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LD49300PT10R

STMicroelectronics

LD49300PT10R by STMicroelectronics

LD49300PT10R by STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 1V and max output current of 3A. It operates b/w -25 °C to 125°C, featuring a low dropout voltage of 0.4V. Ideal for compact electronic applications requiring stable power supply.

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6

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1k+

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Vyrian

USA . 4,699 parts In-Stock

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Digiode

USA . 3,922 parts In-Stock

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Anansix

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Semi Source

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Connector Distribution Corp

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Right Parts Inc.

USA . 8 parts In-Stock

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Microchip USA

USA . 200 parts In-Stock

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$1.212

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$1.212

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IDEA Electronic Components Group

UK . 1,811 parts In-Stock

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$2.629

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$2.366

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$2.629

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$2.366

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MKK Technologies

India . 14 parts In-Stock

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$4.944

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DigiPath Technology Company

USA . 14 parts In-Stock

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$4.944

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AZTECH Wire

Italy . 1,032 parts In-Stock

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$10.770

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Component Stockers USA

USA . 534 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 6,075 parts In-Stock

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Corphita

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Alle Elektronik GmbH

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Perfect Parts

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Vigor

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Assy Fe

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Parana Technologies

USA . 1,847 parts In-Stock

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Kepictronics

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Overview

Unlock superior performance with the LD49300PT10R from STMicroelectronics, a leader in innovative solutions. This reliable fixed LDO regulator delivers exceptional voltage stability and efficiency for a diverse range of applications, from consumer electronics to automotive systems. With its robust thermal performance and compact design, it ensures seamless integration while enhancing device longevity. Experience unparalleled quality and peace of mind knowing you’re backed by ST's expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures good protection and longevity of the regulator in various environments.

Maximum Dropout Voltage: 1.4 V

A low maximum dropout voltage enhances efficiency, allowing the regulator to perform well even in low input-output voltage differential conditions.

Surface Mount: YES

Surface mount technology enables compact designs, making it suitable for modern electronics where space-saving is crucial.

Operating Temperature (TJ-Max): 125 °C

A high maximum operating temperature allows for reliability in demanding environments, extending the range of applications.

Technology: BICMOS

The BICMOS technology combines the advantages of Bipolar and CMOS, leading to higher efficiency and better overall performance.

Package Shape: RECTANGULAR

The rectangular shape provides better PCB layout flexibility, fitting into various design constraints easily.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability during operation.

Operating Temperature (TJ-Min): -25 °C

A wide temperature range ensures reliable performance in challenging cold environments.

Packing Method: TR

The Tape and Reel (TR) packing method supports automated assembly processes, improving manufacturing efficiency.

Minimum Output Voltage: 0.99 V

The capability to output nearly 1V is beneficial for low-voltage applications where precise voltage levels are essential.

Maximum Voltage Tolerance: 3 %

A low voltage tolerance ensures that the output remains steady and reliable, making it ideal for sensitive electronic products.

Nominal Output Voltage: 1 V

Offering a nominal output voltage of 1V makes it suitable for various digital circuits and components.

No. of Terminals: 4

Having 4 terminals provides a simple design for integration into circuit boards and enhances versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient and allows for dense PCB layouts.

Adjustability: FIXED

Fixed output voltages simplify design choices and reduce the risk of malfunction due to incorrect adjustments.

Maximum Operating Temperature: 125 °C

High thermal limits contribute to reliability under high load conditions, ensuring long-term service.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch aids in compatibility with various PCB designs while allowing for efficient soldering.

Maximum Line Regulation: 0.0035 %

Exceptional line regulation indicates excellent performance even with input voltage fluctuations, ensuring a stable output.

Minimum Operating Temperature: -25 °C

Ability to function in low temperatures enhances reliability in diverse weather and industrial conditions.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Being a fixed positive output LDO makes this product ideal for powering low-voltage circuits with minimal noise.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish improves solderability and reduces oxidization, contributing to better electrical performance.

Terminal Position: SINGLE

Single terminal position optimizes space and simplifies PCB layout for designers.

Maximum Output Voltage: 1.01 V

The close maximum output voltage allows for effective voltage regulation while accommodating slight variations.

Maximum Seated Height: 2.63 mm

A low profile enhances suitability for compact designs and devices where height is a constraint.

Width: 6.1 mm

The compact width facilitates efficient space management on the PCB, allowing for denser packing of components.

Maximum Load Regulation: 0.001 %

Outstanding load regulation guarantees that the output voltage remains stable even as load conditions change.

Minimum Input Voltage: 1.4 V

A low minimum input voltage broadens compatibility with various power sources commonly used in low-power applications.

Maximum Output Current: 3 A

A maximum output current of 3 A allows this regulator to support higher load requirements, making it versatile for different applications.

Maximum Time At Peak Reflow Temperature: 30 s

The ability to withstand peak reflow temperatures ensures reliability during assembly processes.

Peak Reflow Temperature: 260 °C

High peak reflow temperature compatibility enables use in a range of soldering processes, increasing the product's adaptability.

Nominal Dropout Voltage: 1.5 V

A nominal dropout voltage ensures efficient operation, particularly in applications where input voltage is not significantly higher than output.

Length: 6.5 mm

Compact length optimizes PCB usage, making the regulator easier to fit into constrained designs.

Maximum Input Voltage: 5.5 V

Allows versatility in applications, supporting a variety of input power sources up to specified limits.

Maximum Input Voltage Absolute: 7 V

Supporting a maximum absolute input voltage of 7V ensures robustness against voltage spikes, enhancing device reliability.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LD49300PT10R attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.4 V

Nominal Dropout Voltage-1:

1.5 V

Maximum Input Voltage Absolute:

7 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Maximum Line Regulation:

.0035 %

Maximum Load Regulation:

.001 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-25 Cel

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

1.01 V

Minimum Output Voltage-1:

.99 V

Nominal Output Voltage-1:

1 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP5H,.37,50TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.63 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

6.1 mm

Trade Compliance

LD49300PT10R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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