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LDS3985M26R

STMicroelectronics

LDS3985M26R by STMicroelectronics

LDS3985M26R by STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 2.6 V and a max output current of 0.3 A. It operates efficiently in temperatures from -40 °C to 125 °C, featuring a low dropout voltage of just 0.15 V. Ideal for compact applications, it comes in a small outline package with gull-wing terminals for easy surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,197 parts In-Stock

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1,197

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Digiode

USA . 1,054 parts In-Stock

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1,054

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Vyrian

USA . 489 parts In-Stock

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489

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,786 parts In-Stock

1+ parts

$6.688

100+ parts

-

1k+ parts

$6.020

10k+ parts

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1,786

$6.688

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$6.020

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MKK Technologies

India . 1,314 parts In-Stock

1+ parts

$12.577

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1,314

$12.577

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DigiPath Technology Company

USA . 1,314 parts In-Stock

1+ parts

$12.577

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1,314

$12.577

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Kepictronics

USA . 33,216 parts In-Stock

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33,216

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Corphita

USA . 4,045 parts In-Stock

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4,045

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Parana Technologies

USA . 209 parts In-Stock

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$7.997

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209

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$7.997

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Overview

Elevate your designs with the LDS3985M26R from STMicroelectronics, a trusted leader in innovative technology. This fixed positive LDO regulator combines exceptional performance and reliability, ensuring stable voltage output even under challenging conditions. With its compact size and advanced BICMOS technology, it seamlessly integrates into a variety of applications, from consumer electronics to automotive systems. Enjoy peace of mind knowing you're backed by ST's commitment to quality, driving your projects to success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and longevity in various applications.

Maximum Dropout Voltage: 1.25 V

A low dropout voltage ensures efficient operation, minimizing power loss and heat generation.

Surface Mount: YES

Surface mount technology allows for space-saving designs and simplifies the assembly process.

Operating Temperature (TJ-Max): 125 °C

A high maximum operating temperature makes this regulator suitable for demanding environments.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS processes for enhanced performance.

Package Shape: RECTANGULAR

The rectangular shape optimizes PCB layout and supports high-density designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical strength.

Operating Temperature (TJ-Min): -40 °C

The wide temperature range ensures reliable operation in harsh conditions.

Packing Method: TR

This method ensures secure packing and protection during transportation.

Minimum Output Voltage: 2.522 V

A versatile minimum output voltage accommodates a variety of applications.

Maximum Voltage Tolerance: 3 %

A low voltage tolerance enables precise regulation, enhancing system stability.

Nominal Output Voltage: 2.6 V

The nominal output voltage is ideal for powering many modern electronic circuits.

Number of Terminals: 5

Five terminals facilitate increased functionality and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The compact package style is perfect for space-constrained applications.

Adjustability: FIXED

A fixed output simplifies the design process by eliminating the need for external adjustments.

Terminal Pitch: 0.95 mm

A close terminal pitch allows for denser layouts, optimizing PCB real estate.

Maximum Line Regulation: 0.00754 %

High line regulation ensures stable output voltage despite changes in input voltage.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

This type of regulator is known for simplicity and reliability in power management.

Terminal Position: DUAL

Dual terminal positioning enhances ease of integration into various board designs.

Maximum Output Voltage: 2.678 V

Supports a range of output applications while ensuring consistent power delivery.

Maximum Seated Height: 1.45 mm

Low seated height allows for lower-profile designs, fitting into tight spaces.

Width: 1.625 mm

A narrow width supports space-efficient PCB designs and tighter components.

Maximum Load Regulation: 0.0311 %

Excellent load regulation maintains stable output under varying load conditions.

Minimum Input Voltage: 2.5 V

Allows operation with low input voltage, expanding its usability in battery-powered applications.

Maximum Output Current: 0.3 A

Provides sufficient current to power modern low-to-medium consumption devices effectively.

Nominal Dropout Voltage: 0.15 V

A very low nominal dropout voltage enhances efficiency in low-voltage applications.

Length: 2.9 mm

Compact length aids in minimizing the overall footprint of electronic assemblies.

Maximum Input Voltage: 6 V

Accommodates a generous input range for versatile application across various systems.

Maximum Input Voltage Absolute: 6 V

The absolute input limit ensures protection against excessive voltage conditions.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LDS3985M26R attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.25 V

Nominal Dropout Voltage-1:

.15 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Maximum Line Regulation:

.00754 %

Maximum Load Regulation:

.0311 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

2.678 V

Minimum Output Voltage-1:

2.522 V

Nominal Output Voltage-1:

2.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Qualification Status:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

1.625 mm

Trade Compliance

LDS3985M26R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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