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LE30CZ-AP

STMicroelectronics

LE30CZ-AP by STMicroelectronics

LE30CZ-AP by STMicroelectronics is a fixed positive LDO regulator with a nominal output of 3V and a max load current of 0.1A. It operates b/w -40 °C to 125 °C, featuring a low dropout voltage of 0.2V. Ideal for compact electronic applications requiring stable voltage regulation.

Median Price

$0.491

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,057 parts In-Stock

1+ parts

-

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4,057

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IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

-

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-

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$0.491

2,000

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-

$0.491

Vyrian

USA . 1,831 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,831

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Anansix

USA . 502 parts In-Stock

1+ parts

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502

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 220 parts In-Stock

1+ parts

$8.055

100+ parts

-

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-

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-

220

$8.055

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IDEA Electronic Components Group

UK . 2,092 parts In-Stock

1+ parts

$8.078

100+ parts

-

1k+ parts

$7.270

10k+ parts

-

2,092

$8.078

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$7.270

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MKK Technologies

India . 1,589 parts In-Stock

1+ parts

$15.189

100+ parts

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1,589

$15.189

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DigiPath Technology Company

USA . 1,589 parts In-Stock

1+ parts

$15.189

100+ parts

-

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1,589

$15.189

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-

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Component Stockers USA

USA . 534 parts In-Stock

1+ parts

$99.990

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534

$99.990

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Corphita

USA . 4,187 parts In-Stock

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4,187

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Vigor

Singapore . 2,522 parts In-Stock

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2,522

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Parana Technologies

USA . 2,179 parts In-Stock

1+ parts

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100+ parts

$9.658

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2,179

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$9.658

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Overview

Elevate your designs with the LE30CZ-AP from STMicroelectronics, a trusted leader in semiconductor innovation. This robust positive LDO regulator ensures reliable performance across diverse applications, from consumer electronics to industrial systems. With its superior voltage stability and wide operating temperature range, it delivers exceptional efficiency while minimizing power loss. Choose the LE30CZ-AP for quality you can trust and peace of mind in every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body provides excellent protection and reliability in various operating environments.

Maximum Dropout Voltage: 1.5 V

A low dropout voltage helps maintain higher efficiency even when the input is close to the output voltage, ensuring consistent performance.

Operating Temperature (TJ-Max): 125 °C

The high maximum operating temperature enables reliability and stability in demanding applications.

Technology: BIPOLAR

Bipolar technology allows for efficient performance, providing good noise characteristics and stability in regulation.

Package Shape: ROUND

The round package shape is optimized for space-saving applications and enhances thermal dissipation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust connections suitable for high-stress environments, ensuring durability.

Operating Temperature (TJ-Min): -40 °C

The wide operating temperature range makes this LDO suitable for harsh environments and varied applications.

Packing Method: AMMO PACK

The ammo pack allows for convenient storage and handling, making it easier for manufacturers to automate assembly.

Minimum Output Voltage: 2.88 V

This minimum output voltage ensures compatibility with various low-voltage applications.

Maximum Voltage Tolerance: 4%

A maximum voltage tolerance of 4% provides assurance in voltage regulation under fluctuating input conditions.

Nominal Output Voltage: 3 V

A fixed nominal output of 3V is ideal for powering a wide range of low-power devices.

No. of Terminals: 3

The 3-terminal configuration simplifies design and integrates easily into existing circuit layouts.

Package Style (Meter): CYLINDRICAL

The cylindrical package style is efficient for compact designs and allows for better airflow around the component.

Adjustability: FIXED

A fixed output voltage minimizes design complexity, streamlining the implementation process in various circuits.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for many PCB layouts, facilitating ease of assembly.

Maximum Line Regulation: 0.02%

Excellent line regulation minimizes output voltage variation regardless of input changes, assuring stable performance.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

This fixed positive single output design is ideally suited for applications requiring reliable voltage regulation.

Terminal Finish: TIN

The tin terminal finish enhances solderability and corrosion resistance, ensuring longevity in end applications.

Terminal Position: BOTTOM

Bottom terminal positioning offers efficient soldering and can reduce the overall height of the assembly.

Maximum Output Voltage: 3.12 V

With a maximum output voltage of 3.12 V, it can safely power devices that require a slight overhead.

Maximum Load Regulation: 0.025%

Outstanding load regulation guarantees minimal voltage drops during load changes, enhancing performance reliability.

Minimum Input Voltage: 3.7 V

The minimum input voltage allows for versatile use in a range of supply systems, while still ensuring effective regulation.

Maximum Output Current: 0.1 A

A maximum output current of 0.1 A makes this regulator suitable for low-power applications.

Nominal Dropout Voltage: 0.2 V

A low nominal dropout voltage means efficient performance while maintaining output stability across a range of inputs.

Maximum Input Voltage: 18 V

The maximum input voltage of 18 V allows for flexibility in choosing power supplies and systems.

Maximum Input Voltage Absolute: 20 V

This absolute maximum rating provides headroom for transients and ensures protection against supply spikes.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LE30CZ-AP attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.2 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

18 V

Minimum Input Voltage:

3.7 V

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

Maximum Line Regulation:

.02 %

Maximum Load Regulation:

.025 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

3.12 V

Minimum Output Voltage-1:

2.88 V

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Packing Method:

AMMO PACK

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

4 %

Trade Compliance

LE30CZ-AP Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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