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M48T12-200PC1

STMicroelectronics

M48T12-200PC1 by STMicroelectronics

STMicroelectronics M48T12-200PC1 is a CMOS TIMER & REAL TIME CLOCK with 2040 RAM words, 8-bit data bus width, and 0.032 MHz clock frequency. It operates b/w 0 to 70 °C and uses parallel access method for applications requiring precise timekeeping in commercial-grade environments.

Median Price

$7.793

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 19 parts In-Stock

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$7.793

100+ parts

$8.182

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$7.715

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19

$7.793

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$7.715

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Vyrian

USA . 4,831 parts In-Stock

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Anansix

USA . 2,416 parts In-Stock

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Digiode

USA . 172 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 111 parts In-Stock

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R&J Components

USA . 68 parts In-Stock

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J2 Sourcing AB

Sweden . 31 parts In-Stock

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

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Whistler Technology

UK . 19 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 8 parts In-Stock

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Carlin Systems, Inc.

USA . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,055 parts In-Stock

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$19.550

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$19.550

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IDEA Electronic Components Group

UK . 98 parts In-Stock

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$29.051

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$26.146

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Corohmni

South Africa . 351 parts In-Stock

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$30.771

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Microchip USA

USA . 163 parts In-Stock

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$39.687

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MKK Technologies

India . 145 parts In-Stock

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$54.628

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DigiPath Technology Company

USA . 145 parts In-Stock

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$54.628

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145

$54.628

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Parana Technologies

USA . 509 parts In-Stock

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$34.735

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Corphita

USA . 212 parts In-Stock

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Assy Fe

Spain . 12 parts In-Stock

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Overview

Upgrade your projects with the STMicroelectronics M48T12-200PC1, a top-notch timer and real-time clock that offers unmatched quality and reliability. Designed by a trusted manufacturer, this product ensures precise timekeeping and data storage for a wide range of applications. With its advanced features and durable construction, the M48T12-200PC1 provides exceptional value and performance to customers looking for a dependable solution. Trust in STMicroelectronics to deliver excellence in timers and real-time clocks.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and ensures compatibility with a wide range of systems.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data storage and processing, enhancing the overall performance of the product.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient power consumption and can help extend battery life in portable devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures that the product can operate reliably even in harsh environmental conditions.

Peripheral IC Type: TIMER, REAL TIME CLOCK

The integration of both timer and real-time clock functions in one IC offers versatile functionality for various timing and scheduling applications.

Technical Specifications

Timers & Real-Time Clocks M48T12-200PC1 attributes and parameters. Explore more Timers & Real-Time Clocks devices from STMicroelectronics

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, DIRECT ADDRESS

Interrupt Capability:

N

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e3

Length:

34.545 mm

No. of Terminals:

24

No. of Timers:

0

On Chip Data RAM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2040

Maximum Seated Height:

9.65 mm

Sub-Category:

Timer or RTC

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Volatile:

NO

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

M48T12-200PC1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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