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LD29150DT25

STMicroelectronics

LD29150DT25 by STMicroelectronics

LD29150DT25 from STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 2.5 V and max output current of 1.5 A. It operates in -40 °C to 125 °C, featuring a low dropout voltage of 0.4 V. Ideal for compact applications requiring stable power supply.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,625 parts In-Stock

1+ parts

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6,625

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Digiode

USA . 4,116 parts In-Stock

1+ parts

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4,116

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Anansix

USA . 2,229 parts In-Stock

1+ parts

-

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2,229

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Prism Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,874 parts In-Stock

1+ parts

$3.641

100+ parts

-

1k+ parts

$3.277

10k+ parts

-

1,874

$3.641

-

$3.277

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MKK Technologies

India . 2,079 parts In-Stock

1+ parts

$6.847

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2,079

$6.847

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DigiPath Technology Company

USA . 2,079 parts In-Stock

1+ parts

$6.847

100+ parts

-

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2,079

$6.847

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AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$21.660

100+ parts

-

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570

$21.660

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QUARKTWIN TECHNOLOGY LTD

USA . 27,932 parts In-Stock

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27,932

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Microchip USA

USA . 6,062 parts In-Stock

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6,062

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Corphita

USA . 4,038 parts In-Stock

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4,038

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Parana Technologies

USA . 2,247 parts In-Stock

1+ parts

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$4.354

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2,247

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$4.354

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Vigor

Singapore . 2,072 parts In-Stock

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2,072

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Perfect Parts

USA . 4 parts In-Stock

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4

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Overview

Elevate your designs with the LD29150DT25 from STMicroelectronics, a leader in innovative semiconductor solutions. This compact LDO regulator guarantees reliable performance across diverse applications, from consumer electronics to industrial systems. With its robust temperature range and minimal voltage drop, it ensures stable operation under demanding conditions. Trust in ST's commitment to quality and efficiency—unlock exceptional value and reliability for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and protects the internal components from environmental challenges.

Maximum Dropout Voltage: 0.7 V

This low dropout voltage allows for efficient regulation, ensuring that the output voltage remains stable even when the input voltage is close to the output voltage.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuit designs, optimizing space and reducing assembly costs.

Operating Temperature (TJ-Max): 125 °C

With a maximum operating temperature of 125 °C, this regulator is suitable for high-temperature applications, ensuring reliability in demanding environments.

Technology: BIPOLAR

Bipolar technology offers better performance in terms of noise, stability, and thermal characteristics, making it an ideal choice for a variety of applications.

Package Shape: RECTANGULAR

The rectangular shape enables efficient layout in printed circuit boards (PCBs), providing better packing density.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and improve solder joint reliability, enhancing overall device performance.

Operating Temperature (TJ-Min): -40 °C

This wide temperature range makes the product suitable for both consumer and industrial applications, providing excellent performance in extreme conditions.

Minimum Output Voltage: 2.45 V

With a low minimum output voltage, this LDO can power sensitive electronics that require specific and low voltage levels.

Maximum Voltage Tolerance: 2 %

A high voltage tolerance ensures that the output remains stable and within acceptable limits, improving reliability across various loads.

Nominal Output Voltage: 2.5 V

The set nominal output voltage makes it suitable for a wide range of low voltage digital and analog applications.

No. of Terminals: 2

Having only two terminals simplifies the design and reduces parasitic resistance, helping maintain voltage integrity.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for high-density routing on PCBs, maximizing space efficiency and reducing overall product size.

Adjustability: FIXED

Fixed output provides ease of design and eliminates the complexity of adjusting voltage outputs, making it user-friendly.

Terminal Pitch: 2.28 mm

The 2.28 mm terminal pitch aligns well with most PCB designs, facilitating compatibility and ease of assembly.

Maximum Line Regulation: 0.0125 %

High line regulation ensures consistent output voltage regardless of input voltage fluctuations, enhancing performance.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

This designation indicates a reliable solution for applications requiring a stable, fixed voltage output with low dropout.

Terminal Finish: MATTE TIN

Matte tin coating offers excellent solderability and corrosion resistance, increasing long-term reliability.

Terminal Position: SINGLE

A single terminal position minimizes space requirement on printed circuit boards, allowing for a more compact design.

Maximum Output Voltage: 2.55 V

A slight variation in the maximum output voltage supports different applications while remaining within necessary operational parameters.

Maximum Seated Height: 2.63 mm

This low profile option is ideal for applications where space is at a premium, facilitating slimmer device designs.

Width: 6.1 mm

The compact width enables efficient board layout and design optimization in applications with limited space.

Maximum Load Regulation: 0.025 %

Low load regulation indicates that the output voltage remains stable regardless of the load current, ensuring reliable operation under varying loads.

Minimum Input Voltage: 3.5 V

The minimum input voltage allows for compatibility with a wide range of upstream power sources, increasing versatility.

Maximum Output Current: 1.5 A

This product can support a significant output current, making it suitable for high-demand applications.

Maximum Time At Peak Reflow Temperature: 30 s

Extended time at peak temperature ensures that solder joints are robust and reliable during assembly processes.

Peak Reflow Temperature: 260 °C

This high temperature tolerance during reflow allows for compatibility with various soldering techniques, enhancing manufacturing flexibility.

Nominal Dropout Voltage: 0.4 V

A nominal dropout voltage of 0.4 V allows for lower input voltages while still maintaining the desired output, maximizing efficiency.

Length: 6.5 mm

The compact length ensures flexibility in PCB design, accommodating a variety of layouts and component placements.

Maximum Input Voltage: 13 V

This wide input voltage range allows the LDO to function effectively in demanding power supply environments.

Maximum Input Voltage Absolute: 30 V

A maximum absolute input voltage of 30 V provides excellent safety margins for input supply variations, enhancing the robustness of the design.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LD29150DT25 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.7 V

Nominal Dropout Voltage-1:

.4 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

13 V

Minimum Input Voltage:

3.5 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.5 mm

Maximum Line Regulation:

.0125 %

Maximum Load Regulation:

.025 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1.5 A

Maximum Output Voltage-1:

2.55 V

Minimum Output Voltage-1:

2.45 V

Nominal Output Voltage-1:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.63 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.28 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

6.1 mm

Trade Compliance

LD29150DT25 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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