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M48T37Y-70MH1E

STMicroelectronics

M48T37Y-70MH1E by STMicroelectronics

M48T37Y-70MH1E by STMicroelectronics is a CMOS real-time clock with an 8-bit data bus and operates b/w 4.5V to 5.5V. It features interrupt capability and supports surface mount technology in a compact package. Ideal for timers in various electronic applications, it withstands temperatures up to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,743 parts In-Stock

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3,743

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Digiode

USA . 2,361 parts In-Stock

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2,361

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Anansix

USA . 982 parts In-Stock

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982

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Sogenti Electronics

Canada . 196 parts In-Stock

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R&J Components

USA . 168 parts In-Stock

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168

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Microchip USA

USA . 104 parts In-Stock

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$12.854

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104

$12.854

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IDEA Electronic Components Group

UK . 261 parts In-Stock

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$19.177

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$17.260

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261

$19.177

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$17.260

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AZTECH Wire

Italy . 925 parts In-Stock

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$19.930

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925

$19.930

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MKK Technologies

India . 1,785 parts In-Stock

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$36.062

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$36.062

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DigiPath Technology Company

USA . 1,785 parts In-Stock

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$36.062

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$36.062

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Corohmni

South Africa . 5,076 parts In-Stock

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$46.119

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Kepictronics

USA . 1,482 parts In-Stock

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Corphita

USA . 1,088 parts In-Stock

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Perfect Parts

USA . 535 parts In-Stock

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Parana Technologies

USA . 407 parts In-Stock

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$22.930

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Cyclops Electronics Ltd (Excess)

UK . 239 parts In-Stock

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Overview

Unlock precision time management with the M48T37Y-70MH1E from STMicroelectronics, a trusted leader in innovative solutions. This reliable real-time clock integrates seamlessly into various applications, ensuring your devices maintain accurate timing and synchronization. With exceptional build quality and advanced features, it empowers customers to enhance performance while reducing downtime and complexity. Choose M48T37Y-70MH1E for unmatched reliability and efficiency in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and protects the internal components, making it suitable for various applications.

Information Access Method: PARALLEL, DIRECT ADDRESS

Direct addressing allows for quicker access to data, improving overall processing speed and efficiency in applications.

Surface Mount: YES

The surface mount capability makes this product easy to integrate into modern compact circuit designs, saving space.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V offers flexibility in power supply options while ensuring safe operation.

Package Shape: RECTANGULAR

The rectangular shape allows for effective space utilization on PCBs, facilitating more compact and organized designs.

No. of Bits: 8

With an 8-bit architecture, this product can handle a substantial range of operations, suitable for various applications.

Power Supplies (V): 5

Designed to operate at a standard power supply of 5V, ensuring compatibility with most electronic systems.

No. of Terminals: 44

The 44 terminals provide ample connectivity options to accommodate multiple functions and peripherals.

Interrupt Capability: Y

Interrupt capability allows the timer to respond promptly to events, enabling more efficient and timely processing.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design optimize board space while maintaining robust performance.

Minimum Supply Voltage: 4.5 V

The ability to function effectively from a minimum supply of 4.5V increases design flexibility and power management.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in moderately harsh environments.

Minimum Operating Temperature: 0 °C

The product can operate from 0 °C, allowing it to function well in a variety of ambient conditions.

Terminal Position: DUAL

Dual terminal positioning enhances the flexibility of board layouts, providing ease of installation.

Maximum Seated Height: 3.05 mm

With a compact seated height, this product is suitable for space-constrained applications.

Width: 8.56 mm

The width of 8.56 mm contributes to the compact design, facilitating integration into various systems.

External Data Bus Width: 8

The 8-bit external data bus width supports efficient communication with other components in the system.

Maximum Clock Frequency: 0.032 MHz

The operational clock frequency meets the performance needs of many timing applications while ensuring energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 10

A maximum time of 10 seconds at peak reflow temperature demonstrates robust thermal tolerance during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C signifies its adaptability to standard soldering processes.

Length: 18.1 mm

At 18.1 mm long, this product fits well into compact electronic designs without compromising performance.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, ensuring reliability for standard consumer electronics.

Peripheral IC Type: TIMER, REAL TIME CLOCK

As a timer and real-time clock, this product is essential for applications requiring accurate timekeeping and event scheduling.

Technology: CMOS

The CMOS technology provides low power consumption, extending battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and are easy to solder, enhancing manufacturing efficiency.

Minimum Time: SECONDS

The ability to measure time in seconds makes this product versatile for a wide range of timing applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures robustness and compatibility with typical electronic systems.

Terminal Pitch: 0.81 mm

The terminal pitch of 0.81 mm allows for a denser layout on PCBs without compromising soldering quality.

Technical Specifications

Timers & Real-Time Clocks M48T37Y-70MH1E attributes and parameters. Explore more Timers & Real-Time Clocks devices from STMicroelectronics

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, DIRECT ADDRESS

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G44

Length:

18.1 mm

No. of Bits:

8

No. of Terminals:

44

No. of Timers:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.5,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.81 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

10

Volatile:

NO

Width:

8.56 mm

Peripheral IC Type:

Trade Compliance

M48T37Y-70MH1E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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