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RHRAC164245K03V

STMicroelectronics

RHRAC164245K03V by STMicroelectronics

RHRAC164245K03V by STMicroelectronics is a military-grade CMOS bus driver with 8 bits and dual ports, operating b/w -55 °C to 150 °C. It features a ceramic, metal-sealed package and supports supply voltages from 2V to 6V. Ideal for high-reliability applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,053 parts In-Stock

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3,053

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Digiode

USA . 2,879 parts In-Stock

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2,879

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Anansix

USA . 2,713 parts In-Stock

1+ parts

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2,713

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$3.854

100+ parts

-

1k+ parts

$3.699

10k+ parts

$3.699

50

$3.854

-

$3.699

$3.699

IDEA Electronic Components Group

UK . 1,810 parts In-Stock

1+ parts

$24.841

100+ parts

-

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$22.357

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1,810

$24.841

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$22.357

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MKK Technologies

India . 2,240 parts In-Stock

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$46.712

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2,240

$46.712

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DigiPath Technology Company

USA . 2,240 parts In-Stock

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$46.712

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2,240

$46.712

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Corphita

USA . 1,318 parts In-Stock

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1,318

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Parana Technologies

USA . 99 parts In-Stock

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$29.701

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99

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$29.701

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Overview

Unlock unparalleled performance in your aerospace and military applications with the RHRAC164245K03V by STMicroelectronics. Crafted with precision, this robust bus driver and transceiver ensures reliable data transmission under extreme conditions, delivering unmatched durability and efficiency. Choose STMicroelectronics for superior quality backed by rigorous testing, making this component a trusted ally for your most critical projects. Elevate your design with confidence!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This combination offers enhanced durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly, making it ideal for high-density applications.

No. of Functions: 2

Having multiple functions in a single package increases versatility and reduces component count, simplifying circuit design.

Screening Level: MIL-PRF-38535 Class V

This screening level guarantees high reliability and performance in military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular shape allows efficient use of PCB space and easier integration into designs.

No. of Bits: 8

With an 8-bit interface, this transceiver supports a wide range of data communication applications.

Nominal Supply Voltage / Vsup: 3 V

A nominal supply voltage of 3 V makes it energy efficient, extending battery life in portable applications.

No. of Terminals: 48

Having 48 terminals facilitates complex connections and enhances functionality in communication systems.

Package Style (Meter): FLATPACK

The flatpack style contributes to a lower profile, making it easier to accommodate in size-constrained designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliable performance in extreme thermal conditions.

Output Characteristics: 3-STATE

The 3-state output allows for flexible data management in multi-device systems.

Minimum Operating Temperature: -55 °C

This allows the device to function in extreme cold environments, enhancing its usability in diverse applications.

Terminal Position: DUAL

Dual terminal positioning improves the device's compatibility with a variety of circuit layouts and configurations.

No. of Ports: 2

Two ports facilitate communication between multiple devices, enhancing system efficiency.

Maximum Seated Height: 2.72 mm

A low seated height supports compact design requirements while providing reliable connections.

Width: 9.65 mm

This width allows integration in tight spaces without compromising performance.

Output Polarity: TRUE

True output polarity can lead to improved signal integrity in various applications.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage enhances flexibility in power management for various applications.

Length: 15.75 mm

Compact length contributes to space-saving designs for effective PCB layouts.

Temperature Grade: MILITARY

This grade guarantees resistance to environmental stresses, making it suitable for defense and aerospace applications.

Total Dose (V): 300k Rad(Si)

High radiation tolerance makes it suitable for space and nuclear applications.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, ideal for modern electronic applications.

Terminal Form: FLAT

Flat terminals promote better thermal performance and ease of soldering.

Packing Method: TR

Taped and reeled packing facilitates efficient handling and automated assembly processes.

Terminal Pitch: 0.635 mm

This pitch provides a suitable distance for comfortable soldering while allowing for compact layouts.

Maximum Supply Voltage (Vsup): 6 V

The flexibility of operating up to 6 V enables it to be used in a broader range of applications.

Technical Specifications

Bus Driver & Transceivers RHRAC164245K03V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

9.65 mm

Trade Compliance

RHRAC164245K03V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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