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M41T0DS6E

STMicroelectronics

M41T0DS6E by STMicroelectronics

M41T0DS6E by STMicroelectronics is a CMOS real-time clock with I2C access, operating b/w 2-5.5V. It features an industrial temp range of -40 °C to 85 °C and comes in a compact 3mm square package. Ideal for timers in various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,243 parts In-Stock

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6,243

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Digiode

USA . 1,733 parts In-Stock

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1,733

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Anansix

USA . 1,690 parts In-Stock

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1,690

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Distributors (Availability)

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AZTECH Wire

Italy . 111 parts In-Stock

1+ parts

$9.700

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-

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111

$9.700

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Microchip USA

USA . 197 parts In-Stock

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$16.810

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197

$16.810

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Corohmni

South Africa . 268 parts In-Stock

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$24.282

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268

$24.282

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IDEA Electronic Components Group

UK . 986 parts In-Stock

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$54.456

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$49.010

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986

$54.456

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$49.010

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Component Stockers USA

USA . 800 parts In-Stock

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$99.990

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800

$99.990

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MKK Technologies

India . 1,759 parts In-Stock

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$102.400

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1,759

$102.400

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DigiPath Technology Company

USA . 1,759 parts In-Stock

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$102.400

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$102.400

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Vigor

Singapore . 2,950 parts In-Stock

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Corphita

USA . 1,491 parts In-Stock

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1,491

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Parana Technologies

USA . 1,258 parts In-Stock

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$65.110

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$65.110

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Overview

Elevate your designs with the M41T0DS6E from STMicroelectronics, a trusted leader in innovative technology. This compact real-time clock ensures precise timekeeping in a wide array of applications, from consumer electronics to industrial automation. With its I2C interface and superior performance across temperatures, it guarantees reliability while optimizing power consumption. Choose the M41T0DS6E for enhanced functionality and quality that you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this timer suitable for a wide range of applications.

Information Access Method: I2C

The I2C interface allows easy integration with microcontrollers and other devices, simplifying communication in embedded systems.

Surface Mount: YES

Surface mount technology enables compact designs, allowing for efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V makes this clock versatile for various power supply options.

Package Shape: SQUARE

The square package shape contributes to uniformity in design and simplifies layout on printed circuit boards.

Power Supplies (V): 2.5/5

The range of supply voltages (2.5V to 5V) allows flexibility in different power environments.

No. of Terminals: 8

With 8 terminals, the device offers a broad setup for interfacing and connections while keeping design compact.

Interrupt Capability: N

The absence of interrupt capability simplifies the timer's operation, making it suitable for simple applications without complex requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this timer ideal for space-constrained applications.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2 V ensures that the timer can operate even in low-power scenarios.

Maximum Operating Temperature: 85 °C

With a high operating temperature of 85 °C, this product is suitable for industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The device's capability to function at -40 °C makes it suitable for harsh environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish ensures reliable electrical connections and improved longevity of the component.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options on the circuit board.

Maximum Seated Height: 1.1 mm

With a maximum seated height of only 1.1 mm, it contributes to a low-profile design for compact products.

Width: 3 mm

A narrow width of 3 mm allows for greater flexibility in placement, especially in crowded PCBs.

Maximum Clock Frequency: 0.032 MHz

A clock frequency of 0.032 MHz provides adequate timing resolution for most applications, while minimizing power consumption.

Maximum Time At Peak Reflow Temperature (s): 10

This specification allows for compatibility with automated soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

The ability to withstand high reflow temperatures ensures reliability when soldering to PCBs.

Length: 3 mm

The compact length improves layout efficiency in space-limited designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ratings, making it suitable for demanding environments.

Peripheral IC Type: TIMER, REAL TIME CLOCK

This timer can be utilized in a variety of applications, including scheduling and timekeeping in embedded systems.

Technology: CMOS

CMOS technology allows for low power consumption and high speed, crucial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and provide firm mechanical support.

Minimum Time: SECONDS

The capability to operate in seconds provides versatility for various timing applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V is standard in many devices, enabling compatibility with a wide range of systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm aids in minimizing board space while allowing for effective soldering.

Volatile: YES

Being volatile means the device uses less power during operation, making it an energy-efficient choice for real-time applications.

Technical Specifications

Timers & Real-Time Clocks M41T0DS6E attributes and parameters. Explore more Timers & Real-Time Clocks devices from STMicroelectronics

Specs

Maximum Clock Frequency:

.032 MHz

Information Access Method:

I2C

Interrupt Capability:

N

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

10

Volatile:

YES

Width:

3 mm

Peripheral IC Type:

Trade Compliance

M41T0DS6E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-615-7675, 5962016157675

NIIN

016157675

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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