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LE40ABZ-APLE

STMicroelectronics

LE40ABZ-APLE by STMicroelectronics

STMicroelectronics LE40ABZ-APLE is a fixed positive single output LDO regulator with 3 terminals. It offers a max output current of 0.1A and a dropout voltage of 0.5V, making it ideal for applications requiring stable voltage regulation in the temperature range of -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,290 parts In-Stock

1+ parts

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1,290

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Digiode

USA . 459 parts In-Stock

1+ parts

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459

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Anansix

USA . 366 parts In-Stock

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366

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 158 parts In-Stock

1+ parts

$4.856

100+ parts

-

1k+ parts

$4.370

10k+ parts

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158

$4.856

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$4.370

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MKK Technologies

India . 1,751 parts In-Stock

1+ parts

$9.131

100+ parts

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1,751

$9.131

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DigiPath Technology Company

USA . 1,751 parts In-Stock

1+ parts

$9.131

100+ parts

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1,751

$9.131

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Parana Technologies

USA . 2,310 parts In-Stock

1+ parts

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100+ parts

$5.806

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2,310

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$5.806

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Corphita

USA . 1,385 parts In-Stock

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1,385

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Overview

Discover the reliable LE40ABZ-APLE fixed regulator by STMicroelectronics, offering exceptional quality and performance in a compact design. Manufactured by a trusted industry leader, this LDO regulator is ideal for a wide range of applications, providing stable output voltage with minimal dropout. With a package style that ensures easy installation and a maximum input voltage of 18V, this product offers customers unmatched value and efficiency. Trust STMicroelectronics to deliver superior solutions for your power management needs.

Feature Benefit Bullets

Maximum Dropout Voltage-1: 1.5 V

Low dropout voltage ensures efficient power conversion and minimal power loss, making this regulator suitable for applications with tight power supply margins.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Package Shape: ROUND

Round package shape provides easy mounting and integration into circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure and stable connections on circuit boards.

Operating Temperature (TJ-Min): -40 °C

Low operating temperature ensures the regulator can function even in extreme cold conditions.

Minimum Output Voltage-1: 3.92 V

Stable minimum output voltage ensures a consistent power supply to connected devices.

Maximum Voltage Tolerance: 2 %

Tight voltage tolerance ensures precise output regulation, critical for sensitive electronic components.

Nominal Output Voltage-1: 4 V

Stable nominal output voltage provides a reliable power source for various applications.

No. of Terminals: 3

Minimal number of terminals simplifies the installation and connection process.

Package Style (Meter): CYLINDRICAL

Cylindrical package style offers efficient space utilization and easy integration in compact designs.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Fixed positive single output LDO regulator provides stable and regulated output voltage for precision applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection on PCBs.

Maximum Output Voltage-1: 4.08 V

High maximum output voltage allows flexibility in powering different components within the specified voltage range.

Minimum Input Voltage: 4.7 V

Low minimum input voltage enables the regulator to operate effectively even with low input power sources.

Maximum Output Current-1: 0.1 A

Sufficient maximum output current capability for powering low-power devices and circuits.

Maximum Input Voltage: 18 V

High maximum input voltage tolerance allows the regulator to handle a wide range of input power sources.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LE40ABZ-APLE attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Maximum Dropout Voltage-1:

.5 V

Maximum Input Voltage:

18 V

Minimum Input Voltage:

4.7 V

JESD-30 Code:

O-XBCY-T3

No. of Functions:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

4.08 V

Minimum Output Voltage-1:

3.92 V

Nominal Output Voltage-1:

4 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Surface Mount:

NO

Terminal Form:

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

2 %

Trade Compliance

LE40ABZ-APLE Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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