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M41ST85WMH6E

STMicroelectronics

M41ST85WMH6E by STMicroelectronics

M41ST85WMH6E by STMicroelectronics is a CMOS real-time clock with I2C access, ideal for industrial applications. It operates b/w -40 °C to 85 °C and supports supply voltages of 2.7V to 3.6V. This compact device features interrupt capability and a max clock frequency of 32 kHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,931 parts In-Stock

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Anansix

USA . 2,260 parts In-Stock

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Digiode

USA . 1,292 parts In-Stock

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Semi Source

USA . 384 parts In-Stock

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Bristol Electronics

USA . 215 parts In-Stock

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Inventory MP

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PC Components Company LLC

USA . 155 parts In-Stock

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ComSIT Distribution GmbH

Germany . 118 parts In-Stock

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North Shore Components

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Sea View Technologies

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AZTECH Wire

Italy . 1,173 parts In-Stock

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$21.000

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Corohmni

South Africa . 1,900 parts In-Stock

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$62.222

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IDEA Electronic Components Group

UK . 1,632 parts In-Stock

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$62.678

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$56.410

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MKK Technologies

India . 165 parts In-Stock

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$117.861

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DigiPath Technology Company

USA . 165 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,239 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Corphita

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Parana Technologies

USA . 823 parts In-Stock

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Kepictronics

USA . 397 parts In-Stock

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Futuretech Components

Singapore . 397 parts In-Stock

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Perfect Parts

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Overview

Unlock precision timekeeping with the M41ST85WMH6E from STMicroelectronics—your go-to solution for reliable timers and real-time clock applications. Renowned for their innovation and quality, STMicroelectronics delivers a product that excels in industrial environments, offering exceptional temperature resilience and low power consumption. Enhance your designs with seamless I2C integration, ensuring accuracy and efficiency for everything from smart devices to automation systems. Experience unparalleled performance and peace of mind with this top-tier component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and suitable for a variety of applications.

Information Access Method: I2C

I2C access allows for efficient communication with microcontrollers and other devices, enhancing integration capabilities.

Surface Mount: YES

Surface mount technology enables compact designs and is ideal for automated assembly.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with common low-voltage systems, enhancing safety and reliability.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space usage on printed circuit boards (PCBs).

Power Supplies: 3/3.3 V

Support for both 3V and 3.3V supplies increases flexibility in system design.

No. of Terminals: 28

With 28 terminals, the product offers versatility in connectivity and function.

Interrupt Capability: Y

Interrupt capability allows for efficient event handling, making this product suitable for real-time applications.

Package Style: SMALL OUTLINE

The small outline package style is ideal for space-constrained applications while providing robust performance.

Minimum Supply Voltage: 2.7 V

A minimum supply voltage of 2.7V supports operation in low-power and battery-operated devices.

Maximum Operating Temperature: 85 °C

An operating temperature limit of 85 °C ensures reliable performance in higher-temperature environments.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes this product suitable for industrial applications in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and corrosion resistance, ensuring longevity in various applications.

Terminal Position: DUAL

Dual terminal positioning allows for greater layout flexibility in PCB designs.

Maximum Seated Height: 3.05 mm

The low seated height is advantageous for low-profile designs while maintaining performance.

Width: 8.56 mm

Standard width makes it compatible with various PCB layouts and designs.

Maximum Clock Frequency: 0.032 MHz

Low maximum clock frequency indicates low power consumption, suitable for battery-operated devices.

Length: 18.1 mm

A length of 18.1 mm ensures a compact footprint for various applications.

Temperature Grade: INDUSTRIAL

Industrial grade ensures reliability and consistency in demanding conditions.

Peripheral IC Type: TIMER, REAL TIME CLOCK

Designed as a timer and real-time clock, this IC is essential for timekeeping applications in embedded systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering on PCBs.

Minimum Time: 1/100 SECOND

The ability to measure down to 1/100 second supports precise timing applications.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V aligns well with standard battery options, enhancing deployment options.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch supports standard PCB design practices, making this IC easy to integrate.

Technical Specifications

Timers & Real-Time Clocks M41ST85WMH6E attributes and parameters. Explore more Timers & Real-Time Clocks devices from STMicroelectronics

Specs

Maximum Clock Frequency:

.032 MHz

Information Access Method:

I2C

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

18.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

No. of Timers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Minimum Time:

1/100 SECOND

Volatile:

NO

Width:

8.56 mm

Peripheral IC Type:

Trade Compliance

M41ST85WMH6E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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