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LD29300D2M25R

STMicroelectronics

LD29300D2M25R by STMicroelectronics

LD29300D2M25R from STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 2.5 V and a max output current of 3 A. It features a low dropout voltage of 0.4 V, operates b/w -40 °C to 125 °C, and is ideal for compact electronic applications. Its surface mount design ensures efficient space utilization in various circuits.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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R&J Components

USA . 27,868 parts In-Stock

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Vyrian

USA . 3,171 parts In-Stock

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Q Components

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 1,140 parts In-Stock

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Anansix

USA . 193 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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LWI Electronics Inc

India . 13 parts In-Stock

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IDEA Electronic Components Group

UK . 1,781 parts In-Stock

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$7.911

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$7.120

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Microchip USA

USA . 424 parts In-Stock

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$8.821

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MKK Technologies

India . 1,204 parts In-Stock

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$14.876

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$14.876

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DigiPath Technology Company

USA . 1,204 parts In-Stock

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$14.876

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$14.876

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AZTECH Wire

Italy . 152 parts In-Stock

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$21.870

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Vigor

Singapore . 1,952 parts In-Stock

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Corphita

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Parana Technologies

USA . 664 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 60 parts In-Stock

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Overview

Elevate your projects with the LD29300D2M25R from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance LDO regulator ensures reliable voltage output with minimal dropout and exceptional load stability, perfect for demanding applications. Its robust design guarantees reliability in extreme temperatures, making it ideal for automotive, industrial, and consumer electronics. Empower your designs with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides adequate thermal performance for reliable operation.

Maximum Dropout Voltage: 0.7 V

This low dropout voltage ensures efficient power conversion and extended battery life in portable applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern PCB layouts.

Operating Temperature (TJ-Max): 125 °C

A high maximum operating temperature increases reliability and expands application possibilities in harsh environments.

Technology: BIPOLAR

Bipolar technology typically offers better noise performance and stability for sensitive electronic circuits.

Package Shape: RECTANGULAR

Rectangular packages are often preferred for space-efficient layouts and ease of placement on PCBs.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connection and are easy to solder in automated assembly processes.

Operating Temperature (TJ-Min): -40 °C

The ability to operate in extremely low temperatures enables use in a wide range of applications, including automotive.

Packing Method: TR

Tape and reel packaging is ideal for automated assembly, ensuring high throughput and efficient manufacturing.

Minimum Output Voltage: 2.45 V

A minimum output voltage ensures compatibility with various low-voltage applications, maximizing versatility.

Maximum Voltage Tolerance: 2 %

A low voltage tolerance indicates high precision in output voltage, which is critical for sensitive circuits.

Nominal Output Voltage: 2.5 V

This nominal output voltage is ideal for many digital components, reducing the need for additional voltage regulation.

Number of Terminals: 3

Three terminals simplify integration into circuits, making it easier to achieve the desired output parameters.

Package Style (Meter): SMALL OUTLINE

Small outline packages are well-suited for space-constrained designs, allowing for higher circuit density.

Adjustability: FIXED

Fixed voltage output simplifies design and enhances reliability by eliminating adjustable components and potential points of failure.

Terminal Pitch: 2.54 mm

A common terminal pitch facilitates compatibility with multiple socket and PCB designs, enhancing flexibility.

Maximum Line Regulation: 0.0125 %

Excellent line regulation ensures minimal variation in output voltage regardless of input voltage changes, crucial for sensitive loads.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

This type of regulator provides stable and reliable output voltage, crucial for powering integrated circuits.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and prevents oxidation, ensuring reliable electrical connections.

Terminal Position: SINGLE

Single terminal position allows for straightforward connection in designs with limited space or in specific layout requirements.

Maximum Output Voltage: 2.55 V

This slightly higher maximum output voltage expands the range of applications suitable for this regulator.

Maximum Seated Height: 4.83 mm

A low seated height is advantageous in compact designs where vertical space is limited.

Width: 9.15 mm

Reasonable width facilitates easy placement on PCBs while maintaining a compact overall footprint.

Maximum Load Regulation: 0.025 %

Tight load regulation ensures consistent voltage output even when the load varies, essential for stable performance.

Minimum Input Voltage: 3.5 V

Requires a relatively low minimum input voltage, allowing for flexibility in design with varying supply voltages.

Maximum Output Current: 3 A

A high output current capability supports demanding applications, making it suitable for powering devices with high current needs.

Maximum Time At Peak Reflow Temperature: 30 s

Long exposure time at peak temperatures during assembly ensures good solder joint quality without damaging the component.

Peak Reflow Temperature: 245 °C

This peak temperature rating indicates compatibility with most surface-mount assembly processes, including lead-free solder.

Nominal Dropout Voltage: 0.4 V

This lower nominal dropout voltage enhances efficiency, ensuring less wasted power and minimizing heat generation.

Length: 10.2 mm

A compact length aids in fitting within small footprint designs while maintaining necessary electrical functionality.

Maximum Input Voltage: 13 V

A safe maximum input voltage provides ample room for a variety of power supply applications, ensuring operational flexibility.

Maximum Input Voltage Absolute: 30 V

This absolute maximum input voltage expands the range of compatible power sources, enhancing design versatility.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LD29300D2M25R attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.7 V

Nominal Dropout Voltage-1:

.4 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

13 V

Minimum Input Voltage:

3.5 V

JESD-30 Code:

R-PSSO-G3

JESD-609 Code:

e3

Length:

10.2 mm

Maximum Line Regulation:

.0125 %

Maximum Load Regulation:

.025 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

2.55 V

Minimum Output Voltage-1:

2.45 V

Nominal Output Voltage-1:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.55TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

245

Qualification Status:

Not Qualified

Maximum Seated Height:

4.83 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

9.15 mm

Trade Compliance

LD29300D2M25R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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