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LD3985G33R

STMicroelectronics

LD3985G33R by STMicroelectronics

LD3985G33R from STMicroelectronics is a fixed positive LDO regulator with a nominal output of 3.3 V and a max load current of 150 mA. It features low dropout voltage (0.1 V) and operates in -40 °C to 125 °C, ideal for compact electronic applications. Its small outline package ensures efficient surface mounting.

Median Price

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Lifecycle Status

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5

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1k+

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Vyrian

USA . 5,188 parts In-Stock

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Digiode

USA . 2,453 parts In-Stock

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Bristol Electronics

USA . 1,797 parts In-Stock

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Dan-Mar Components

USA . 1,797 parts In-Stock

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Anansix

USA . 1,167 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 478 parts In-Stock

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$8.054

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478

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IDEA Electronic Components Group

UK . 113 parts In-Stock

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$8.841

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$7.957

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113

$8.841

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$7.957

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AZTECH Wire

Italy . 414 parts In-Stock

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$14.140

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414

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MKK Technologies

India . 862 parts In-Stock

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$16.625

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DigiPath Technology Company

USA . 862 parts In-Stock

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$16.625

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Component Stockers USA

USA . 761 parts In-Stock

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$99.990

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Kepictronics

USA . 21,000 parts In-Stock

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Vigor

Singapore . 6,487 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,974 parts In-Stock

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Perfect Parts

USA . 1,514 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,316 parts In-Stock

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Parana Technologies

USA . 1,224 parts In-Stock

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$10.571

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Corphita

USA . 298 parts In-Stock

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Overview

Unlock reliability and performance with the LD3985G33R from STMicroelectronics, a leader in semiconductor solutions. This fixed positive single-output LDO regulator excels in diverse applications, ensuring a stable 3.3 V output even in harsh conditions. With its robust BICMOS technology and superior line regulation, it delivers exceptional efficiency, making it ideal for powering sensitive electronics. Experience peace of mind knowing you’re backed by ST’s commitment to quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers reliable protection and durability, making this regulator suitable for a variety of applications.

Maximum Dropout Voltage: 1.1 V

A low dropout voltage ensures better efficiency and performance in low-voltage applications.

Surface Mount: YES

Surface mount technology makes the device easy to incorporate into modern PCB designs, allowing for compact layouts.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this LDO can withstand demanding environments, ensuring reliability.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, providing high performance and low power consumption.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for effective placement among other components.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and inspection, ensuring quality assembly.

Operating Temperature (TJ-Min): -40 °C

The wide operating temperature range ensures reliable operation in extreme conditions, making it versatile for various applications.

Packing Method: TR

Tape & reel packaging streamlines assembly processes in high-volume manufacturing settings.

Minimum Output Voltage: 3.201 V

The specified minimum output voltage provides stability and reliability for sensitive electronic circuits.

Maximum Voltage Tolerance: 3 %

The 3% tolerance ensures that the output voltage remains within acceptable limits, aiding in the design of precise circuits.

Nominal Output Voltage: 3.3 V

The standard 3.3 V output is widely used in digital circuits, making it a versatile choice for most modern electronic devices.

No. of Terminals: 5

The five terminal configuration provides flexibility in circuit design, accommodating various connections.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are ideal for space-constrained applications, supporting compact circuit designs.

Adjustability: FIXED

Fixed output voltage simplifies circuit design, reducing the need for additional components.

Terminal Pitch: 0.95 mm

A 0.95 mm terminal pitch is compatible with many PCB designs, facilitating easy integration.

Maximum Line Regulation: 0.00726 %

Excellent line regulation ensures consistent output voltage despite variations in input voltage, which is critical for stable circuit performance.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Being a fixed positive LDO regulator, it is ideal for providing stable voltage for low-power applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and resistance to corrosion, ensuring durability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options in circuit designs.

Maximum Output Voltage: 3.399 V

A maximum output voltage close to the nominal value ensures reliable performance under varying load conditions.

Maximum Seated Height: 1.1 mm

The low seated height contributes to a compact form factor, essential for space-constrained designs.

Width: 1.6 mm

A slim width allows for more efficient spacing on PCBs, maximizing layout options.

Maximum Load Regulation: 0.0245 %

Exceptional load regulation guarantees stable output voltage under varying load conditions, crucial for sensitive applications.

Minimum Input Voltage: 2.5 V

The ability to operate at a low input voltage makes this LDO versatile for use with a wide range of power sources.

Maximum Output Current: 0.15 A

The specified output current is sufficient for many low to moderate power applications, providing flexibility in usage.

Maximum Time At Peak Reflow Temperature: 30 s

This specification allows for proper soldering practices without damaging the component during assembly.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature ensures compatibility with modern high-temperature soldering processes.

Nominal Dropout Voltage: 0.06 V

This low nominal dropout voltage supports efficient operation in low-voltage applications, extending the usable battery life.

Length: 2.9 mm

The compact length helps save space on the PCB while still delivering robust performance.

Maximum Input Voltage: 6 V

With a maximum input voltage of 6 V, this LDO is compatible with a variety of power sources, enhancing its versatility.

Maximum Input Voltage Absolute: 6 V

Knowing the absolute maximum input voltage helps in designing circuits that prevent exceeding the limits, ensuring longevity.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LD3985G33R attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.1 V

Nominal Dropout Voltage-1:

.06 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Maximum Line Regulation:

.00726 %

Maximum Load Regulation:

.0245 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.399 V

Minimum Output Voltage-1:

3.201 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.6 mm

Trade Compliance

LD3985G33R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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