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PM6764TR

STMicroelectronics

PM6764TR by STMicroelectronics

PM6764TR by STMicroelectronics is a compact power management IC designed for efficient switching control. It features a very thin profile with 28 terminals, adjustable threshold, and measures just 4mm x 4mm. Ideal for space-constrained applications requiring reliable power management solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,338 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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8,338

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Chip Stock

USA . 5,000 parts In-Stock

1+ parts

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-

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5,000

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Anansix

USA . 1,568 parts In-Stock

1+ parts

-

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1,568

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Digiode

USA . 333 parts In-Stock

1+ parts

-

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333

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$7.085

100+ parts

-

1k+ parts

$6.376

10k+ parts

-

188

$7.085

-

$6.376

-

AZTECH Wire

Italy . 268 parts In-Stock

1+ parts

$11.390

100+ parts

-

1k+ parts

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10k+ parts

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268

$11.390

-

-

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MKK Technologies

India . 526 parts In-Stock

1+ parts

$13.323

100+ parts

-

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526

$13.323

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DigiPath Technology Company

USA . 526 parts In-Stock

1+ parts

$13.323

100+ parts

-

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526

$13.323

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-

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Microchip USA

USA . 2,144 parts In-Stock

1+ parts

$23.133

100+ parts

-

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2,144

$23.133

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Component Stockers USA

USA . 523 parts In-Stock

1+ parts

$99.990

100+ parts

-

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523

$99.990

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A-Z Elektronik GmbH

Germany . 6,735 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,735

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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4,500

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GreenTree Electronics

Israel . 4,500 parts In-Stock

1+ parts

-

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4,500

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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Corphita

USA . 1,070 parts In-Stock

1+ parts

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1,070

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Parana Technologies

USA . 443 parts In-Stock

1+ parts

-

100+ parts

$8.471

1k+ parts

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10k+ parts

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443

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$8.471

-

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Overview

Unlock superior performance with the PM6764TR from STMicroelectronics, a trusted leader in power management solutions. Designed for efficiency and versatility, this cutting-edge IC enhances system reliability while optimizing energy consumption. Its compact, slim profile makes it ideal for space-constrained applications, ensuring seamless integration into your designs. Experience the perfect blend of quality, innovation, and value—empowering your projects to achieve more!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easier integration into compact designs, improving board space efficiency.

Package Shape: SQUARE

The square package shape aids in simplified layout and better thermal performance in applications.

No. of Terminals: 28

With 28 terminals, this product provides flexibility in connectivity options for various applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier style and thin profile enhance thermal management and facilitate use in space-constrained environments.

Terminal Position: QUAD

The quad terminal position allows for efficient routing and reduces the complexity of PCB design.

Maximum Seated Height: 1 mm

The low seated height of 1 mm contributes to a slim profile, making it ideal for portable and compact devices.

Width (mm): 4 mm

With a width of only 4 mm, this component can fit into tight spaces, providing design flexibility.

Length: 4 mm

A compact length of 4 mm ensures minimal footprint, advantageous for high-density circuit boards.

Terminal Form: NO LEAD

The no lead design allows for enhanced thermal and electrical performance while enabling ultra-compact layouts.

Adjustable Threshold: YES

The adjustable threshold feature provides customization options for various applications, improving versatility in power management.

Technical Specifications

Power Management ICs PM6764TR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

Other IC type:

JESD-30 Code:

S-XQCC-N28

Length:

4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

PM6764TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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