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M24256-BHRMN6P

STMicroelectronics

M24256-BHRMN6P by STMicroelectronics

M24256-BHRMN6P by STMicroelectronics is a 32Kx8 EEPROM with a synchronous operating mode and I2C interface. It operates b/w 1.8V to 5.5V, supports up to 1 MHz clock frequency, and features hardware write protection. Ideal for industrial applications requiring reliable data retention from -40 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,726 parts In-Stock

1+ parts

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4,726

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Vyrian

USA . 2,822 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,822

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Anansix

USA . 2,249 parts In-Stock

1+ parts

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2,249

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 803 parts In-Stock

1+ parts

$4.989

100+ parts

-

1k+ parts

$4.490

10k+ parts

-

803

$4.989

-

$4.490

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MKK Technologies

India . 263 parts In-Stock

1+ parts

$9.382

100+ parts

-

1k+ parts

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10k+ parts

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263

$9.382

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DigiPath Technology Company

USA . 263 parts In-Stock

1+ parts

$9.382

100+ parts

-

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263

$9.382

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AZTECH Wire

Italy . 1,119 parts In-Stock

1+ parts

$21.090

100+ parts

-

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1,119

$21.090

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Microchip USA

USA . 163 parts In-Stock

1+ parts

$82.025

100+ parts

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163

$82.025

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Component Stockers USA

USA . 715 parts In-Stock

1+ parts

$99.990

100+ parts

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715

$99.990

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Corphita

USA . 2,785 parts In-Stock

1+ parts

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100+ parts

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2,785

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Parana Technologies

USA . 1,497 parts In-Stock

1+ parts

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100+ parts

$5.965

1k+ parts

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1,497

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$5.965

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Overview

Unlock endless possibilities with the M24256-BHRMN6P EEPROM from STMicroelectronics, a leader in innovation and reliability. Engineered for optimal performance, this compact, durable memory solution offers unparalleled data retention and endurance, making it ideal for industrial applications, automotive systems, and consumer electronics. Benefit from its efficient operation, robust write protection, and flexible power supply options—perfect for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this EEPROM durable and lightweight, suitable for various applications.

Surface Mount: YES

Being surface mount allows for easier integration onto PCB, saving space and improving reliability.

Package Shape: RECTANGULAR

The rectangular shape enables easier placement on circuit boards and better space utilization.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster data transfer rates, which is critical for high-speed applications.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5V is ideal for low-power applications, reducing energy consumption.

Power Supplies (V): 2/5

Supports a range of supply voltages, providing flexibility for various circuit designs.

No. of Terminals: 8

With 8 terminals, this device offers a compact and efficient interface while maintaining functionality.

Package Style (Meter): SMALL OUTLINE

Small outline packaging ensures a compact footprint, perfect for space-constrained devices.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, making it suitable for industrial applications.

Organization: 32KX8

The 32Kx8 organization allows for efficient data handling and storage, suitable for various applications.

Minimum Operating Temperature: -40 °C

This EEPROM functions well in low-temperature environments, ideal for outdoor or harsh conditions.

I2C Control Byte: 1010DDDR

Utilizes the I2C control byte for efficient communication, simplifying design and integration processes.

Terminal Position: DUAL

Dual terminal positioning facilitates easier soldering and assembly on PCBs.

Write Protection: HARDWARE

Hardware write protection enhances data integrity and security, safeguarding against accidental overwrites.

Maximum Seated Height: 1.75 mm

A low profile height allows for compact designs, fitting easily in space-limited applications.

Maximum Clock Frequency (fCLK): 1 MHz

A maximum clock frequency of 1 MHz supports efficient data transmission rates, optimizing performance.

Width: 3.9 mm

Compact width allows for dense layout on PCBs, contributing to reduced overall device size.

Minimum Supply Voltage (Vsup): 1.8 V

Supporting a minimum supply voltage of 1.8V enhances compatibility with modern low-power designs.

Length: 4.9 mm

Short length helps achieve a small form factor, ideal for portable or miniaturized devices.

Temperature Grade: INDUSTRIAL

Industrial-grade components guarantee reliability and performance in demanding environments.

Technology: CMOS

CMOS technology enables low power consumption, making it suitable for battery-operated devices.

Parallel or Serial: SERIAL

Serial communication simplifies wiring and connectivity, especially in complex systems.

Terminal Form: GULL WING

Gull wing leads provide enhanced soldering reliability and strength for secure connections.

Maximum Supply Current: 5 mA

A maximum supply current of 5 mA allows for energy-efficient designs, extending battery life.

No. of Words: 32768 words

A capacity of 32768 words offers ample memory for many applications, ensuring versatility.

Memory Width: 8

An 8-bit memory width allows for efficient data handling, fitting well in various data processing tasks.

Minimum Data Retention Time: 40

Data retention of 40 years ensures that stored information remains intact, providing long-term reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for tighter packing on PCBs without compromising performance.

No. of Words Code: 32K

A 32K word code is ideal for a variety of applications requiring moderate data storage.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a maximum supply voltage of 5.5V enables operation in more robust electronic environments.

Endurance: 1000000 Write/Erase Cycles

High endurance rating makes this EEPROM suitable for applications requiring frequent data updates.

Serial Bus Type: I2C

I2C bus type simplifies multi-device communication, reducing design complexity and cost.

Maximum Write Cycle Time (tWC): 5 ms

A write cycle time of 5 ms ensures rapid data writing capabilities, enhancing overall system responsiveness.

Memory Density: 262144 bit

A density of 262144 bits provides substantial storage capacity, catering to diverse application needs.

Memory IC Type: EEPROM

As an EEPROM, this product supports non-volatile data storage, retaining information without power.

Maximum Standby Current: 0.000002 Amp

Extremely low standby current contributes to energy efficiency, making it perfect for battery-operated projects.

Technical Specifications

EEPROM M24256-BHRMN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24256-BHRMN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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