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LD2982BM31R

STMicroelectronics

LD2982BM31R by STMicroelectronics

LD2982BM31R by STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 3.1 V and a max dropout voltage of just 0.225 V. It operates in temperatures from -40 °C to 125°C, making it ideal for various applications. This compact device supports surface mount technology and delivers up to 50 mA output current efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,938 parts In-Stock

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2,938

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Anansix

USA . 1,549 parts In-Stock

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1,549

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Digiode

USA . 1,005 parts In-Stock

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1,005

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,509 parts In-Stock

1+ parts

$2.357

100+ parts

-

1k+ parts

$2.121

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1,509

$2.357

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$2.121

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MKK Technologies

India . 177 parts In-Stock

1+ parts

$4.432

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177

$4.432

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DigiPath Technology Company

USA . 177 parts In-Stock

1+ parts

$4.432

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177

$4.432

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AZTECH Wire

Italy . 689 parts In-Stock

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$11.840

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689

$11.840

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QUARKTWIN TECHNOLOGY LTD

USA . 8,335 parts In-Stock

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8,335

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Microchip USA

USA . 5,424 parts In-Stock

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5,424

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Corphita

USA . 4,442 parts In-Stock

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4,442

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 683 parts In-Stock

1+ parts

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$2.818

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683

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$2.818

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Overview

Elevate your designs with the LD2982BM31R from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance LDO regulator ensures superior voltage stability and efficiency, making it perfect for compact, modern electronics. With its robust thermal range and reliable output, it meets diverse applications—from consumer gadgets to industrial controls. Choose LD2982BM31R for quality, precision, and peace of mind, ensuring your projects succeed effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight body material enhances the device's reliability and ease of integration into various applications.

Maximum Dropout Voltage: 0.225 V

A low maximum dropout voltage ensures better efficiency, providing stable output even with minimal input voltage above the output voltage.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, making it suitable for high-density circuit layouts.

Operating Temperature (TJ-Max): 125 °C

Supports a high maximum operating temperature, which is essential for use in demanding environments and ensures reliability under stress.

Technology: BIPOLAR

Bipolar technology typically offers better noise performance and precision regulation, leading to improved output stability.

Package Shape: RECTANGULAR

A rectangular package shape aids in efficient space utilization on PCBs while also allowing for better thermal management.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide excellent mechanical stability for the device when mounted on circuit boards.

Operating Temperature (TJ-Min): -40 °C

The wide operating temperature range makes this regulator suitable for both high and low-temperature environments, enhancing application versatility.

Minimum Output Voltage: 2.991 V

Allows for regulation of voltages as low as this value, making it suitable for a range of sensitive electronic components.

Maximum Voltage Tolerance: 3.5 %

A generous voltage tolerance indicates reliable performance across a variety of conditions, minimizing potential operational issues.

Nominal Output Voltage: 3.1 V

Provides a stable nominal output voltage, essential for powering consistent electronic applications.

No. of Terminals: 5

The 5-terminal design allows for multiple connections, enabling versatile configurations for various application needs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The compact and low-profile design fits well in space-constrained applications, which is critical for modern electronic devices.

Adjustability: FIXED

Fixed adjustment simplifies design and implementation, reducing the potential for errors during setup in end-use applications.

Terminal Pitch: 0.95 mm

A fine terminal pitch is well-suited for densely populated circuit boards, maximizing space efficiency.

Maximum Line Regulation: 0.0118 %

Excellent line regulation ensures consistent output despite fluctuations in input voltage, enhancing overall performance and reliability.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

This type of regulator is ideal for applications requiring a stable voltage supply without the need for adjusting components.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances reliability, oxidation resistance, and longevity of electrical connections.

Terminal Position: DUAL

Dual terminal positioning provides flexible mounting options, aiding in easier integration into PCB designs.

Maximum Output Voltage: 3.208 V

The ability to deliver this maximum output voltage makes it suitable for a wide range of electronic devices requiring stable power supply.

Maximum Seated Height: 1.45 mm

A low seated height permits integration into low-profile applications while maintaining performance standards.

Width: 1.625 mm

Compact width ensures the regulator can fit into tight spaces, ideal for modern electronic applications.

Minimum Input Voltage: 2.5 V

This low minimum input voltage expands the range of applications, allowing for efficient power regulation from various sources.

Maximum Output Current: 0.05 A

Sufficient output current capability makes it suitable for a variety of low-current applications while maintaining efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A high tolerance for peak reflow temperature ensures the regulator withstands assembly processes without compromising performance.

Peak Reflow Temperature: 260 °C

This high peak reflow temperature further contributes to compatibility with modern PCB assembly techniques.

Nominal Dropout Voltage: 0.12 V

A low nominal dropout voltage enhances the regulator's efficiency, ensuring reliable power delivery under varying load conditions.

Length: 2.9 mm

Compact length allows the device to be used in space-constrained designs, ensuring versatility in applications.

Maximum Input Voltage: 16 V

A high maximum input voltage makes the regulator suitable for a wide range of power sources, allowing for flexible designs.

Maximum Input Voltage Absolute: 16 V

Restating the maximum input voltage confirms the robustness of the device, ensuring it can handle various supply scenarios.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LD2982BM31R attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.225 V

Nominal Dropout Voltage-1:

.12 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

16 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Maximum Line Regulation:

.0118 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.05 A

Maximum Output Voltage-1:

3.208 V

Minimum Output Voltage-1:

2.991 V

Nominal Output Voltage-1:

3.1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

1.625 mm

Trade Compliance

LD2982BM31R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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