Loading...

LM224WDT

STMicroelectronics

LM224WDT by STMicroelectronics

LM224WDT by STMicroelectronics is a micropower operational amplifier featuring a max input offset voltage of 5000 µV, a common mode reject ratio of 80 dB, and operates within -40 °C to 105 °C. Ideal for industrial applications, it supports supply voltages from ±1.5V to ±15V. Its compact design and surface mount capability make it suitable for space-constrained environments.

Median Price

$0.405

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,487 parts In-Stock

1+ parts

-

100+ parts

$0.158

1k+ parts

$0.131

10k+ parts

$0.117

5,487

-

$0.158

$0.131

$0.117

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.405

1k+ parts

$0.338

10k+ parts

$0.316

2,500

-

$0.405

$0.338

$0.316

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.424

10k+ parts

$0.402

2,500

-

-

$0.424

$0.402

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,446 parts In-Stock

1+ parts

$0.357

100+ parts

-

1k+ parts

-

10k+ parts

-

2,446

$0.357

-

-

-

Chip Stock

USA . 29,037 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,037

-

-

-

-

Vyrian

USA . 7,073 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,073

-

-

-

-

Anansix

USA . 2,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,398

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,764 parts In-Stock

1+ parts

$0.338

100+ parts

-

1k+ parts

-

10k+ parts

-

4,764

$0.338

-

-

-

Microchip USA

USA . 4,988 parts In-Stock

1+ parts

$2.370

100+ parts

-

1k+ parts

-

10k+ parts

-

4,988

$2.370

-

-

-

IDEA Electronic Components Group

UK . 1,044 parts In-Stock

1+ parts

$5.734

100+ parts

-

1k+ parts

$5.161

10k+ parts

-

1,044

$5.734

-

$5.161

-

AZTECH Wire

Italy . 1,060 parts In-Stock

1+ parts

$8.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1,060

$8.640

-

-

-

MKK Technologies

India . 2,053 parts In-Stock

1+ parts

$10.783

100+ parts

-

1k+ parts

-

10k+ parts

-

2,053

$10.783

-

-

-

DigiPath Technology Company

USA . 2,053 parts In-Stock

1+ parts

$10.783

100+ parts

-

1k+ parts

-

10k+ parts

-

2,053

$10.783

-

-

-

Lixinc

USA . 14,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,300

-

-

-

-

Kepictronics

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,500

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,945

-

-

-

-

Alle Elektronik GmbH

Germany . 4,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,630

-

-

-

-

Parana Technologies

USA . 161 parts In-Stock

1+ parts

-

100+ parts

$6.856

1k+ parts

-

10k+ parts

-

161

-

$6.856

-

-

Overview

Elevate your designs with the LM224WDT from STMicroelectronics—a premier operational amplifier that guarantees exceptional performance and reliability. Designed for a variety of applications, this robust component ensures precision in signal processing while minimizing power consumption. With STMicroelectronics' renowned quality and commitment to innovation, the LM224WDT delivers unmatched value, empowering you to create cutting-edge solutions that stand out in any industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making this Op Amp suitable for various applications.

Maximum Input Offset Voltage: 5000 uV

A low input offset voltage enhances accuracy in signal processing, which is critical in precision applications.

Maximum Average Bias Current (IIB): 0.2 uA

This low bias current minimizes power consumption and enhances battery life in portable devices.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automated assembly in modern circuit boards.

No. of Functions: 4

Having multiple functions increases versatility, making it suitable for complex circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape is common in designs, facilitating easier layout on PCBs.

Nominal Common Mode Reject Ratio: 80 dB

A high common mode rejection ratio implies effective noise suppression, improving performance in noisy environments.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage simplifies integration with common digital systems.

Power Supplies (V): 3/30/±1.5/±15

Wide power supply range enhances versatility, enabling use in various applications from low-power to high-performance circuits.

No. of Terminals: 14

A 14-terminal configuration allows for more complex designs and a variety of functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package enables high-density circuit designs, saving space on the PCB.

Maximum Supply Voltage Limit: 32 V

High supply voltage tolerance increases application range, allowing it to be used in more demanding environments.

Maximum Operating Temperature: 105 °C

Able to function at high temperatures, this Op Amp is suitable for industrial applications and harsh environments.

Maximum Bias Current (IIB) @25 °C: 0.1 uA

Very low bias current aids in reducing overall noise, making it ideal for sensitive applications.

Frequency Compensation: YES

Integrated frequency compensation promotes stable operation across a range of frequencies, ensuring reliable performance.

Minimum Voltage Gain: 25000

High voltage gain makes it effective for amplifying weak signals in sensor applications.

Minimum Operating Temperature: -40 °C

Withstand extreme low temperatures, making it suitable for automotive and outdoor applications.

Terminal Finish: MATTE TIN

A matte tin finish improves solderability and reliability of electrical connections.

Terminal Position: DUAL

Dual terminal positioning enhances connection flexibility in circuit designs.

Maximum Seated Height: 1.75 mm

A low profile allows for compact designs, which is crucial in space-constrained applications.

Width: 3.9 mm

Compact width allows for higher-density layouts, supporting modern miniaturized designs.

Micropower: YES

Micropower capability enables energy-efficient designs, making it perfect for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with modern reflow soldering processes, facilitating easier manufacturing.

Peak Reflow Temperature (°C): 260

High temperature tolerance during reflow ensures reliability and durability in solder joints.

Length: 8.65 mm

A compact length helps in optimizing board space while ensuring effective signal processing.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures performance in a variety of challenging environments.

Maximum Negative Supply Voltage Limit: 0 V

This specification aids in simplifying design requirements, as the Op Amp can operate with a single-supply setup.

Nominal Negative Supply Voltage (Vsup): 0 V

Operating with a nominal negative supply contributes to design flexibility for various applications.

Nominal Unity Gain Bandwidth: 1300 kHz

A high unity gain bandwidth allows this Op Amp to be applied in high-frequency signal applications.

Technology: BIPOLAR

Bipolar technology provides better performance characteristics in terms of speed and gain compared to other technologies.

Terminal Form: GULL WING

The gull wing terminal form enhances surface mount performance and provides reliable connections.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it offers versatility in a wide range of analog applications.

Maximum Supply Current: 3 mA

Low supply current helps in energy conservation, making it suitable for battery-powered and portable devices.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture allows for excellent stability and a wide range of applications.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated handling and is ideal for high-volume production.

Nominal Slow Rate: 0.4 V/us

Slow rate aids in reducing overshoot and ringing, improving signal integrity in fast-switching applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows compatibility with common PCB designs and makes assembly straightforward.

Technical Specifications

Operational Amplifiers (Op Amps) LM224WDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

3/30/±1.5/±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

1.3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

25000

Nominal Slew Rate:

0.4 V/us

Peak Bias Current:

200 nA

Maximum Bias Current (IIB) @25 °C:

100 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

32 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

3 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

LM224WDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 21