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M41T256YMH7F

STMicroelectronics

M41T256YMH7F by STMicroelectronics

M41T256YMH7F by STMicroelectronics is a CMOS real-time clock with I2C access, operating b/w -25 °C to 70 °C. It features a supply voltage range of 4.5V to 5.5V and supports a max clock frequency of 0.032 MHz. Ideal for timers in compact electronic devices, it comes in a small outline package with 44 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,631 parts In-Stock

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Vyrian

USA . 2,474 parts In-Stock

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Anansix

USA . 2,410 parts In-Stock

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2,410

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AZTECH Wire

Italy . 796 parts In-Stock

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$19.900

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796

$19.900

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Microchip USA

USA . 381 parts In-Stock

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$46.610

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381

$46.610

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IDEA Electronic Components Group

UK . 940 parts In-Stock

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$47.650

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$42.885

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940

$47.650

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$42.885

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Corohmni

South Africa . 853 parts In-Stock

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$68.012

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853

$68.012

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MKK Technologies

India . 1,610 parts In-Stock

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$89.604

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$89.604

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DigiPath Technology Company

USA . 1,610 parts In-Stock

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$89.604

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$89.604

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Component Stockers USA

USA . 311 parts In-Stock

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$99.990

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Corphita

USA . 3,116 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 1,253 parts In-Stock

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$56.973

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$56.973

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Overview

Unlock precision timing with the M41T256YMH7F from STMicroelectronics, a leader in innovative electronics. This real-time clock ensures reliability and accuracy for your applications, whether in smart devices, industrial systems, or consumer electronics. With its compact design and I2C interface, it seamlessly integrates into various projects, providing exceptional performance at an unbeatable value. Choose STMicroelectronics for quality that elevates your technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability in various applications.

Information Access Method: I2C

The I2C communication interface simplifies integration with other devices in digital systems.

Surface Mount: YES

Surface mount capability allows for efficient, space-saving design on PCBs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for operating with standard voltages.

Package Shape: RECTANGULAR

The rectangular shape is optimized for diverse circuit board layouts and space requirements.

Power Supplies (V): 5

Operates provided with a standard voltage, ensuring compatibility with common power supplies.

No. of Terminals: 44

With 44 terminals, this chip offers extensive connectivity options for various peripherals.

Interrupt Capability: N

Absence of interrupt capability may simplify design use cases where simple timing functions are required.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch make it ideal for compact electronic devices.

Minimum Supply Voltage: 4.5 V

A wide operational voltage range allows for versatile usage in multiple applications.

Maximum Operating Temperature: 70 °C

The operational limit of 70 °C ensures performance stability in moderate environmental conditions.

Minimum Operating Temperature: -25 °C

This device is suitable for use in cooler environments, enhancing its application range.

Terminal Position: DUAL

The dual terminal position aids in flexible layout configurations and easier soldering.

Maximum Seated Height: 3.05 mm

A low seating height is advantageous for minimizing footprint in space-constrained designs.

Width: 8.56 mm

A compact width allows for integration into thin electronic devices without compromising performance.

Maximum Clock Frequency: 0.032 MHz

The clock frequency is suitable for low-power applications, extending device battery life.

Maximum Time At Peak Reflow Temperature (s): 10

Robust to standard reflow soldering processes, ensuring compatibility with modern manufacturing.

Peak Reflow Temperature (°C): 260

Can withstand high reflow temperatures, aiding in the soldering process during assembly.

Length: 18.1 mm

An optimal length allows for easy integration in small electronic devices and circuits.

Peripheral IC Type: TIMER, REAL TIME CLOCK

Specialized for timing applications, making it perfect for embedded systems requiring accurate timekeeping.

Technology: CMOS

CMOS technology provides high noise immunity and low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance mechanical stability.

Minimum Time: 1/100 SECOND

A precise timing capability allows for accurate timekeeping in various applications.

Nominal Supply Voltage: 5 V

Standard nominal voltage simplifies the power supply design and component selection.

Terminal Pitch: 0.81 mm

A terminal pitch of 0.81 mm ensures compatibility with closely designed circuit layouts.

Technical Specifications

Timers & Real-Time Clocks M41T256YMH7F attributes and parameters. Explore more Timers & Real-Time Clocks devices from STMicroelectronics

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

0

Information Access Method:

I2C

Interrupt Capability:

N

JESD-30 Code:

R-PDSO-G44

Length:

18.1 mm

No. of Terminals:

44

No. of Timers:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.5,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.81 mm

Terminal Position:

DUAL

Minimum Time:

1/100 SECOND

Maximum Time At Peak Reflow Temperature (s):

10

Volatile:

NO

Width:

8.56 mm

Peripheral IC Type:

Trade Compliance

M41T256YMH7F Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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