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SMA6F22A

STMicroelectronics

SMA6F22A by STMicroelectronics

SMA6F22A by STMicroelectronics is a unidirectional transient voltage suppressor diode, ideal for protecting sensitive electronics. It features a max reverse power dissipation of 600 W and operates b/w -55 °C to 175 °C. With a breakdown voltage range of 24.4-27 V, it's perfect for robust circuit protection applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,468 parts In-Stock

1+ parts

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2,468

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Anansix

USA . 529 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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529

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Digiode

USA . 309 parts In-Stock

1+ parts

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309

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,193 parts In-Stock

1+ parts

$0.086

100+ parts

-

1k+ parts

$0.078

10k+ parts

-

2,193

$0.086

-

$0.078

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MKK Technologies

India . 1,713 parts In-Stock

1+ parts

$0.163

100+ parts

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10k+ parts

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1,713

$0.163

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DigiPath Technology Company

USA . 1,713 parts In-Stock

1+ parts

$0.163

100+ parts

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10k+ parts

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1,713

$0.163

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AZTECH Wire

Italy . 1,165 parts In-Stock

1+ parts

$8.350

100+ parts

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1,165

$8.350

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Eastek

USA . 80,000 parts In-Stock

1+ parts

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80,000

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Perfect Parts

USA . 22,400 parts In-Stock

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22,400

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Corphita

USA . 1,151 parts In-Stock

1+ parts

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1,151

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Parana Technologies

USA . 130 parts In-Stock

1+ parts

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100+ parts

$0.103

1k+ parts

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130

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$0.103

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Overview

Ensure your designs excel with the SMA6F22A from STMicroelectronics, a leader in innovation and reliability. This transient suppression device promises unmatched protection against voltage spikes, enhancing the longevity of your electronic applications. With robust thermal performance and compact surface mount design, it seamlessly integrates into your projects, offering peace of mind and elevated efficiency. Trust STMicroelectronics to safeguard your technology investments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability, making this device suitable for various environmental conditions.

Config: SINGLE

A single diode configuration simplifies the design and integration process into electronic circuits.

Surface Mount: YES

Surface mount capability allows for efficient use of board space and supports automated manufacturing processes.

Maximum Non Repetitive Peak Reverse Power Dissipation: 600 W

This high power dissipation rating indicates the device can handle significant surges, enhancing system protection during transient events.

Package Shape: RECTANGULAR

The rectangular package shape is advantageous for space optimization on PCBs and ensures easy layout.

No. of Terminals: 2

Having only two terminals reduces complexity and makes circuit connections straightforward.

Package Style (Meter): SMALL OUTLINE

The small outline of the package enables compact designs while maintaining sufficient performance and reliability.

Maximum Operating Temperature: 175 °C

A high operating temperature range ensures this device can function in demanding thermal environments.

Minimum Operating Temperature: -55 °C

The wide temperature range allows operation in extreme conditions, making it versatile for various applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and ensures reliable electrical connections during assembly.

Terminal Position: DUAL

Dual terminal positioning facilitates easier placement and connection in circuit designs.

Minimum Breakdown Voltage: 24.4 V

A minimum breakdown voltage of 24.4 V makes this device effective for protecting against voltage spikes in low-voltage applications.

Peak Reflow Temperature °C: 245 °C

A peak reflow temperature of 245 °C indicates compatibility with modern soldering processes, ensuring reliable assembly.

Maximum Breakdown Voltage: 27 V

The maximum breakdown voltage of 27 V provides a robust defense against over-voltage conditions to protect sensitive components.

Reference Standard: IEC-61000-4-2

Complying with IEC-61000-4-2 standards ensures this device meets international criteria for electrostatic discharge immunity.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

As a transient voltage suppressor, this diode is specifically designed to protect circuits from voltage spikes.

Technology: AVALANCHE

Avalanche technology allows for quick response times and effective suppression of transient voltages.

Terminal Form: FLAT

Flat terminal form aids in providing a stable connection and enhances the soldering process.

Maximum Repetitive Peak Reverse Voltage: 22 V

The maximum repetitive peak reverse voltage of 22 V ensures reliable operation under cyclic voltage stress.

Polarity: UNIDIRECTIONAL

Unidirectional configuration simplifies circuit design by preventing reverse current, thus protecting circuitry effectively.

Diode Element Material: SILICON

Silicon as the diode element material is widely recognized for its effective performance and availability in electronic applications.

Technical Specifications

Transient Suppression Devices SMA6F22A attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

27 V

Minimum Breakdown Voltage:

24.4 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-221AC

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

600 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity:

UNIDIRECTIONAL

Reference Standard:

IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

22 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

SMA6F22A Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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