimize performance.

Maximum Seated Height: 1 mm

A maximum seated height of 1 mm allows for low-profile designs, which is a significant advantage in space-constrained applications.

Width: 7 mm

A width of 7 mm provides a good balance between footprint size and functionality, contributing to compact designs.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum time of 40 seconds at peak reflow temperature facilitates effective soldering without compromising component performance.

Peak Reflow Temperature °C: 260

Supported peak reflow temperatures of 260 °C ensure compatibility with modern soldering techniques, enhancing manufacturing efficiency.

Length: 7 mm

At 7 mm in length, this IC maintains a small footprint, allowing for higher-density PCB designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature applications underscores its robustness and reliability in harsh environments.

Terminal Form: NO LEAD

The no-lead design enhances space efficiency and minimizes potential for contamination, improving overall reliability.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, it is optimized for performance in communication applications, ensuring effective signal processing.

Nominal Supply Voltage: 1.8 V

Operating at a low nominal supply voltage of 1.8 V helps in reducing power consumption, which is critical for battery-operated or energy-sensitive devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for greater packing density on PCBs, making it ideal for compact designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, adequate precautions must be taken during handling, ensuring optimal reliability in humid environments.

Technical Specifications

Other Function Telecom Interface ICs SN250Q attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

SN250Q Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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