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SMA6F31A

STMicroelectronics

SMA6F31A by STMicroelectronics

SMA6F31A by STMicroelectronics is a single-configured transient suppression device with a max non-repetitive peak reverse power dissipation of 600W. It is used for voltage suppression in applications such as IEC-61000-4-2 reference standard compliance and protection against transient voltage spikes.

Median Price

$0.061

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 773 parts In-Stock

1+ parts

$0.069

100+ parts

$0.053

1k+ parts

$0.031

10k+ parts

-

773

$0.069

$0.053

$0.031

-

Mouser Electronics

USA . 844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.097

844

-

-

-

$0.097

Verical

USA . 773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.031

10k+ parts

-

773

-

-

$0.031

-

Chip1Stop

Japan . 773 parts In-Stock

1+ parts

-

100+ parts

$0.053

1k+ parts

$0.031

10k+ parts

-

773

-

$0.053

$0.031

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,317 parts In-Stock

1+ parts

$0.066

100+ parts

-

1k+ parts

-

10k+ parts

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1,317

$0.066

-

-

-

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$0.148

100+ parts

-

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-

10k+ parts

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98

$0.148

-

-

-

Flip Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

-

-

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Anansix

USA . 2,569 parts In-Stock

1+ parts

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2,569

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-

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Vyrian

USA . 623 parts In-Stock

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623

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 561 parts In-Stock

1+ parts

$0.026

100+ parts

-

1k+ parts

-

10k+ parts

-

561

$0.026

-

-

-

Corphita

USA . 2,860 parts In-Stock

1+ parts

$0.062

100+ parts

-

1k+ parts

-

10k+ parts

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2,860

$0.062

-

-

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IDEA Electronic Components Group

UK . 1,006 parts In-Stock

1+ parts

$0.076

100+ parts

-

1k+ parts

$0.069

10k+ parts

-

1,006

$0.076

-

$0.069

-

MKK Technologies

India . 1,637 parts In-Stock

1+ parts

$0.144

100+ parts

-

1k+ parts

-

10k+ parts

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1,637

$0.144

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-

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DigiPath Technology Company

USA . 1,637 parts In-Stock

1+ parts

$0.144

100+ parts

-

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10k+ parts

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1,637

$0.144

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.145

100+ parts

-

1k+ parts

$0.139

10k+ parts

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500

$0.145

-

$0.139

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Argo Parts USA

USA . 1,497 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

-

10k+ parts

$0.143

1,497

$0.147

-

-

$0.143

Continental Prestige Electronics

USA . 1,008 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

-

10k+ parts

$0.144

1,008

$0.147

-

-

$0.144

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

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-

-

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Parana Technologies

USA . 2,279 parts In-Stock

1+ parts

-

100+ parts

$0.091

1k+ parts

-

10k+ parts

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2,279

-

$0.091

-

-

Overview

Experience superior protection with the SMA6F31A by STMicroelectronics! As a leading manufacturer in the industry, STMicroelectronics delivers exceptional quality and reliability. The SMA6F31A is a Transient Suppression Device that offers unrivaled performance and versatility. Whether you need to safeguard your sensitive electronics or suppress voltage spikes, this product has got you covered. Its small outline package shape and surface mount feature make it easy to integrate into any design. With a maximum non-repetitive peak reverse power dissipation of 600W, it ensures long-lasting protection for your valuable equipment. Trust the SMA6F31A to provide the peace of mind you deserve.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and protection, making the device suitable for various applications.

Config:

SINGLE. The single configuration simplifies installation and operation, making it convenient for users.

Surface Mount:

YES. This feature allows for easy and efficient mounting on circuit boards, saving time and effort during assembly.

Maximum Non Repetitive Peak Reverse Power Dissipation:

600 W. With a high power dissipation capacity, this device can handle surges and spikes without damage, ensuring reliable operation.

Package Shape:

RECTANGULAR. The rectangular shape allows for efficient space utilization, making it suitable for compact designs.

No. of Terminals:

2. The two terminal configuration simplifies circuit connection, ensuring easy integration into electronic systems.

Package Style (Meter):

SMALL OUTLINE. The small outline package style minimizes space requirements, enabling the use of this device in space-constrained applications.

Maximum Operating Temperature:

175 °C. This high operating temperature range ensures the device's reliability and performance even in demanding environments.

Minimum Operating Temperature:

55 °C. The wide temperature range ensures the device's functionality in extreme cold conditions, expanding its potential applications.

Terminal Finish:

MATTE TIN. The matte tin terminal finish provides excellent conductivity and corrosion resistance, contributing to the long-term reliability of the device.

Terminal Position:

DUAL. The dual terminal position enhances versatility in circuit connection, making it suitable for different system configurations.

Minimum Breakdown Voltage:

34.2 V. This low breakdown voltage allows the device to quickly respond to voltage spikes and suppress them effectively, protecting connected components.

Peak Reflow Temperature °C:

245. The high peak reflow temperature enables efficient and reliable soldering during assembly, ensuring proper connection and reducing the risk of failure.

Maximum Breakdown Voltage:

37.8 V. With a high breakdown voltage, this device can effectively suppress transient voltages and protect sensitive components from damage.

Reference Standard:

IEC-61000-4-2. Compliant with this reference standard, the device meets recognized industry requirements for transient suppression, ensuring its reliability and performance.

Diode Type:

TRANS VOLTAGE SUPPRESSOR DIODE. This diode type specializes in suppressing voltage transients, making it an ideal choice for protecting electronic circuits.

Technology:

AVALANCHE. The avalanche technology used in this device ensures rapid response and high surge capability, making it effective in safeguarding against transient events.

Terminal Form:

FLAT. The flat terminal form makes soldering and connection easier, enhancing the device's reliability and simplifying assembly processes.

Maximum Repetitive Peak Reverse Voltage:

31 V. With a high repetitive peak reverse voltage capacity, this device can handle repeated voltage surges without degradation, ensuring long-lasting protection.

Polarity:

UNIDIRECTIONAL. The unidirectional polarity allows the device to suppress transients in one direction, making it suitable for applications that require protection against specific voltage fluctuations.

Diode Element Material:

SILICON. The silicon diode element material provides excellent conductivity and high temperature tolerance, ensuring reliable performance and longevity of the device.

Technical Specifications

Transient Suppression Devices SMA6F31A attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

37.8 V

Minimum Breakdown Voltage:

34.2 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-221AC

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

600 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity:

UNIDIRECTIONAL

Reference Standard:

IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

31 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

SMA6F31A Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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