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LD1117DC-R

STMicroelectronics

LD1117DC-R by STMicroelectronics

LD1117DC-R by STMicroelectronics is an adjustable positive LDO regulator with a max output current of 0.8 A and a dropout voltage of 1.2 V. It operates b/w 0 °C to 125 °C, making it ideal for various electronic applications. Its compact design features an 8-terminal gull-wing package for easy surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,448 parts In-Stock

1+ parts

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2,448

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Digiode

USA . 1,577 parts In-Stock

1+ parts

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1,577

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Anansix

USA . 144 parts In-Stock

1+ parts

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144

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 347 parts In-Stock

1+ parts

$8.990

100+ parts

-

1k+ parts

$8.091

10k+ parts

-

347

$8.990

-

$8.091

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MKK Technologies

India . 831 parts In-Stock

1+ parts

$16.906

100+ parts

-

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831

$16.906

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DigiPath Technology Company

USA . 831 parts In-Stock

1+ parts

$16.906

100+ parts

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831

$16.906

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Corphita

USA . 4,403 parts In-Stock

1+ parts

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4,403

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Parana Technologies

USA . 1,741 parts In-Stock

1+ parts

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100+ parts

$10.749

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1,741

-

$10.749

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Overview

Elevate your projects with the LD1117DC-R from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This adjustable LDO regulator ensures stable power delivery, even in demanding environments, maximizing efficiency for applications ranging from consumer electronics to industrial systems. With top-notch reliability and performance, this product is designed to enhance your designs, providing you with the peace of mind that comes from using industry-leading technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures a lightweight and durable design, making it suitable for a variety of applications.

Maximum Dropout Voltage: 1.2 V

A low maximum dropout voltage allows for efficient performance and minimal power loss, making it ideal for battery-operated devices.

Surface Mount: YES

The surface mount design facilitates easy integration into modern compact circuit boards, enhancing manufacturing efficiency.

Operating Temperature (TJ-Max): 125 °C

With a maximum operating temperature of 125 °C, this regulator is suitable for high-temperature environments, ensuring reliability in demanding applications.

Maximum Input-Output Voltage Differential: 13.75 V

A high voltage differential capability allows for greater versatility in application designs, accommodating a range of input voltages.

Technology: BIPOLAR

The bipolar technology used in this regulator contributes to stable performance and lower noise levels, enhancing the overall output quality.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space on the PCB while providing reliable performance, making it suitable for various layout designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure a solid connection during installation, reducing the risk of failure.

Operating Temperature (TJ-Min): 0 °C

A minimum operating temperature of 0 °C expands usability to standard temperature environments, making it more adaptable in different applications.

Packing Method: TR

Tape and reel packaging simplifies handling and automates assembly processes, boosting manufacturing efficiency.

Minimum Output Voltage: 1.25 V

The capability to deliver output as low as 1.25 V is crucial for powering low-voltage devices while maintaining efficiency.

No. of Terminals: 8

Eight terminals provide essential connection options, enhancing compatibility with various circuit configurations.

Maximum Line Regulation (%/V): 0.08

Low line regulation indicates excellent performance in maintaining stable output voltage despite input fluctuations.

Package Style (Meter): SMALL OUTLINE

A small outline package style allows for compact designs, making it ideal for space-constrained applications.

Adjustability: ADJUSTABLE

Adjustable output voltage provides flexibility for different application needs, making the product versatile and user-friendly.

Maximum Load Regulation (%): 1 %

Excellent load regulation ensures output voltage stability under varying load conditions, enhancing performance reliability.

Terminal Pitch: 1.27 mm

The standard terminal pitch makes it compatible with a wide range of PCB designs, ensuring ease of integration into existing systems.

Minimum Input-Output Voltage Differential: 1.5 V

A minimum differential provides the necessary voltage headroom for the regulator to operate effectively in various applications.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

As a single output LDO regulator, it is designed to deliver a consistent and stable voltage, crucial for powering sensitive electronic components.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

A high-quality terminal finish enhances corrosion resistance and ensures reliable electrical connections, contributing to product longevity.

Terminal Position: DUAL

Dual terminal positioning provides increased routing flexibility on the PCB, allowing engineers to design more complex circuits.

Maximum Output Voltage: 15 V

A high maximum output voltage expands its ability to supply power to various devices, from microcontrollers to more complex circuits.

Maximum Output Current: 0.8 A

Capable of supplying up to 0.8 A of output current, it is suitable for powering a variety of load applications efficiently.

Maximum Time At Peak Reflow Temperature (s): 40

With a peak reflow soldering time of 40 seconds, this regulator can withstand assembly processes without affecting its performance.

Peak Reflow Temperature: 260 °C

Able to endure high reflow temperatures, this regulator is robust enough for modern PCB assembly processes.

Nominal Dropout Voltage: 1.1 V

A nominal dropout voltage of 1.1 V indicates efficient operation, allowing for better performance in low-voltage applications.

Width: 3.9 mm

Compact width makes it suitable for space-constrained designs while still providing robust electrical performance.

Length: 4.9 mm

Short length enhances layout flexibility, allowing designers to optimize PCB space without sacrificing functionality.

Maximum Seated Height: 1.75 mm

Low profile seated height is advantageous in applications where height restrictions are critical.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO LD1117DC-R attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

1.2 V

Nominal Dropout Voltage-1:

1.1 V

Maximum Input-Output Voltage Differential:

13.75 V

Minimum Input-Output Voltage Differential:

1.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Maximum Line Regulation (%/V):

.08

Maximum Load Regulation (%):

1 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

0 Cel

Maximum Output Current-1:

.8 A

Maximum Output Voltage-1:

15 V

Minimum Output Voltage-1:

1.25 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

LD1117DC-R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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