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M48T212V-85MH1E

STMicroelectronics

M48T212V-85MH1E by STMicroelectronics

M48T212V-85MH1E by STMicroelectronics is a CMOS real-time clock with a max supply voltage of 3.6V and operates in temperatures from 0 °C to 70 °C. It features parallel direct address access and interrupt capability, making it ideal for time-sensitive applications. This compact device comes in a small outline package with 44 terminals, ensuring efficient integration into various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,490 parts In-Stock

1+ parts

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8,490

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Digiode

USA . 3,582 parts In-Stock

1+ parts

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3,582

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Anansix

USA . 1,603 parts In-Stock

1+ parts

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1,603

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 402 parts In-Stock

1+ parts

$16.450

100+ parts

-

1k+ parts

-

10k+ parts

-

402

$16.450

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-

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Microchip USA

USA . 270 parts In-Stock

1+ parts

$35.516

100+ parts

-

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-

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-

270

$35.516

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-

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IDEA Electronic Components Group

UK . 456 parts In-Stock

1+ parts

$53.773

100+ parts

-

1k+ parts

$48.396

10k+ parts

-

456

$53.773

-

$48.396

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Corohmni

South Africa . 21 parts In-Stock

1+ parts

$84.696

100+ parts

-

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21

$84.696

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MKK Technologies

India . 2,080 parts In-Stock

1+ parts

$101.117

100+ parts

-

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2,080

$101.117

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DigiPath Technology Company

USA . 2,080 parts In-Stock

1+ parts

$101.117

100+ parts

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2,080

$101.117

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Corphita

USA . 3,049 parts In-Stock

1+ parts

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3,049

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Parana Technologies

USA . 2,337 parts In-Stock

1+ parts

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100+ parts

$64.294

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2,337

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$64.294

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Overview

Unlock precision timing with the M48T212V-85MH1E from STMicroelectronics, a leader in innovative semiconductor solutions. This robust real-time clock seamlessly integrates into various applications, ensuring unparalleled reliability and efficiency. With its compact design and low power consumption, it's perfect for consumer electronics, industrial automation, and IoT devices. Experience enhanced performance and long-lasting quality that only a trusted name like STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using durable plastic/epoxy materials ensures longevity and reliability, making this product suitable for various environments.

Information Access Method: PARALLEL, DIRECT ADDRESS

The parallel direct address method allows fast data retrieval and control, enhancing system performance and responsiveness.

Surface Mount: YES

Being surface mount compatible allows for compact designs and higher-density PCBs, optimizing space usage in electronic devices.

Maximum Supply Voltage: 3.6 V

The flexibility of operating up to 3.6 V makes this product versatile for various applications without risk of overvoltage.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized footprint, facilitating easy integration into PCB designs.

Power Supplies (V): 3.3

Operating at 3.3 V is ideal for modern low-power applications, ensuring energy efficiency and compatibility with other devices.

No. of Terminals: 44

A higher number of terminals allows for more connections and functionality, catering to complex applications.

Interrupt Capability: Y

The ability to handle interrupts enhances the product's performance in real-time applications, ensuring timely processing.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design provides a compact solution, ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

The minimum voltage requirement of 3 V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows the product to function reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

Starting from 0 °C ensures the product can be used in cold environments without performance degradation.

Terminal Position: DUAL

Dual terminal positioning helps in easier mounting and improved electrical performance in tight spaces.

Maximum Seated Height: 3.05 mm

A low seated height facilitates integration into low-profile device designs, ensuring aesthetic and space efficiency.

Width: 8.56 mm

A narrow width makes it suitable for miniaturized circuits without compromising functionality.

External Data Bus Width: 8

An 8-bit external data bus width supports easy integration with standard microcontrollers and processors.

Maximum Clock Frequency: 0.032 MHz

This frequency is suitable for most Timer and Real Time Clock applications, ensuring sufficient accuracy for timekeeping.

Maximum Time At Peak Reflow Temperature (s): 10

The tolerance to a maximum reflow time indicates robustness in manufacturing processes, ensuring quality and reliability.

Peak Reflow Temperature °C: 260

The ability to withstand high reflow temperatures ensures the product is suitable for modern soldering techniques.

Length: 18.1 mm

A manageable length contributes to the compact design, making it ideal for a variety of applications.

Temperature Grade: COMMERCIAL

A commercial temperature grade indicates suitability for general use, providing a balance between performance and cost.

Peripheral IC Type: TIMER, REAL TIME CLOCK

As a dedicated Timer and RTC peripheral, it meets specific requirements for timekeeping and scheduling tasks efficiently.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide a secure connection and ease of soldering, enhancing device reliability.

Minimum Time: SECONDS

The capability to handle time measurements in seconds is essential for precise timing applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V ensures compatibility with a wide range of power sources, facilitating integration.

Terminal Pitch: 0.81 mm

A terminal pitch of 0.81 mm allows for a compact footprint while maintaining ease of soldering and assembly.

Technical Specifications

Timers & Real-Time Clocks M48T212V-85MH1E attributes and parameters. Explore more Timers & Real-Time Clocks devices from STMicroelectronics

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, DIRECT ADDRESS

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G44

Length:

18.1 mm

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.5,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.81 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

10

Volatile:

NO

Width:

8.56 mm

Peripheral IC Type:

Trade Compliance

M48T212V-85MH1E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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