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LD39130SPU25R

STMicroelectronics

LD39130SPU25R by STMicroelectronics

LD39130SPU25R by STMicroelectronics is a fixed positive regulator with a nominal output of 2.5 V and max current of 0.3 A, ideal for compact applications. It operates b/w -40 °C to 125 °C, ensuring reliability in various environments. Its small outline design allows for efficient surface mounting in space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,804 parts In-Stock

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7,804

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Anansix

USA . 1,558 parts In-Stock

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1,558

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Digiode

USA . 384 parts In-Stock

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384

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,891 parts In-Stock

1+ parts

$3.043

100+ parts

-

1k+ parts

$2.739

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1,891

$3.043

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$2.739

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Microchip USA

USA . 5,951 parts In-Stock

1+ parts

$3.098

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5,951

$3.098

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MKK Technologies

India . 2,072 parts In-Stock

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$5.723

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2,072

$5.723

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DigiPath Technology Company

USA . 2,072 parts In-Stock

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$5.723

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2,072

$5.723

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AZTECH Wire

Italy . 907 parts In-Stock

1+ parts

$17.200

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907

$17.200

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Perfect Parts

USA . 22,400 parts In-Stock

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22,400

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Corphita

USA . 1,184 parts In-Stock

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1,184

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Parana Technologies

USA . 206 parts In-Stock

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$3.639

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$3.639

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Overview

Experience unparalleled performance and reliability with the LD39130SPU25R from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers this compact fixed regulator that excels in various applications, from portable electronics to industrial systems. Offering precise voltage regulation with minimal dropout, it ensures your devices operate efficiently and sustainably. Choose the LD39130SPU25R for enhanced stability and peace of mind in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy increases the robustness and reliability of the product.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space, enabling streamlined designs.

Operating Temperature (TJ-Max): 125 °C

High maximum operating temperature ensures reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape is ideal for automated assembly processes, thereby reducing manufacturing costs.

Terminal Form: NO LEAD

No-lead terminals simplify soldering and reduce potential failures related to lead structure.

Operating Temperature (TJ-Min): -40 °C

Wide operating temperature range makes it suitable for various applications, including harsh conditions.

Packing Method: TR

Tape and reel packing method facilitates easy handling and automated assembly.

Minimum Output Voltage-1: 2.45 V

A low minimum output voltage allows compatibility with a wider range of components and systems.

Maximum Voltage Tolerance: 2 %

Tight voltage tolerance ensures stable and reliable performance, enhancing overall circuit efficacy.

Nominal Output Voltage-1: 2.5 V

A nominal output voltage of 2.5 V makes it suitable for various low-voltage applications.

No. of Terminals: 6

Having six terminals provides flexibility for varying circuit designs and configurations.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

A very thin profile and small outline save space on PCBs, promoting miniaturization of devices.

Adjustability: FIXED

The fixed adjustability simplifies the design process, requiring no external components for voltage setting.

Terminal Pitch: 0.4 mm

A compact terminal pitch allows for high-density PCB mounting, which is beneficial for space-constrained applications.

Maximum Line Regulation: 0.03125 %

Excellent line regulation ensures consistent output voltage despite variations in input voltage.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR

This type of regulator offers reliable performance for powering essential electronic circuits.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB layout and connection options.

Maximum Output Voltage-1: 2.55 V

Generous maximum output voltage adds versatility for varying load requirements.

Maximum Seated Height: 0.4 mm

A low seated height enables integration into slim designs and compact devices.

Width: 1.2 mm

Compact width aids in designs where space is limited while maintaining functionality.

Maximum Load Regulation: 0.0375 %

Low load regulation improves output stability during varying load conditions.

Minimum Input Voltage: 3 V

Minimum input voltage of 3 V expands usability across a range of applications.

Maximum Output Current-1: 0.3 A

Capable of delivering up to 0.3 A output current, it meets the requirements of many standard applications.

Nominal Dropout Voltage-1: 0.3 V

A low dropout voltage improves efficiency, especially in battery-powered applications.

Length: 1.3 mm

Short length supports compact designs and high-density applications.

Maximum Input Voltage: 5.5 V

A maximum input voltage of 5.5 V allows for considerable flexibility in input power source selection.

Maximum Input Voltage Absolute: 7 V

The high absolute maximum input voltage ensures protection against unexpected voltage spikes.

Technical Specifications

Fixed Regulators - Positive Single Output Standard LD39130SPU25R attributes and parameters. Explore more Fixed Regulators - Positive Single Output Standard devices from STMicroelectronics

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

.3 V

Maximum Input Voltage Absolute:

7 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3 V

JESD-30 Code:

R-PDSO-N6

Length:

1.3 mm

Maximum Line Regulation:

.03125 %

Maximum Load Regulation:

.0375 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

2.55 V

Minimum Output Voltage-1:

2.45 V

Nominal Output Voltage-1:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.05,16

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.4 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

2 %

Width:

1.2 mm

Trade Compliance

LD39130SPU25R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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