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M41T256YMT7F

STMicroelectronics

M41T256YMT7F by STMicroelectronics

M41T256YMT7F by STMicroelectronics is a CMOS real-time clock with I2C access, ideal for timekeeping in various applications. It operates b/w -25 °C to 70 °C and supports a supply voltage of 4.5V to 5.5V. Its compact design features 44 terminals in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,242 parts In-Stock

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Vyrian

USA . 2,148 parts In-Stock

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Anansix

USA . 2,146 parts In-Stock

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2,146

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AZTECH Wire

Italy . 1,050 parts In-Stock

1+ parts

$14.300

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-

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1,050

$14.300

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IDEA Electronic Components Group

UK . 555 parts In-Stock

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$20.694

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-

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$18.624

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555

$20.694

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$18.624

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Microchip USA

USA . 379 parts In-Stock

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$36.602

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379

$36.602

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MKK Technologies

India . 880 parts In-Stock

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$38.913

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880

$38.913

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DigiPath Technology Company

USA . 880 parts In-Stock

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$38.913

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880

$38.913

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Corohmni

South Africa . 635 parts In-Stock

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$47.080

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635

$47.080

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Component Stockers USA

USA . 610 parts In-Stock

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$99.990

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610

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 24,229 parts In-Stock

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Corphita

USA . 4,904 parts In-Stock

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Parana Technologies

USA . 1,125 parts In-Stock

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$24.742

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$24.742

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Overview

Unlock precise timekeeping and elevate your projects with the M41T256YMT7F from STMicroelectronics. Renowned for their innovation and reliability, STMicroelectronics offers this advanced real-time clock that seamlessly integrates with your designs via I2C. Enjoy enhanced performance in diverse applications—from consumer electronics to industrial automation—ensuring optimal efficiency and accuracy. Trust in a leader that delivers quality, helping you stay ahead in today’s fast-paced tech landscape!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it suitable for various applications.

Information Access Method: I2C

I2C communication allows easy integration with microcontrollers, simplifying design and reducing connections needed.

Surface Mount: YES

Surface mount technology enables compact designs and efficient use of PCB space, ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supplies.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout on PCB and better mechanical stability.

Power Supplies (V): 5

Operating at a standard 5 V supply is common in electronics, enhancing compatibility with existing systems.

No. of Terminals: 44

Having 44 terminals provides ample connection options for various functionalities, ensuring flexibility.

Interrupt Capability: N

While lacking interrupt capability, this simplifies design for applications where continuous operation is feasible.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline with shrink pitch contributes to high-density design, beneficial in space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation under varied supply conditions.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows use in environments with moderate heat, enhancing application range.

Minimum Operating Temperature: -25 °C

Its operational range down to -25 °C makes it suitable for cold weather application scenarios.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish improves reliability and longevity by preventing corrosion.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options in various designs.

Maximum Seated Height: 3.05 mm

This low seated height supports efficient use of vertical space on PCBs.

Width: 8.56 mm

A width of 8.56 mm allows for flexibility in design and integration into compact devices.

Maximum Clock Frequency: 0.032 MHz

A maximum clock frequency of 0.032 MHz is sufficient for most timing applications, ensuring low power consumption.

Length: 18.1 mm

The length is designed to optimize space usage in existing layouts.

Peripheral IC Type: TIMER, REAL TIME CLOCK

Combining timer and real-time clock functionality in one IC saves board space and costs.

Technology: CMOS

CMOS technology ensures lower power consumption and higher durability, suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve mechanical stability during use.

Minimum Time: 1/100 SECOND

The capability to measure time down to 1/100 of a second makes it highly precise for timing applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V assures stability and compatibility with standard electronics.

Terminal Pitch: 0.81 mm

A terminal pitch of 0.81 mm allows for denser layouts, making it easier to incorporate into compact designs.

Technical Specifications

Timers & Real-Time Clocks M41T256YMT7F attributes and parameters. Explore more Timers & Real-Time Clocks devices from STMicroelectronics

Specs

Maximum Clock Frequency:

.032 MHz

Information Access Method:

I2C

Interrupt Capability:

N

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3/e4

Length:

18.1 mm

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.5,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.81 mm

Terminal Position:

DUAL

Minimum Time:

1/100 SECOND

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Volatile:

NO

Width:

8.56 mm

Peripheral IC Type:

Trade Compliance

M41T256YMT7F Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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