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LNBP9K7-R

STMicroelectronics

LNBP9K7-R by STMicroelectronics

LNBP9K7-R by STMicroelectronics is a compact switching regulator designed for automotive applications, operating b/w -40 °C to 125 °C. It supports input voltages from 15V to 25V and delivers up to 0.8A output current. Its small outline package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,523 parts In-Stock

1+ parts

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4,523

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Digiode

USA . 3,056 parts In-Stock

1+ parts

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-

1k+ parts

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3,056

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Anansix

USA . 106 parts In-Stock

1+ parts

-

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106

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 26 parts In-Stock

1+ parts

$6.363

100+ parts

-

1k+ parts

$5.726

10k+ parts

-

26

$6.363

-

$5.726

-

Microchip USA

USA . 452 parts In-Stock

1+ parts

$6.882

100+ parts

-

1k+ parts

-

10k+ parts

-

452

$6.882

-

-

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AZTECH Wire

Italy . 589 parts In-Stock

1+ parts

$8.340

100+ parts

-

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589

$8.340

-

-

-

MKK Technologies

India . 314 parts In-Stock

1+ parts

$11.965

100+ parts

-

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314

$11.965

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DigiPath Technology Company

USA . 314 parts In-Stock

1+ parts

$11.965

100+ parts

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314

$11.965

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QUARKTWIN TECHNOLOGY LTD

USA . 28,652 parts In-Stock

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28,652

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Vigor

Singapore . 10,000 parts In-Stock

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10,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 3,377 parts In-Stock

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3,377

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Metaverse IC Inc.

Canada . 1,044 parts In-Stock

1+ parts

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1,044

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Parana Technologies

USA . 569 parts In-Stock

1+ parts

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100+ parts

$7.608

1k+ parts

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569

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$7.608

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Overview

Elevate your designs with the LNBP9K7-R from STMicroelectronics, a leader in innovative semiconductor solutions. Engineered for reliability, this automotive-grade switching regulator ensures optimal performance in demanding environments. With its compact footprint and robust temperature range, it seamlessly integrates into various applications, delivering efficient power management. Trust in STMicroelectronics for quality and performance that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on printed circuit boards, ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes the layout on PCB, enhancing organization and deployment in circuit assemblies.

Power Supplies (V): 16, 22

Supported voltage options provide flexibility in design, accommodating various power supply requirements.

No. of Terminals: 7

The 7 terminal design allows for versatile connections, facilitating complex circuit integrations.

Package Style (Meter): SMALL OUTLINE

Small outline packaging contributes to a compact footprint, making it suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures reliability in demanding environments, including automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold conditions makes it a reliable choice for outdoor and harsh environments.

Terminal Finish: TIN

The tin terminal finish improves solderability, enhancing connection reliability during assembly.

Terminal Position: SINGLE

Single terminal position simplifies the design and layout of connections, allowing for easier troubleshooting.

Maximum Seated Height: 2.03 mm

A low maximum seated height ensures compatibility with low-profile designs, essential for modern compact electronics.

Width: 8 mm

The uniform width allows for consistency in design and layout across multiple components on the PCB.

Other IC type: SWITCHING REGULATOR

As a switching regulator, it efficiently converts power, resulting in less wasted energy and heat production.

Nominal Input Voltage: 16 V

The nominal input voltage aligns with common power supply voltages, facilitating integration into standard systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures the component can withstand modern soldering processes without damage.

Length: 9.395 mm

The specific length is designed for optimal fit in standard PCB layouts, ensuring a balanced component design.

Temperature Grade: AUTOMOTIVE

Designed with automotive applications in mind, ensuring high reliability and performance in vehicles.

Maximum Output Current: 0.8 A

With a robust output current capability, it can effectively power various loads, enhancing its applicability.

Terminal Form: GULL WING

Gull wing terminals provide a stable mounting structure that enhances durability and performance on PCB.

Switcher Config: SINGLE

A single switcher configuration simplifies design and implementation, making it easier to manage and control power.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with common placement tools and techniques, streamlining assembly.

Minimum Input Voltage: 15 V

The minimum input voltage ensures operation is feasible for many standard power sources in varying applications.

Maximum Input Voltage: 25 V

The maximum input voltage capability allows for a wider range of power supply options and increased system flexibility.

Technical Specifications

Switching Regulators & Controllers LNBP9K7-R attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Maximum Input Voltage:

25 V

Minimum Input Voltage:

15 V

Nominal Input Voltage:

16 V

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Length:

9.395 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP7H,.4,50TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

16,22

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Power Management Circuits

Surface Mount:

YES

Switcher Config:

SINGLE

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Width (mm):

8 mm

Trade Compliance

LNBP9K7-R Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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