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RHF1009AK02V

STMicroelectronics

RHF1009AK02V by STMicroelectronics

RHF1009AK02V from STMicroelectronics is a military-grade voltage reference with adjustable output ranging from 2.375 V to 2.625 V. It features a ceramic, metal-sealed flatpack design and operates b/w -55 °C and 125 °C. Ideal for precision applications requiring stable voltage references.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,317 parts In-Stock

1+ parts

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4,317

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Digiode

USA . 610 parts In-Stock

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610

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Anansix

USA . 246 parts In-Stock

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246

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,278 parts In-Stock

1+ parts

$2.871

100+ parts

-

1k+ parts

$2.584

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2,278

$2.871

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$2.584

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MKK Technologies

India . 577 parts In-Stock

1+ parts

$5.399

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577

$5.399

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DigiPath Technology Company

USA . 577 parts In-Stock

1+ parts

$5.399

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577

$5.399

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Parana Technologies

USA . 1,555 parts In-Stock

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$3.433

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1,555

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$3.433

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Corphita

USA . 1,508 parts In-Stock

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1,508

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Overview

Unlock precision and reliability with the RHF1009AK02V voltage reference from STMicroelectronics—an industry leader renowned for its commitment to quality and innovation. Designed for extreme conditions, this adaptable component ensures consistent performance across military applications and beyond. Its compact ceramic package and adjustable output offer flexibility, enhancing your designs while boosting efficiency. Elevate your projects with the trusted excellence of STMicroelectronics!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired construction ensures robustness, making it suitable for harsh environments.

Surface Mount: YES

Surface mount capabilities allow for easy integration into modern electronics, facilitating compact designs and automated assembly.

Trim or Adjustable Output (V): YES

The adjustable output feature provides flexibility to customize the voltage levels, accommodating various application requirements.

Package Shape: SQUARE

The square package shape makes it easier to fit into various layouts, optimizing space within the circuit board.

No. of Terminals: 10

A higher number of terminals may offer more connections for added functionalities or circuit configurations.

Package Style (Meter): FLATPACK

The flatpack style allows for a low-profile design, reducing height constraints in compact electronic devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this component is suitable for high-temperature applications in military and industrial settings.

Minimum Output Voltage: 2.375 V

The ability to achieve a minimum output voltage of 2.375 V provides versatility for applications requiring lower voltage references.

Minimum Operating Temperature: -55 °C

Operating down to -55 °C ensures reliable performance in extreme cold conditions, catering to military and aerospace applications.

Maximum Output Voltage: 2.625 V

The maximum output voltage of 2.625 V allows for adaptability in different voltage regulation scenarios.

Terminal Position: DUAL

The dual terminal position facilitates various connection configurations, enhancing design flexibility.

Maximum Seated Height: 2.62 mm

With a maximum seated height of only 2.62 mm, this component is ideal for low-profile applications.

Width: 6.48 mm

A width of 6.48 mm strikes a balance between compactness and adequate terminal spacing for reliable connections.

Other IC type: TWO TERMINAL VOLTAGE REFERENCE

As a two-terminal voltage reference, it provides simplified circuit integration compared to multi-terminal alternatives.

Length: 6.48 mm

The length of 6.48 mm allows for efficient usage of board space without compromising on electrical performance.

Temperature Grade: MILITARY

The military-grade specification guarantees enhanced reliability and performance in demanding applications.

Terminal Form: FLAT

Flat terminal form supports effective soldering and connection, ensuring stable electrical performance.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a good balance between compact design and ease of handling during assembly.

Max Voltage Temp Coef: 30 ppm/°C

With a maximum voltage temperature coefficient of 30 ppm/°C, it offers excellent voltage stability across temperature variations.

Nominal Output Voltage: 2.5 V

The nominal output voltage of 2.5 V is a common requirement for many digital and analog circuits, making it a versatile choice.

Technical Specifications

Voltage References RHF1009AK02V attributes and parameters. Explore more Voltage References devices from STMicroelectronics

Specs

JESD-30 Code:

S-CDFP-F10

Length:

6.48 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Voltage:

2.625 V

Minimum Output Voltage:

2.375 V

Nominal Output Voltage:

2.5 V

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.62 mm

Surface Mount:

YES

Max Voltage Temp Coef:

30 ppm/Cel

Temperature Grade:

Terminal Form:

FLAT

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

YES

Width (mm):

6.48 mm

Trade Compliance

RHF1009AK02V Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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