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MTC20174-TQ-C1TR

STMicroelectronics

MTC20174-TQ-C1TR by STMicroelectronics

MTC20174-TQ-C1TR by STMicroelectronics is a surface mount IC designed for modem applications. It operates with a supply voltage of 4.75V to 5.25V and comes in a 100-TQFP package, making it ideal for compact designs. With a moisture sensitivity level of 3, it's suitable for various electronic devices.

Median Price

$13.500

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 5 parts In-Stock

1+ parts

$13.500

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$13.500

-

-

-

Digiode

USA . 4,862 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,862

-

-

-

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Vyrian

USA . 2,761 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,761

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-

-

-

Anansix

USA . 326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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326

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-

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Microfarads

USA . 5 parts In-Stock

1+ parts

-

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5

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 364 parts In-Stock

1+ parts

$14.944

100+ parts

-

1k+ parts

-

10k+ parts

-

364

$14.944

-

-

-

AZTECH Wire

Italy . 1,215 parts In-Stock

1+ parts

$17.720

100+ parts

-

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10k+ parts

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1,215

$17.720

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-

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A-Z Elektronik GmbH

Germany . 4,892 parts In-Stock

1+ parts

-

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4,892

-

-

-

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Corphita

USA . 3,671 parts In-Stock

1+ parts

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3,671

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MKK Technologies

India . 1,699 parts In-Stock

1+ parts

-

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1,699

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-

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DigiPath Technology Company

USA . 1,699 parts In-Stock

1+ parts

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1,699

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Parana Technologies

USA . 1,121 parts In-Stock

1+ parts

-

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1,121

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Futuretech Components

Singapore . 752 parts In-Stock

1+ parts

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752

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IDEA Electronic Components Group

UK . 704 parts In-Stock

1+ parts

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100+ parts

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704

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Perfect Parts

USA . 476 parts In-Stock

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476

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Overview

Unlock unparalleled connectivity with the MTC20174-TQ-C1TR from STMicroelectronics, a leader in innovative semiconductor solutions. Engineered for reliability and performance, this integrated circuit excels in modem applications, ensuring seamless data transmission in your devices. Enjoy the benefits of robust voltage support and surface mount convenience, making it the ideal choice for enhancing efficiency and reducing footprint in any project. Elevate your designs with STMicroelectronics’ trusted quality and innovation!

Feature Benefit Bullets

Standard Package: 450

A standard package size of 450 ensures compatibility with a wide range of applications, making this IC a versatile choice for engineers.

Category: Integrated Circuits (ICs) / Modems - ICs and Modules

Being categorized under Integrated Circuits and specifically as a modem IC, this product is tailored for reliable communication solutions.

Packaging: Tray

Tray packaging provides efficient handling and storage, minimizing damage during transport and making it easy to integrate into assembly lines.

Voltage - Supply: 4.75V ~ 5.25V

A wide supply voltage range allows for flexibility in numerous applications, accommodating various system voltage requirements.

Mounting Type: Surface Mount

Surface mount technology enables compact designs and efficient routing of PCB traces, ideal for modern electronic devices.

Package / Case: 100-TQFP

The 100-TQFP package type offers a good balance of performance and size, facilitating efficient thermal management and maximizing circuit density.

Supplier Device Package: 100-TQFP

With a consistent supplier device package, it's easier for manufacturers to source and maintain stock, ensuring production stability.

Base Product Number: MTC201

This specific product designation aids in easy identification and cross-referencing within product lines, enhancing supply chain management.

Moisture Sensitivity Level (MSL): 3 (168 Hours)

An MSL of 3 indicates a moderate level of sensitivity to moisture, allowing for reasonable handling times before necessary reflow soldering.

Technical Specifications

Additional Parts MTC20174-TQ-C1TR attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Category:

Integrated Circuits (ICs)
Interface Modems - ICs and Modules

Package / Case:

100-TQFP

Voltage - Supply:

4.75V ~ 5.25V

Packaging:

Tray

Mounting Type:

Surface Mount

Supplier Device Package:

100-TQFP

Standard Package:

450

Base Product Number:

MTC201

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

MTC20174-TQ-C1TR Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A991G

HTS

8542.39.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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